Patents by Inventor Yuichi Saitou

Yuichi Saitou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11662140
    Abstract: A raw material gas liquefying device includes a feed line; a refrigerant circulation line; and a controller. In a refrigerant liquefaction route, a refrigerant flows through a compressor, a heat exchanger, a circulation system JT valve, a liquefied refrigerant storage tank, and the heat exchanger, and returns to the compressor. In a cryogenic energy generation route, the refrigerant flows through the compressor, the heat exchanger, an expansion unit, and the heat exchanger, and returns to the compressor. The controller determines if a refrigerant storage tank liquid level is within an allowable range, manipulates a feed system JT valve opening rate to control refrigerant temperature at the high-temperature-side refrigerant flow path exit side of the heat exchanger, and manipulates the opening rate of the feed system JT valve to control the refrigerant storage tank liquid level so that the refrigerant storage tank liquid level falls into the predetermined allowable range.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: May 30, 2023
    Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Tomohiro Sakamoto, Hidetaka Miyazaki, Naotaka Yamazoe, Daisuke Kariya, Yasuo Miwa, Yuichi Saitou, Yosuke Kimura, Toshihiro Komiya, Yoshihiro Matsuda, Keisuke Nakagawa
  • Publication number: 20190285339
    Abstract: A raw material gas liquefying device includes a feed line; a refrigerant circulation line; and a controller. In a refrigerant liquefaction route, a refrigerant flows through a compressor, a heat exchanger, a circulation system JT valve, a liquefied refrigerant storage tank, and the heat exchanger, and returns to the compressor. In a cryogenic energy generation route, the refrigerant flows through the compressor, the heat exchanger, an expansion unit, and the heat exchanger, and returns to the compressor. The controller determines if a refrigerant storage tank liquid level is within an allowable range, manipulates a feed system JT valve opening rate to control refrigerant temperature at the high-temperature-side refrigerant flow path exit side of the heat exchanger, and manipulates the opening rate of the feed system JT valve to control the refrigerant storage tank liquid level so that the refrigerant storage tank liquid level falls into the predetermined allowable range.
    Type: Application
    Filed: December 4, 2017
    Publication date: September 19, 2019
    Applicant: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Tomohiro SAKAMOTO, Hidetaka MIYAZAKI, Naotaka YAMAZOE, Daisuke KARIYA, Yasuo MIWA, Yuichi SAITOU, Yosuke KIMURA, Toshihiro KOMIYA, Yoshihiro MATSUDA, Keisuke NAKAGAWA
  • Patent number: 5239633
    Abstract: A data processor which comprises a pipeline processing mechanism for executing memory indirect addressing and register indirect addressing in an address calculation stage, checks whether or not an instruction writes an operand to a memory or register, makes each stage of the pipeline mechanism hold reservation information thereof in sequence, thereby reduces the frequency of stops of pipeline processing caused by processing of operand address calculation of the following instruction attending on a writing of the operand of the preceding instruction to a memory or register, so that data processing can be execute at a higher efficiency.
    Type: Grant
    Filed: May 4, 1990
    Date of Patent: August 24, 1993
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Fumihiko Terayama, Yuichi Saitou, Toyohiko Yoshida
  • Patent number: 4756796
    Abstract: There is disclosed a method of providing an elongated stock; producing a wafer comprising the steps of processing one end face of an elongated stock to form a first flat surface; cutting through one end portion of the stock transversely by a cutter to provide a slice of a predetermined thickness having opposite side faces defined respectively by the first flat surface and a cut surface subjected to the cutting; and processing the cut surface of the slice to form a second flat surface, using the first flat surface as a reference surface, thereby providing the wafer.
    Type: Grant
    Filed: October 10, 1986
    Date of Patent: July 12, 1988
    Assignees: Misubishi Kinzoku Kabushiki Kaisha, Japan Silicon Co., Ltd.
    Inventor: Yuichi Saitou