Patents by Inventor Yuichi Sumii

Yuichi Sumii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRESSURE-SENSITIVE ADHESIVE COMPOUND, PRESSURE-SENSITIVE ADHESIVE TAPE, AND WAFER TREATMENT METHOD
    Publication number: 20130220533
    Abstract: The present invention aims to provide an adhesive composition which has high initial adhesion and can strongly fix an adherend, while can be peeled off easily by light irradiation even after undergoing a high-temperature process at 200° C. or higher. The present invention also aims to provide an adhesive tape produced from the adhesive composition, and wafer treatment method using the adhesive composition. The present invention provides an adhesive composition including an adhesive component, a photoinitiator, and a silicone compound containing a functional group that is crosslinkable with the adhesive component.
    Type: Application
    Filed: September 14, 2011
    Publication date: August 29, 2013
    Inventors: Toru Tonegawa, Takahiro Asao, Yuichi Sumii, Shigeru Nomura, Masateru Fukuoka, Daihei Sugita