Patents by Inventor Yuichi Takayoshi
Yuichi Takayoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7971353Abstract: A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.Type: GrantFiled: February 7, 2008Date of Patent: July 5, 2011Assignee: Nitto Denko CorporationInventors: Yuichi Takayoshi, Kazushi Ichikawa, Toshiki Naito
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Patent number: 7629540Abstract: A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.Type: GrantFiled: February 7, 2008Date of Patent: December 8, 2009Assignee: Nitto Denko CorporationInventors: Yuichi Takayoshi, Kazushi Ichikawa, Toshiki Naito
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Publication number: 20090025963Abstract: A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.Type: ApplicationFiled: February 7, 2008Publication date: January 29, 2009Applicant: Nitto Denko CorporationInventors: Yuichi Takayoshi, Kazushi Ichikawa, Toshiki Naito
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Publication number: 20090025212Abstract: A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.Type: ApplicationFiled: February 7, 2008Publication date: January 29, 2009Applicant: Nitto Denko CorporationInventors: Yuichi Takayoshi, Kazushi Ichikawa, Toshiki Naito
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Patent number: 7407386Abstract: A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer, and an insulating cover layer formed on the insulating base layer for covering the conductive pattern. The conductive pattern includes terminal portions for connecting with external terminals. The insulating cover layer has an opening formed correspondingly for the respective terminal portions. A position determining zone for determining whether or not a margin of the insulating cover layer facing the opening is located in a proper position is provided in proximity of the terminal portions.Type: GrantFiled: February 13, 2007Date of Patent: August 5, 2008Assignee: Nitto Denko CorporationInventors: Kazushi Ichikawa, Yuichi Takayoshi
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Patent number: 7371971Abstract: A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.Type: GrantFiled: February 8, 2006Date of Patent: May 13, 2008Assignee: Nitto Denko CorporationInventors: Yuichi Takayoshi, Kazushi Ichikawa, Toshiki Naito
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Patent number: 7281327Abstract: An insulating substrate with metal foils on both sides thereof is prepared, and a through hole that passes through the metal foils and insulating substrate is formed. An electroless copper plating layer is formed on an inner surface of the through hole and a surface of each of the metal foils, followed by the formation of an electrolytic copper plating layer on the overall surface of the electroless copper plating layer. After removing the electrolytic copper plating layer except the portions on the inner surface and a peripheral region of the through hole, the metal foils are processed to form conductor patterns.Type: GrantFiled: May 5, 2005Date of Patent: October 16, 2007Assignee: Nitto Denko CorporationInventors: Yuichi Takayoshi, Mineyoshi Hasegawa, Yasushi Tsuda, Akinori Itokawa
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Publication number: 20070190852Abstract: A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer, and an insulating cover layer formed on the insulating base layer for covering the conductive pattern. The conductive pattern includes terminal portions for connecting with external terminals. The insulating cover layer has an opening formed correspondingly for the respective terminal portions. A position determining zone for determining whether or not a margin of the insulating cover layer facing the opening is located in a proper position is provided in proximity of the terminal portions.Type: ApplicationFiled: February 13, 2007Publication date: August 16, 2007Applicant: Nitto Denko CorporationInventors: Kazushi Ichikawa, Yuichi Takayoshi
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Publication number: 20060176069Abstract: A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.Type: ApplicationFiled: February 8, 2006Publication date: August 10, 2006Applicant: Nitto Denko CorporationInventors: Yuichi Takayoshi, Kazushi Ichikawa, Toshiki Naito
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Patent number: 7067912Abstract: A wired circuit board can control characteristic impedance at connection points between wires of a suspension board with circuit and terminal portions of the wired circuit board connected thereto with a simple structure, to improve signal transmission efficiency even for fine pitch wiring or for high frequency signals. The wired circuit board includes a relay flexible wiring circuit board formed by a first wired circuit board including a first metal substrate, a first insulating base layer, a first conductor layer and a first insulating cover layer which is substantially identical in layer structure with the suspension board with circuit and a second wired circuit board connected with the first wired circuit board for connecting with a control circuit board. Since the suspension board with circuit and the first wired circuit board are rendered substantially identical in layer structure, both characteristic impedances at these connection points can be matched.Type: GrantFiled: June 4, 2004Date of Patent: June 27, 2006Assignee: Nitto Denko CorporationInventors: Yoshihiko Takeuchi, Yasuhito Ohwaki, Yuichi Takayoshi
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Publication number: 20060016072Abstract: An insulating substrate with metal foils on both sides thereof is prepared, and a through hole that passes through the metal foils and insulating substrate is formed. An electroless copper plating layer is formed on an inner surface of the through hole and a surface of each of the metal foils, followed by the formation of an electrolytic copper plating layer on the overall surface of the electroless copper plating layer. After removing the electrolytic copper plating layer except the portions on the inner surface and a peripheral region of the through hole, the metal foils are processed to form conductor patterns.Type: ApplicationFiled: May 5, 2005Publication date: January 26, 2006Inventors: Yuichi Takayoshi, Mineyoshi Hasegawa, Yasushi Tsuda, Akinori Itokawa
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Publication number: 20040245619Abstract: A wired circuit board that can control characteristic impedance at connection points between wires of a suspension board with circuit and terminal portions of the wired circuit board connected thereto with a simple structure, to improve signal transmission efficiency even for fine pitch wiring or for high frequency signal. To provide this wired circuit board, a relay flexible wiring circuit board 1 is formed by a first wired circuit board 14 comprising a first metal substrate 16, a first insulating base layer 17, a first conductor layer 18 and a first insulating cover layer 19 which is substantially identical in layer structure with the suspension board with circuit 3 and a second wired circuit board 15 connected with the first wired circuit board 14 for connecting with a control circuit board 4.Type: ApplicationFiled: June 4, 2004Publication date: December 9, 2004Inventors: Yoshihiko Takeuchi, Yasuhito Ohwaki, Yuichi Takayoshi
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Patent number: 6280828Abstract: A flexible wiring board including a gold pad having dynamic Vickers hardness of not less than 50 or having a ratio of amount of nickel in a surface of the gold pad (atomic weight %) to thickness of gold (&mgr;m) of not more than 5 or having both the dynamic Vickers hardness of not less than 50 and the ratio of amount of nickel in the surface of the gold pad (atomic weight %) to thickness of gold (&mgr;m) of not more than 5, to provide a flexible wiring board that can substantially ensure the connection reliability when the board is connected with a semiconductor device by wiring bonding.Type: GrantFiled: March 15, 2000Date of Patent: August 28, 2001Assignee: Nitto Denko CorporationInventors: Yasuo Nakatsuka, Yuichi Takayoshi, Chiharu Miyaake, Toshihiko Sugimoto