Patents by Inventor Yuichi Terashita
Yuichi Terashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11342198Abstract: Disclosed is a processing liquid supplying apparatus. The apparatus includes: a processing liquid supply source configured to supply a processing liquid for processing a substrate to be processed; an ejection unit configured to eject the processing liquid to the substrate to be processed; a filter device configured to remove foreign matters in the processing liquid; a supply pump and an ejection pump which are provided in the supply path at a primary side and a secondary side of the filter device, respectively; and a control unit configured to output a control signal to decompress and degas the processing liquid supplied from the processing liquid supply source by using one of the supply pump and the ejection pump, and subsequently, pass the degassed processing liquid through the filter device beginning from the primary side to the secondary side of the filter device by using the supply pump and the ejection pump.Type: GrantFiled: August 2, 2018Date of Patent: May 24, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Yuichi Terashita, Kousuke Yoshihara, Koji Takayanagi, Toshinobu Furusho, Takashi Sasa
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Patent number: 10901320Abstract: There is provided a method of developing an exposed resist film formed on a surface of a substrate to form a resist pattern, which includes: rotating the substrate about a rotation axis that extends in a direction perpendicular to the surface of the substrate that is horizontally supported; supplying a developing solution through a discharge hole positioned above the substrate onto the resist film such that the developing solution is widely spread on a surface of the resist film; and positioning a wetted part having a surface that faces the surface of the substrate, above a preceding region in the surface of the substrate, the preceding region being a region to which the developing solution is preferentially supplied through the discharge hole.Type: GrantFiled: September 7, 2018Date of Patent: January 26, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Tomohiro Iseki, Hirofumi Takeguchi, Yuichi Terashita
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Patent number: 10734251Abstract: A filtration efficiency, which is similar to the filtration efficiency obtained when a plurality of filters are provided, can be obtained by one filter, and decrease in throughput can be prevented. Based on a control signal from a control unit 101, a resist liquid L is sucked into a pump 70 through a filter. A part of the resist liquid sucked in the pump is discharged from a discharge nozzle 7. The remaining resist liquid is returned to a supply conduit 51b on a primary side of the filter. A process is synthesized by adding a replenishment amount equal to the discharge amount to the return amount. The discharge of the synthesized process liquid and the filtration thereof by the filter are performed the number of times corresponding to a rate between the discharge amount and the return amount.Type: GrantFiled: December 10, 2013Date of Patent: August 4, 2020Assignee: Tokyo Electron LimitedInventors: Koji Takayanagi, Yukie Minekawa, Yuichi Yoshida, Kousuke Yoshihara, Yuichi Terashita, Toshinobu Furusho, Takashi Sasa
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Publication number: 20200227286Abstract: Disclosed is a processing liquid supplying apparatus. The apparatus includes: a processing liquid supply source configured to supply a processing liquid for processing a substrate to be processed; an ejection unit configured to eject the processing liquid to the substrate to be processed; a filter device configured to remove foreign matters in the processing liquid; a supply pump and an ejection pump which are provided in the supply path at a primary side and a secondary side of the filter device, respectively; and a control unit configured to output a control signal to decompress and degas the processing liquid supplied from the processing liquid supply source by using one of the supply pump and the ejection pump, and subsequently, pass the degassed processing liquid through the filter device beginning from the primary side to the secondary side of the filter device by using the supply pump and the ejection pump.Type: ApplicationFiled: August 2, 2018Publication date: July 16, 2020Inventors: Yuichi Terashita, Kousuke Yoshihara, Koji Takayanagi, Toshinobu Furusho, Takashi Sasa
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Patent number: 10262880Abstract: Techniques disclosed herein provide an apparatus and method of spin coating that inhibits the formation of wind marks and other defects from turbulent fluid-flow, thereby enabling higher rotational velocities and decreased drying times, while maintaining film uniformity. Techniques disclosed herein include a fluid-flow member, such as a ring or cover, positioned or suspended above the surface of a wafer or other substrate. The fluid-flow member has a radial curvature that prevents wind marks during rotation of a wafer during a coating and spin drying process.Type: GrantFiled: February 19, 2013Date of Patent: April 16, 2019Assignee: Tokyo Electron LimitedInventors: Derek W. Bassett, Wallace P. Printz, Joshua S. Hooge, Katsunori Ichino, Yuichi Terashita, Kousuke Yoshihara
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Publication number: 20190056666Abstract: There is provided a method of developing an exposed resist film formed on a surface of a substrate to form a resist pattern, which includes: rotating the substrate about a rotation axis that extends in a direction perpendicular to the surface of the substrate that is horizontally supported; supplying a developing solution through a discharge hole positioned above the substrate onto the resist film such that the developing solution is widely spread on a surface of the resist film; and positioning a wetted part having a surface that faces the surface of the substrate, above a preceding region in the surface of the substrate, the preceding region being a region to which the developing solution is preferentially supplied through the discharge hole.Type: ApplicationFiled: September 7, 2018Publication date: February 21, 2019Inventors: Tomohiro ISEKI, Hirofumi TAKEGUCHI, Yuichi TERASHITA
