Patents by Inventor Yuichi Otani
Yuichi Otani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240172396Abstract: A cooling system of the present disclosure includes: a coolant tank storing a coolant removing heat from a heating element in a closed space as an inner space; a plurality of heat pipes that are arranged to extend from the coolant tank toward the outside of the coolant tank and respectively having passages allowing the coolant as a working fluid to be movable therethrough; and a blower fan blowing air to the plurality of heat pipes from the outside of the coolant tank in a direction in which the heat pipes are arranged, wherein a cross-sectional shape orthogonal to the extension direction of each heat pipe is a flat plate shape having a leading edge on an upstream side of a blowing direction of the blower fan and a trailing edge on a downstream side thereof with the blowing direction as a longitudinal direction.Type: ApplicationFiled: February 14, 2022Publication date: May 23, 2024Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Nobuhide Hara, Yuichi Otani, Sumiu Uchida, Tadahiko Suzuta, Hiroko Kitamoto, Kentaro Hayashi, Atsushi Imai
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Patent number: 11834968Abstract: A steam generation apparatus includes: a heat medium flow passage through which a heat medium flows; a primary economizer disposed in the heat medium flow passage; a secondary economizer disposed in the heat medium flow passage at an upstream side of the primary economizer with respect to a flow direction of the heat medium; a primary evaporator disposed in the heat medium flow passage at an upstream side of the secondary economizer with respect to the flow direction of the heat medium; a first flash tank for generating flash steam; a first feed water line configured to supply water heated by the primary economizer to the secondary economizer; and a second feed water line disposed so as to branch from the first feed water line and configured to supply the water heated by the primary economizer to the first flash tank.Type: GrantFiled: November 26, 2020Date of Patent: December 5, 2023Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Hideyuki Uechi, Yuichi Otani, Fumito Kajitani, Taichi Yoshii, Norito Katsuki, Kanako Nagayama, Takahiro Hidaka
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Publication number: 20230022466Abstract: A steam generation apparatus includes: a heat medium flow passage through which a heat medium flows; a primary economizer disposed in the heat medium flow passage; a secondary economizer disposed in the heat medium flow passage at an upstream side of the primary economizer with respect to a flow direction of the heat medium; a primary evaporator disposed in the heat medium flow passage at an upstream side of the secondary economizer with respect to the flow direction of the heat medium; a first flash tank for generating flash steam; a first feed water line configured to supply water heated by the primary economizer to the secondary economizer; and a second feed water line disposed so as to branch from the first feed water line and configured to supply the water heated by the primary economizer to the first flash tank.Type: ApplicationFiled: November 26, 2020Publication date: January 26, 2023Inventors: Hideyuki UECHI, Yuichi OTANI, Fumito KAJITANI, Taichi YOSHII, Norito KATSUKI, Kanako NAGAYAMA, Takahiro HIDAKA
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Publication number: 20220319724Abstract: Ensuring a high output temperature while preventing leakage of radioactive substances, etc. A nuclear reactor includes a fuel unit; a shield unit that covers a circumference of the fuel unit for shielding from radioactive rays; and a heat conductive portion that penetrates the shield unit, is arranged such that the heat conductive portion extends to inside of the fuel unit and outside of the shield unit, and transfers heat of the fuel unit to the outside of the shield unit by solid heat conduction.Type: ApplicationFiled: November 6, 2020Publication date: October 6, 2022Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Hideyuki Kudo, Hironori Noguchi, Koichi Tanimoto, Yuichi Otani, Yutaka Tanaka, Takafumi Noda, Kazuhiro Yoshida, Hideyuki Sakata, Tatsuo Ishiguro, Hideaki Ikeda, Satoru Kamohara, Shohei Otsuki, Nozomu Murakami, Wataru Nakazato, Takashi Hasegawa, Tadakatsu Yodo, Yasutaka Harai, Shota Kobayashi
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Publication number: 20220282934Abstract: A heat pipe includes an external cylinder extending in an axial direction, an internal cylinder provided inside the external cylinder so as to extend in the axial direction, and a wick provided between and integrally with the external cylinder and the internal cylinder. The wick includes a plurality of micro through portions extending linearly in the axial direction. According to this configuration, a working fluid moves smoothly in the axial direction without being blocked, and thus it is possible to provide a heat pipe having a further improved heat exchange performance.Type: ApplicationFiled: January 25, 2022Publication date: September 8, 2022Inventors: Nobuhide HARA, Masafumi KATTA, Koichi TANIMOTO, Yuichi OTANI
