Patents by Inventor Yuichi Tokita

Yuichi Tokita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220367573
    Abstract: An image pickup element is constituted by laminating at least a first electrode, an organic photoelectric conversion layer, and a second electrode in order, and the organic photoelectric conversion layer includes a first organic semiconductor material having the following structural formula (1).
    Type: Application
    Filed: June 16, 2022
    Publication date: November 17, 2022
    Applicant: SONY GROUP CORPORATION
    Inventors: Masaki MURATA, Hideaki MOGI, Shintarou HIRATA, Iwao YAGI, Yasuharu UJIIE, Masashi BANDO, Raku SHIRASAWA, Hajime KOBAYASHI, Mitsunori NAKAMOTO, Yuichi TOKITA
  • Patent number: 11411051
    Abstract: An image pickup element is constituted by laminating at least a first electrode, an organic photoelectric conversion layer, and a second electrode in order, and the organic photoelectric conversion layer includes a first organic semiconductor material having the following structural formula (1).
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: August 9, 2022
    Assignee: SONY CORPORATION
    Inventors: Masaki Murata, Hideaki Mogi, Shintarou Hirata, Iwao Yagi, Yasuharu Ujiie, Masashi Bando, Raku Shirasawa, Hajime Kobayashi, Mitsunori Nakamoto, Yuichi Tokita
  • Publication number: 20220037409
    Abstract: An imaging element according to an embodiment of the present disclosure includes: a first electrode and a second electrode facing each other; and a photoelectric conversion layer including a p-type semiconductor and an n-type semiconductor, and provided between the first electrode and the second electrode, in which the photoelectric conversion layer has an exciton charge separation rate of 1×1010 s?1 to 1×1016 s?1 both inclusive in a p-n junction surface formed by the p-type semiconductor and the n-type semiconductors.
    Type: Application
    Filed: October 21, 2021
    Publication date: February 3, 2022
    Inventors: HAJIME KOBAYASHI, YUICHI TOKITA
  • Patent number: 11183540
    Abstract: An imaging element according to an embodiment of the present disclosure includes: a first electrode and a second electrode facing each other; and a photoelectric conversion layer including a p-type semiconductor and an n-type semiconductor, and provided between the first electrode and the second electrode, in which the photoelectric conversion layer has an exciton charge separation rate of 1×1010 s?1 to 1×1016 s?1 both inclusive in a p-n junction surface formed by the p-type semiconductor and the n-type semiconductor.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: November 23, 2021
    Assignee: SONY CORPORATION
    Inventors: Hajime Kobayashi, Yuichi Tokita
  • Patent number: 10933494
    Abstract: A lap-fillet arc welding joint includes a weld bead, the weld bead being formed on an end portion of one sheet of overlapped two sheets and a surface of other sheet along the end portion. The other sheet includes a projecting portion projecting from the surface at a side of a weld toe of at least one of a start portion and a termination portion of the weld bead. The weld toe is located on a slope surface portion of the projecting portion at a side of the end portion of the one sheet.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: March 2, 2021
    Assignee: JFE Steel Corporation
    Inventors: Tsuyoshi Shiozaki, Yuichi Tokita, Yoshikiyo Tamai
  • Publication number: 20200266241
    Abstract: An imaging element according to an embodiment of the present disclosure includes: a first electrode and a second electrode facing each other; and a photoelectric conversion layer including a p-type semiconductor and an n-type semiconductor, and provided between the first electrode and the second electrode, in which the photoelectric conversion layer has an exciton charge separation rate of 1×101° s?1 to 1×1016 s?1 both inclusive in a p-n junction surface formed by the p-type semiconductor and the n-type semiconductor.
