Patents by Inventor Yuichi Osada

Yuichi Osada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4614782
    Abstract: A heat resistant resin composition comprising (A) a polyamideimide resin soluble in a cresol type solvent obtained by using a lactam as a reactant, and (B) at least one member selected from the group consisting of a polyester resin, a polyesteramide resin, a polyesterimide resin and a polyesteramideimide resin, preferably heated for conducting a reaction, gives coatings excellent in heat resistance, thermal shock resistance, wear resistance, resistance to hydrolysis, crazing resistance, etc., suitable for enamelled wire.
    Type: Grant
    Filed: November 23, 1984
    Date of Patent: September 30, 1986
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hiroshi Nishizawa, Shozo Kasai, Yasunori Okada, Yuichi Osada, Yoshiyuki Mukoyama
  • Patent number: 4530975
    Abstract: A polyamide-imide resin composition comprising (A) a polyamide-imide resin modified with a polyisocyanate containing one or more isocyanurate rings and a lactam and (B) at least one member selected from the group consisting of (i) an alkoxy modified amino resin, (ii) a polyisocyanate containing one or more isocyanurate rings, (iii) a phenol-formaldehyde resin, (iv) an epoxy resin, (v) a polyester resin having one or more hydroxyl groups obtained by using terephthalic acid and/or isophthalic acid as an acid component, and (vi) a metal salt of Sn, Mn, Co or Zn, can give fast curing properties to the resin composition without lowering heat resistance, flexibility, abrasion resistance and also giving good surface appearance to the coating.
    Type: Grant
    Filed: September 30, 1982
    Date of Patent: July 23, 1985
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yoshiyuki Mukoyama, Touichi Sakata, Yuichi Osada
  • Patent number: 4448844
    Abstract: A heat resistant resin produced by reacting (A) a polyamideimide resin with (B) an alcohol component and (C) an acid component with heating is soluble in a cresol type solvent and gives coatings excellent in heat resistance, thermal shock resistance, wear resistance, resistance to hydrolysis, etc., suitable for enamelled wire.
    Type: Grant
    Filed: July 28, 1983
    Date of Patent: May 15, 1984
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Yuichi Osada, Shozo Kasai, Yasunori Okada, Isao Uchigasaki, Toyoji Oshima, Yoshiyuki Mukoyama, Hiroshi Nishizawa
  • Patent number: 4431758
    Abstract: A heat resistant resin produced by reacting (A) a polyamideimide resin with (B) an alcohol component and (C) an acid component with heating is soluble in a cresol type solvent and gives coatings excellent in heat resistance, thermal shock resistance, wear resistance, resistance to hydrolysis, etc., suitable for enamelled wire.
    Type: Grant
    Filed: March 31, 1982
    Date of Patent: February 14, 1984
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yuichi Osada, Shozo Kasai, Yasunori Okada, Isao Uchigasaki, Toyoji Oshima, Yoshiyuki Mukoyama, Hiroshi Nishizawa
  • Patent number: 4237251
    Abstract: Polyesteramides produced by reacting in the first step an aromatic monoalkyl dicarboxylate with an aromatic diisocyanate in the presence or absence of one or more monoalkyl dicarboxylates and/or diisocyanates to produce an aromatic dialkyl diamidedicarboxylate of the formula: ##STR1## wherein R.sub.1 is alkyl; and R.sub.2 is a divalent aromatic residue, or a mixture of dialkyl diamidedicarboxylates containing the compound of the formula (II), and reacting in the second step the compound of the formula (II) or the mixture containing the compound of the formula (II) with one member selected from the group consisting of(a) one or more polyhydric alcohols,(b) one or more polyhydric alcohols and polyvalent carboxylic acids, and(c) one or more polyhydric alcohols and a linear polyester have improved heat resistance as well as excellent mechanical properties and can be used, e.g., for enamelled wire.
    Type: Grant
    Filed: January 11, 1979
    Date of Patent: December 2, 1980
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Toshiaki Ishimaru, Hiroshi Nishizawa, Yuichi Osada
  • Patent number: 4186122
    Abstract: A polyester resin, polyester-imide resin or polyester-amide-imide resin dissolved in a solvent containing 60% by weight or more of at least one polyhydric alcohol derivative selected from the group consisting of R.sub.1 COO(CHR.sub.2 CH.sub.2 O).sub.n H, R.sub.1 COO(CHR.sub.2 CH.sub.2 O).sub.n COR.sub.3, R.sub.1 O(CHR.sub.2 CH.sub.2 O).sub.n COR.sub.3 and R.sub.1 O(CHR.sub.2 CH.sub.2 O).sub.n R.sub.4, wherein R.sub.1, R.sub.3 and R.sub.4 are independently lower alkyl, aryl or aralkyl; R.sub.2 is hydrogen or methyl; and n is an integer of 1 to 3, gives an electrical insulating coating having excellent storage stability and high resin concentration without causing defects of phenols when used as a solvent.
    Type: Grant
    Filed: August 29, 1977
    Date of Patent: January 29, 1980
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yasunori Okada, Yuichi Osada, Mineo Nakano, Shozo Kasai, Shigeo Tachiki, Nobuyuki Hayashi, Masahiro Abo
  • Patent number: 4127553
    Abstract: An electrical insulating resin composition comprising a resin obtained by reacting (a) one or more tri- or higher polyhydric alcohols and/or tri- or higher polybasic acids, (b) one or more dihydric alcohols, (c) one or more dibasic acids, (d) one or more monobasic acids containing one or more aromatic rings in the molecule, and/or (e) one or more monohydric alcohols containing one or more aromatic rings in the molecule, and if desired (f) one or more compounds containing or being able to form one or more 5-membered imide rings, can give high solids varnishes without lowering the molecular weight of the resin produced. Said varnishes can give coating films excellent in heat resistance, flexibility and mechanical strengths.
    Type: Grant
    Filed: April 19, 1977
    Date of Patent: November 28, 1978
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yuichi Osada, Yasunori Okada, Shozo Kasai, Mineo Nakano, Shigeo Tachiki, Nobuyuki Hayashi, Masahiro Abo