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Publication number: 20210159393Abstract: In a non-limiting embodiment, a semiconductor device may include a magnetic tunnel junction (MTJ) stack. The MTJ stack may include a reference layer comprising a magnetic layer, a first tunneling barrier layer arranged over the reference layer, a free layer comprising a magnetic layer arranged over the first tunneling barrier layer, and a capping layer arranged over the reference layer, the first tunneling barrier layer and the free layer. The capping layer may be a non-magnetic layer. According to various non-limiting embodiments, the capping layer may include a rare earth element. According to various non-limiting embodiments, the MTJ stack may further include a second tunneling barrier layer arranged between the free layer and the capping layer. The capping layer may contact the second tunneling barrier layer.Type: ApplicationFiled: November 26, 2019Publication date: May 27, 2021Inventors: Wai Cheung LAW, Ganesh KOLLIYIL RAJAN, Yuichi OTANI, Kazutaka YAMANE, Chim Seng SEET, Grayson Dao Hwee WONG
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Patent number: 10914382Abstract: A shaft sealing structure for a rotation shaft, includes a sealing ring having ends formed by removal of its part. The ends abutting each other are continuous in the circumferential direction when the sealing ring is reduced in diameter to a radially inner side. The sealing ring is provided along the circumferential direction of the rotation shaft so as to be contactable with an outer peripheral surface of the rotation shaft. The structure also includes a pressing member configured to be movable between a pressing position and a retracted position; an elastic member configured to bias the pressing member toward the pressing position by elastic force; and a support member configured to support the pressing member at the retracted position against the elastic force, and to allow the pressing member to move to the pressing position at a predetermined temperature.Type: GrantFiled: August 23, 2018Date of Patent: February 9, 2021Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Naotaka Komatsu, Takumi Hori, Yuichi Otani, Hidetaka Kafuku, Hiromu Okamoto, Shunsuke Tanaka, Yasushi Takayama, Tomoki Hanada
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Publication number: 20200357984Abstract: Structures for a non-volatile memory element and methods of fabricating a structure for a non-volatile memory element. The structure includes a bottom electrode, a seed layer on the bottom electrode, and a magnetic-tunneling-junction layer stack on the seed layer. The seed layer is composed of a nickel-chromium-ruthenium alloy including ruthenium in an amount ranging from seven atomic percent by weight to eighty-four atomic percent by weight.Type: ApplicationFiled: May 9, 2019Publication date: November 12, 2020Inventors: Yuichi Otani, Kazutaka Yamane, Ganesh Kolliyil Rajan
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Patent number: 10818837Abstract: Structures for a non-volatile memory element and methods of fabricating a structure for a non-volatile memory element. The structure includes a bottom electrode, a seed layer on the bottom electrode, and a magnetic-tunneling-junction layer stack on the seed layer. The seed layer is composed of a nickel-chromium-ruthenium alloy including ruthenium in an amount ranging from seven atomic percent by weight to eighty-four atomic percent by weight.Type: GrantFiled: May 9, 2019Date of Patent: October 27, 2020Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.Inventors: Yuichi Otani, Kazutaka Yamane, Ganesh Kolliyil Rajan
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Publication number: 20200096043Abstract: A rotary machine of the present invention is provided with: a bearing including an inner ring secured to an outer peripheral surface of a rotating element, an outer ring disposed outside the inner ring, and a plurality of rolling elements interposed between the inner ring and the outer ring; a bearing housing disposed outside the bearing and to which the outer ring is secured; a casing disposed outside the bearing housing and to which the bearing housing is secured; and a temperature difference reducer to reduce a difference between a temperatures of the outer and inner rings.Type: ApplicationFiled: November 29, 2017Publication date: March 26, 2020Applicant: MITSUBISHI HEAVY INDUSTRIES THERMAL SYSTEMS, LTD.Inventors: Takeshi KANEKO, Yuichi OTANI, Jun MIYAMOTO, Yasushi HASEGAWA