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Patent number: 10120286Abstract: There is provided a method of developing an exposed resist film formed on a surface of a substrate to form a resist pattern, which includes: rotating the substrate about a rotation axis that extends in a direction perpendicular to the surface of the substrate that is horizontally supported; supplying a developing solution through a discharge hole positioned above the substrate onto the resist film such that the developing solution is widely spread on a surface of the resist film; and positioning a wetted part having a surface that faces the surface of the substrate, above a preceding region in the surface of the substrate, the preceding region being a region to which the developing solution is preferentially supplied through the discharge hole.Type: GrantFiled: July 17, 2015Date of Patent: November 6, 2018Assignee: Tokyo Electron LimitedInventors: Tomohiro Iseki, Hirofumi Takeguchi, Yuichi Terashita
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Patent number: 10101669Abstract: A technique which, in forming a resist pattern on a wafer, can achieve high resolution and high in-plane uniformity of pattern line width. After forming a resist film on a wafer W and subsequently performing pattern exposure by means of a pattern exposure apparatus, the entire pattern exposure area is exposed by using a flood exposure apparatus. During the flood exposure, the exposure amount is adjusted depending on the exposure position on the wafer based on information on the in-plane distribution of the line width of a resist pattern, previously obtained from an inspection apparatus. Methods for adjusting the exposure amount include a method which adjusts the exposure amount while moving a strip-shaped irradiation area corresponding to the diameter of the wafer, a method which involves intermittently moving an irradiation area, corresponding to a shot area in the preceding pattern exposure, to adjust the exposure amount for each chip.Type: GrantFiled: January 13, 2015Date of Patent: October 16, 2018Assignee: Tokyo Electron LimitedInventors: Seiji Nagahara, Gousuke Shiraishi, Satoru Shimura, Kousuke Yoshihara, Shinichiro Kawakami, Masaru Tomono, Yuichi Terashita, Hironori Mizoguchi
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Patent number: 10074546Abstract: Disclosed is a processing liquid supplying apparatus. The apparatus includes: a processing liquid supply source configured to supply a processing liquid for processing a substrate to be processed; an ejection unit configured to eject the processing liquid to the substrate to be processed; a filter device configured to remove foreign matters in the processing liquid; a supply pump and an ejection pump which are provided in the supply path at a primary side and a secondary side of the filter device, respectively; and a control unit configured to output a control signal to decompress and degas the processing liquid supplied from the processing liquid supply source by using one of the supply pump and the ejection pump, and subsequently, pass the degassed processing liquid through the filter device beginning from the primary side to the secondary side of the filter device by using the supply pump and the ejection pump.Type: GrantFiled: September 15, 2014Date of Patent: September 11, 2018Assignee: Tokyo Electron LimitedInventors: Yuichi Terashita, Kousuke Yoshihara, Koji Takayanagi, Toshinobu Furusho, Takashi Sasa
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Patent number: 10022652Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.Type: GrantFiled: November 21, 2017Date of Patent: July 17, 2018Assignee: Tokyo Electron LimitedInventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi
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Patent number: 9972512Abstract: A liquid processing apparatus for liquid-processing a substrate includes a substrate holding device that rotates a substrate in horizontal position, a nozzle holding device holding processing liquid and gas nozzles, the liquid nozzle discharging processing liquid from a discharge port such that the liquid is discharged obliquely to surface of the substrate, the gas nozzle discharging gas perpendicularly to the surface of the substrate, a moving device that moves the nozzle device with respect to the surface of the substrate, and a control device including circuitry that controls the nozzle, substrate and moving devices such that while the substrate is rotated, the liquid is discharged to peripheral portion toward downstream side in rotation direction and along tangential direction of the substrate and gas is discharged from the gas nozzle toward position adjacent to liquid landing position of the liquid on the surface and is on center side of the substrate.Type: GrantFiled: September 27, 2017Date of Patent: May 15, 2018Assignee: TOKYO ELECTRON LIMITEDInventors: Akiko Kai, Takafumi Niwa, Shogo Takahashi, Hiroshi Nishihata, Yuichi Terashita, Teruhiko Kodama
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Patent number: 9952512Abstract: A developing method for forming a resist film having a high uniformity of CD distribution. After exposure of a resist film on a substrate surface to form a resist pattern, the method includes sequential steps of: (A) supplying a developer to the rotating substrate; (B) reacting the resist film with the developer; and (C) removing the developer from the surface of the resist film to terminate the reaction of the resist film with the developer. In step (A), a liquid-contact nozzle, having an ejection orifice for the developer and a lower surface extending laterally from the ejection orifice and disposed opposite the resist film, is used. In step (C), the boundary between a reaction-terminated area of the surface of the resist film, and an in-progress reaction area of the surface of the resist film, is moved from the center toward the periphery of the resist film.Type: GrantFiled: May 5, 2015Date of Patent: April 24, 2018Assignee: Tokyo Electron LimitedInventors: Hirofumi Takeguchi, Tomohiro Iseki, Yuichi Terashita
