Patents by Inventor Yuichi Suyama

Yuichi Suyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 5760464
    Abstract: A semiconductor device has a semiconductor chip with a plurality of pads, an inner lead which is connected to a plurality of pads by a plurality of bonding wires and which has a broken part portion, and a bonding wire which electrically connects broken ends of the broken portion of the inner lead and which has a fusing current smaller than that of the inner lead.
    Type: Grant
    Filed: August 21, 1995
    Date of Patent: June 2, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yuichi Suyama, Yuzo Fukuzaki