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Patent number: 10361363Abstract: A method includes: a first film formation process forming a film by sputtering a first insulator target when a projection plane of the first insulator target on a plane including a front face of a substrate is in a first state; and a second film formation process forming a film by sputtering a second insulator target when a projection plane of the second insulator target formed on the plane including the front face of the substrate is in a second state different from the first state. The second film formation process provides the insulating film having a second characteristic variation having opposite tendency to a first characteristic variation in the film provided by the first film formation process, the first characteristic variation occurring from a center portion to a peripheral portion of the substrate, the second characteristic variation occurring at least partly from the center portion to the peripheral portion.Type: GrantFiled: May 31, 2016Date of Patent: July 23, 2019Assignee: CANON ANELVA CORPORATIONInventors: Yuichi Otani, Takuya Seino
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Patent number: 10290991Abstract: This solid laser amplification device has: a laser medium part that has a solid medium, into which a laser light enters from an entrance part and from which the laser light (L) is emitted to the outside from an exit part, and an amplification layer, which is provided on the surface of the medium, receives the laser light in the medium, and amplifies and reflects said light toward the exit part; a microchannel cooling part that cools the amplification layer; and a thermally conductive part that is provided so as to make contact between the amplification layer and the cooling part and transfers the heat of the amplification layer to the cooling part.Type: GrantFiled: June 8, 2016Date of Patent: May 14, 2019Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Yoshiyuki Kondo, Yuichi Otani, Yoshiteru Komuro, Atsushi Kodama, Koichi Hamamoto, Hiroyuki Daigo, Naoki Inoue, Tomoya Morioka, Masahiro Kato, Shingo Nishikata
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Patent number: 10236655Abstract: A solid laser amplification device having a laser medium that has a solid medium, into which a laser light enters and from which the laser light is emitted, and an amplification layer, provided on the surface of the medium, receives the laser light in the medium, and amplifies and reflects the light toward the exit; and a microchannel cooling part that has a plurality of cooling pipelines, into which a cooling solvent is conducted and which are arranged parallel to the surface of the amplification layer, and a cooling surface, at the outer periphery of the cooling pipelines and attached on the surface of the amplification layer, the microchannel cooling part cooling the amplification layer. The closer the position of the cooling pipeline to a position facing a section of the amplification layer that receives the laser light, the greater the cooling force exhibited by the cooling part.Type: GrantFiled: June 8, 2016Date of Patent: March 19, 2019Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Yoshiyuki Kondo, Yuichi Otani, Yoshiteru Komuro, Atsushi Kodama, Koichi Hamamoto, Hiroyuki Daigo, Naoki Inoue, Tomoya Morioka, Masahiro Kato, Shingo Nishikata
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Publication number: 20190063801Abstract: The present invention maintains a compact evaporator size in a centrifugal chiller utilizing a low pressure refrigerant used at a maximum pressure of less than 0.2 MPaG while avoiding efficiency losses and equipment damage that result from carryover of liquid state refrigerant to the turbo compressor side.Type: ApplicationFiled: April 12, 2017Publication date: February 28, 2019Applicant: MITSUBISHI HEAVY INDUSTRIES THERMAL SYSTEMS, LTD.Inventors: Naoya MIYOSHI, Kazuki WAJIMA, Taichi YOSHII, Yuichi OTANI
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Publication number: 20190063610Abstract: A shaft sealing structure for a rotation shaft, includes a sealing ring having ends formed by removal of its part. The ends abutting each other are continuous in the circumferential direction when the sealing ring is reduced in diameter to a radially inner side. The sealing ring is provided along the circumferential direction of the rotation shaft so as to be contactable with an outer peripheral surface of the rotation shaft. The structure also includes a pressing member configured to be movable between a pressing position and a retracted position; an elastic member configured to bias the pressing member toward the pressing position by elastic force; and a support member configured to support the pressing member at the retracted position against the elastic force, and to allow the pressing member to move to the pressing position at a predetermined temperature.Type: ApplicationFiled: August 23, 2018Publication date: February 28, 2019Inventors: Naotaka KOMATSU, Takumi HORI, Yuichi OTANI, Hidetaka KAFUKU, Hiromu OKAMOTO, Shunsuke TANAKA, Yasushi TAKAYAMA, Tomoki HANADA