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Publication number: 20180093205Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.Type: ApplicationFiled: November 21, 2017Publication date: April 5, 2018Inventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi
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Patent number: 9899243Abstract: A light irradiation apparatus includes: a rotary holding unit that rotates a substrate around a rotary axis while holding the substrate; a lighting unit positioned to face the rotary holding unit; a light shielding mask positioned between the rotary holding unit and the lighting unit, and widened along a direction orthogonal to the rotary axis; and a driving unit that linearly moves the lighting unit along the direction orthogonal to the rotary axis. The light shielding mask overlaps with the substrate when viewed in the direction of the rotary axis. The light shielding mask has an opening portion. An opening width of the opening portion at a side away from the rotary axis is larger than the opening with near the rotary axis. The lighting unit irradiates light through the opening portion toward the surface of the substrate while being moved above the opening portion by the driving unit.Type: GrantFiled: December 8, 2015Date of Patent: February 20, 2018Assignee: Tokyo Electron LimitedInventors: Masahide Tadokoro, Yuichi Terashita, Gousuke Shiraishi, Tomohiro Iseki, Masaru Tomono, Hironori Mizoguchi
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Patent number: 9878267Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.Type: GrantFiled: June 30, 2017Date of Patent: January 30, 2018Assignee: Tokyo Electron LimitedInventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi
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Publication number: 20180019112Abstract: A liquid processing apparatus for liquid-processing a substrate includes a substrate holding device that rotates a substrate in horizontal position, a nozzle holding device holding processing liquid and gas nozzles, the liquid nozzle discharging processing liquid from a discharge port such that the liquid is discharged obliquely to surface of the substrate, the gas nozzle discharging gas perpendicularly to the surface of the substrate, a moving device that moves the nozzle device with respect to the surface of the substrate, and a control device including circuitry that controls the nozzle, substrate and moving devices such that while the substrate is rotated, the liquid is discharged to peripheral portion toward downstream side in rotation direction and along tangential direction of the substrate and gas is discharged from the gas nozzle toward position adjacent to liquid landing position of the liquid on the surface and is on center side of the substrate.Type: ApplicationFiled: September 27, 2017Publication date: January 18, 2018Applicant: TOKYO ELECTRON LIMITEDInventors: Akiko KAI, Takafumi NIWA, Shogo TAKAHASHI, Hiroshi NISHIHATA, Yuichi TERASHITA, Teruhiko KODAMA
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Publication number: 20170296944Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.Type: ApplicationFiled: June 30, 2017Publication date: October 19, 2017Inventors: Kousuke YOSHIHARA, Katsunori ICHINO, Toshinobu FURUSHO, Takashi SASA, Katsuhiro TSUCHIYA, Yuichi TERASHITA, Hirofumi TAKEGUCHI
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Patent number: 9786488Abstract: A liquid processing method for liquid-processing a substrate includes setting a substrate on a substrate holding device which rotates the substrate such that the substrate is held in horizontal position, supplying processing liquid to center portion of the substrate such that the center portion positioned center side with respect to peripheral portion of the substrate is liquid-processed, positioning a discharge port of a processing liquid nozzle toward downstream side in rotation direction such that the liquid is discharged to the peripheral portion obliquely to surface of the substrate and along tangential direction of the substrate while the substrate is rotated, and discharging gas from a gas nozzle perpendicularly to the surface of the substrate toward position that is adjacent to liquid landing position of the liquid on the surface of the substrate and is on the center side of the substrate, while the liquid is discharged to the peripheral portion.Type: GrantFiled: September 30, 2015Date of Patent: October 10, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Akiko Kai, Takafumi Niwa, Shogo Takahashi, Hiroshi Nishihata, Yuichi Terashita, Teruhiko Kodama
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Patent number: 9732910Abstract: A processing-liquid supply apparatus includes a source, a discharge device, a supply channel connecting the source and discharge device, a filter device positioned in the channel to form first side having the source and second side having the discharge device, a pump device positioned in the channel, and a control device which controls suction and discharge by the pump device. The control device controls the pump device such that the liquid is discharged from the discharge device, that remaining of the liquid on the second side is suctioned to be returned to the first side and that the remaining of the liquid returned to the first side flows from the first toward second side together with refill of the liquid from the source, and the control device is set such that return amount of the liquid to the filter device is equal to or greater than amount of the discharge.Type: GrantFiled: September 26, 2014Date of Patent: August 15, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Koji Takayanagi, Kousuke Yoshihara, Yuichi Terashita, Toshinobu Furusho, Takashi Sasa
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Patent number: 9731226Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.Type: GrantFiled: February 22, 2013Date of Patent: August 15, 2017Assignee: Tokyo Electron LimitedInventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi