Patents by Inventor Yuichi Sakon

Yuichi Sakon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210252207
    Abstract: Provided is a molded filter used for a flexible disposable bag which is produced so as to be capable of sucking and storing, for example, bodily secretions of a patient and being disposed when a fixed storage amount is reached, wherein a laminate of at least two elements of a powdered hydrophilic swelling agent and a charged nonwoven fabric, and more preferably, a laminate of three elements with a hydrophobic porous film added thereto, is used as a filter base material and the charged nonwoven fabric is arranged downstream of the powdered hydrophilic swelling agent in a direction of flow of expiratory air inside the body. Thus, the molded filter has functions of air permeability that is equal to or higher than a PE sintered body CMC filter, short term and long term waterproof properties, and a better microbial barrier property.
    Type: Application
    Filed: December 19, 2018
    Publication date: August 19, 2021
    Applicant: Greenpla Co., Ltd.
    Inventors: Yuichi SAKON, Yoshiharu YABUKI, Satoru KURAMOTO, Masakazu MASUDA
  • Patent number: 4826726
    Abstract: A heat-resistnat wire is disclosed which comprises a line of copper or aluminum coated with a shielding material obtained by heating a mixture of: (A) an ethylenic copolymer comprised of ethylene and 0.1 to 20.0 mol % of a monomer of at most 30 carbon atoms having an oxirane group or a hydroxyl group and having at least one double bond; and (B) an ethylenic copolymer comprised of ethylene and 0.1 to 20.0 mol % of a monomer possessing a functional group capable of reacting with oxirane group or hydroxy group in the ethylenic copolymer (A). The wire is excellent not only in heat resistance but also in insulating ability and flexibility.
    Type: Grant
    Filed: June 24, 1986
    Date of Patent: May 2, 1989
    Assignee: Showa Denko Kabushiki Kaisha
    Inventors: Masahiko Maeda, Ryutaro Fujihira, Yoshihiro Moteki, Naotoshi Watanabe, Yuichi Sakon
  • Patent number: 4751146
    Abstract: A heat resistant printed circuit board is disclosed which comprises a laminate of:(A) a thin-walled body having a thickness of from 0.2 .mu.m to less than 5 mm and containing a cross-linked product of a mixture of (a) 1 to 99 wt. % of an ethylenic copolymer (A) comprised of 30 to 99.5 wt. % of ethylene, and an oxirane ring-containing compound having at least one double bond and having 6 to 30 carbon atoms, and (b) 99 to 1 wt. % of an ethylenic copolymer (B) comprised of 30 to 99.5 wt. % of ethylene, and a comonomer selected from the group consisting of unsaturated monocarboxylic acids, unsaturated dicarboxylic acids, unsaturated dicarboxylic acid anhydrides, and half esters of unsaturated dicarboxylic acids; and(B) an electrically conductive metal layer having a thickness of from 100 .ANG. to 400 .mu.m.The boards have excellent heat resistance, electrical insulating properties, flexibility, chemical resistance, dimensional stability, etc.
    Type: Grant
    Filed: July 9, 1986
    Date of Patent: June 14, 1988
    Assignee: Showa Denko Kabushiki Kaisha
    Inventors: Masahiko Maeda, Kazuya Nagata, Yasutoki Saitou, Taketsugu Ootani, Yuichi Sakon