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Patent number: 10153426Abstract: This invention provides a manufacturing method of a magnetoresistive effect element having a higher MR ratio than a conventional element. A manufacturing method of a magnetoresistive effect element of an embodiment of the invention includes: a step of forming a tunnel barrier layer on a substrate, on a surface of which one of a magnetization free layer and a magnetization fixed layer is formed; a step of cooling the substrate after the step of forming a tunnel barrier layer; a step of forming an other one of the magnetization free layer and the magnetization fixed layer on the tunnel barrier layer after the step of cooling; and a step of raising a temperature of the substrate after the step of forming the other one of the magnetization free layer and the magnetization fixed layer.Type: GrantFiled: April 21, 2016Date of Patent: December 11, 2018Assignee: CANON ANELVA CORPORATIONInventors: Takuya Seino, Yuichi Otani, Kazumasa Nishimura
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Patent number: 10014646Abstract: A laser oscillation cooling device (100) includes a light emitting section (1) that emits laser excitation light (Z1), a laser excitation section (2) that excites the laser excitation light (Z1) to emit laser light (Z2) and has a heat generating region (S) where heat is locally generated, a storage tank (3) capable of storing an extremely low temperature liquid (L), a pressurizing section (31) that brings the extremely low temperature liquid (L) into a sub-cool state by pressurizing the inside of the storage tank (3), and a jetting supply section (4) that removes heat from the laser excitation section (2) by jetting the extremely low temperature liquid (L) in the sub-cool state from a plurality of jet ports arrayed in a two-dimensional manner to the laser excitation section (2).Type: GrantFiled: November 20, 2015Date of Patent: July 3, 2018Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Jiro Kasahara, Junnosuke Nakatani, Yuichi Otani, Naoki Inoue, Koichi Hamamoto, Shingo Nishikata
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Publication number: 20180145473Abstract: This solid laser amplification device has: a laser medium part that has a solid medium, into which a laser light enters from an entrance part and from which the laser light (L) is emitted to the outside from an exit part, and an amplification layer, which is provided on the surface of the medium, receives the laser light in the medium, and amplifies and reflects said light toward the exit part; a microchannel cooling part that cools the amplification layer; and a thermally conductive part that is provided so as to make contact between the amplification layer and the cooling part and transfers the heat of the amplification layer to the cooling part.Type: ApplicationFiled: June 8, 2016Publication date: May 24, 2018Inventors: Yoshiyuki KONDO, Yuichi OTANI, Yoshiteru KOMURO, Atsushi KODAMA, Koichi HAMAMOTO, Hiroyuki DAIGO, Naoki INOUE, Tomoya MORIOKA, Masahiro KATO, Shingo NISHIKATA
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Publication number: 20180145474Abstract: A solid laser amplification device having a laser medium that has a solid medium, into which a laser light enters and from which the laser light is emitted, and an amplification layer, provided on the surface of the medium, receives the laser light in the medium, and amplifies and reflects the light toward the exit; and a microchannel cooling part that has a plurality of cooling pipelines, into which a cooling solvent is conducted and which are arranged parallel to the surface of the amplification layer, and a cooling surface, at the outer periphery of the cooling pipelines and attached on the surface of the amplification layer, the microchannel cooling part cooling the amplification layer. The closer the position of the cooling pipeline to a position facing a section of the amplification layer that receives the laser light, the greater the cooling force exhibited by the cooling part.Type: ApplicationFiled: June 8, 2016Publication date: May 24, 2018Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Yoshiyuki KONDO, Yuichi OTANI, Yoshiteru KOMURO, Atsushi KODAMA, Koichi HAMAMOTO, Hiroyuki DAIGO, Naoki INOUE, Tomoya MORIOKA, Masahiro KATO, Shingo NISHIKATA
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Publication number: 20180026416Abstract: A laser oscillation cooling device (100) includes a light emitting section (1) that emits laser excitation light (Z1), a laser excitation section (2) that excites the laser excitation light (Z1) to emit laser light (Z2) and has a heat generating region (S) where heat is locally generated, a storage tank (3) capable of storing an extremely low temperature liquid (L), a pressurizing section (31) that brings the extremely low temperature liquid (L) into a sub-cool state by pressurizing the inside of the storage tank (3), and a jetting supply section (4) that removes heat from the laser excitation section (2) by jetting the extremely low temperature liquid (L) in the sub-cool state from a plurality of jet ports arrayed in a two-dimensional manner to the laser excitation section (2).Type: ApplicationFiled: November 20, 2015Publication date: January 25, 2018Inventors: Jiro KASAHARA, Junnosuke NAKATANI, Yuichi OTANI, Naoki INOUE, Koichi HAMAMOTO, Shingo NISHIKATA