    Type: Application
    Filed: May 5, 2020
    Publication date: August 20, 2020
    Inventors: HAJIME KOBAYASHI, YUICHI TOKITA
  • Patent number: 10672837
    Abstract: An imaging element according to an embodiment of the present disclosure includes: a first electrode and a second electrode facing each other; and a photoelectric conversion layer including a p-type semiconductor and an n-type semiconductor, and provided between the first electrode and the second electrode, in which the photoelectric conversion layer has an exciton charge separation rate of 1×1010 s?1 to 1×1016 s?1 both inclusive in a p-n junction surface formed by the p-type semiconductor and the n-type semiconductor.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: June 2, 2020
    Assignee: SONY CORPORATION
    Inventors: Hajime Kobayashi, Yuichi Tokita
  • Patent number: 10626477
    Abstract: A method for manufacturing a hot press formed part, includes: preparing a hot press forming object comprising a single-ply portion and a two-ply portion; heating the hot press forming object to a temperature range from an Ac3 transformation temperature of a base steel sheet of the first coated steel sheet to 1000° C.; press forming the hot press forming object to obtain a formed body, the press forming being started upon temperatures of the single-ply portion and of the two-ply portion being no higher than solidification points of Zn—Ni coating layers of the first and second coated steel sheets and no lower than an Ar3 transformation temperature of the base steel sheet of the first coated steel sheet; and quenching the formed body to thereby obtain a hot press formed part, in which the hot press forming object has a thickness ratio from 1.4 to 5.0.
    Type: Grant
    Filed: September 8, 2015
    Date of Patent: April 21, 2020
    Assignees: JFE STEEL CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Masaki Morino, Hideaki Kobiki, Tatsuya Nakagaito, Yuichi Tokita, Toru Minote, Yoshikiyo Tamai
  • Publication number: 20200119100
    Abstract: An image pickup element is constituted by laminating at least a first electrode, an organic photoelectric conversion layer, and a second electrode in order, and the organic photoelectric conversion layer includes a first organic semiconductor material having the following structural formula (1).
    Type: Application
    Filed: December 12, 2019
    Publication date: April 16, 2020
    Applicant: SONY CORPORATION
    Inventors: Masaki MURATA, Hideaki MOGI, Shintarou HIRATA, Iwao YAGI, Yasuharu UJIIE, Masashi BANDO, Raku SHIRASAWA, Hajime KOBAYASHI, Mitsunori NAKAMOTO, Yuichi TOKITA
  • Patent number: 10608049
    Abstract: An image pickup element is constituted by laminating at least a first electrode, an organic photoelectric conversion layer, and a second electrode in order, and the organic photoelectric conversion layer includes a first organic semiconductor material having the following structural formula (1).
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: March 31, 2020
    Assignee: Sony Corporation
    Inventors: Masaki Murata, Hideaki Mogi, Shintarou Hirata, Iwao Yagi, Yasuharu Ujiie, Masashi Bando, Raku Shirasawa, Hajime Kobayashi, Mitsunori Nakamoto, Yuichi Tokita
  • Patent number: 10590974
    Abstract: A lap fillet arc-welded joint produced by overlapping two metal sheets and welding an end portion of one sheet of the two metal sheets to a surface of the other sheet along the end portion of the one sheet includes a protruding curved potion being bead-shaped and protruding from the surface of the other sheet; and a weld toe positioned on a top portion of the protruding curved portion.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: March 17, 2020
    Assignee: JFE Steel Corporation
    Inventors: Tsuyoshi Shiozaki, Yuichi Tokita, Yoshikiyo Tamai
  • Publication number: 20190296086
    Abstract: An imaging element according to an embodiment of the present disclosure includes: a first electrode and a second electrode facing each other; and a photoelectric conversion layer including a p-type semiconductor and an n-type semiconductor, and provided between the first electrode and the second electrode, in which the photoelectric conversion layer has an exciton charge separation rate of 1×1010 s?1 to 1×1016 s?1 both inclusive in a p-n junction surface formed by the p-type semiconductor and the n-type semiconductor.
    Type: Application
    Filed: May 16, 2017
    Publication date: September 26, 2019
    Inventors: HAJIME KOBAYASHI, YUICHI TOKITA
  • Patent number: 10167530
    Abstract: A method of manufacturing a hot press formed part by hot pressing a coated steel sheet that is obtained by forming a Zn-based coating layer on a surface of a steel sheet includes: heating the coated steel sheet to a temperature range of 750° C. or more and 1000° C. or less; cooling a surface of the coated steel sheet; and hot press forming the coated steel sheet under a condition that a surface temperature of the coated steel sheet is 400° C. or less and an average temperature of the coated steel sheet is 500° C. or more or a temperature of a center position of the coated steel sheet in a thickness direction is 530° C. or more.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: January 1, 2019
    Assignee: JFE Steel Corporation
    Inventors: Tatsuya Nakagaito, Yuichi Tokita, Toru Minote, Yoshikiyo Tamai
  • Patent number: 10161892
    Abstract: A method of analyzing press-forming of a press-forming material including analyzing press-forming, analyzing springback and analyzing a change in shape of the press-forming material. The analyzing press-forming may include setting an initial temperature distribution for the heated press-forming material and performing a press-forming analysis by combining temperature analysis and structural analysis to obtain shape information, temperature distribution, stress distribution, and strain distribution. The analyzing springback may occur with and without consideration of contact heat transfer between a press-forming tool and the press-forming material. The method may further include modifying the temperature distribution obtained in the analyzing springback and then re-analyzing the change in shape of the press-forming material. The analyzing the change in shape may be performed until a temperature distribution in the press-forming material is within the range of ±5° C.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: December 25, 2018
    Assignee: JFE STEEL CORPORATION
    Inventors: Toru Minote, Yuichi Tokita, Yoshikiyo Tamai, Takeshi Fujita
  • Publication number: 20180339368
    Abstract: A lap-fillet arc welding joint includes a weld bead, the weld bead being formed on an end portion of one sheet of overlapped two sheets and a surface of other sheet along the end portion. The other sheet includes a projecting portion projecting from the surface at a side of a weld toe of at least one of a start portion and a termination portion of the weld bead. The weld toe is located on a slope surface portion of the projecting portion at a side of the end portion of the one sheet.
    Type: Application
    Filed: August 8, 2016
    Publication date: November 29, 2018
    Applicant: JFE STEEL CORPORATION
    Inventors: Tsuyoshi Shiozaki, Yuichi Tokita, Yoshikiyo Tamai
  • Publication number: 20180274575
    Abstract: A lap fillet arc-welded joint produced by overlapping two metal sheets and welding an end portion of one sheet of the two metal sheets to a surface of the other sheet along the end portion of the one sheet includes a protruding curved potion being bead-shaped and protruding from the surface of the other sheet; and a weld toe positioned on a top portion of the protruding curved portion.
    Type: Application
    Filed: January 27, 2016
    Publication date: September 27, 2018
    Inventors: Tsuyoshi Shiozaki, Yuichi Tokita, Yoshikiyo Tamai
  • Publication number: 20180219045
    Abstract: An image pickup element is constituted by laminating at least a first electrode, an organic photoelectric conversion layer, and a second electrode in order, and the organic photoelectric conversion layer includes a first organic semiconductor material having the following structural formula (1).
    Type: Application
    Filed: July 14, 2016
    Publication date: August 2, 2018
    Inventors: Masaki MURATA, Hideaki MOGI, Shintarou HIRATA, Iwao YAGI, Yasuharu UJIIE, Masashi BANDO, Raku SHIRASAWA, Hajime KOBAYASHI, Mitsunori NAKAMOTO, Yuichi TOKITA
  • Publication number: 20180195144
    Abstract: A method for manufacturing a hot press formed part, includes: preparing a hot press forming object comprising a single-ply portion and a two-ply portion; heating the hot press forming object to a temperature range from an Ac3 transformation temperature of a base steel sheet of the first coated steel sheet to 1000° C.; press forming the hot press forming object to obtain a formed body, the press forming being started upon temperatures of the single-ply portion and of the two-ply portion being no higher than solidification points of Zn—Ni coating layers of the first and second coated steel sheets and no lower than an Ar3 transformation temperature of the base steel sheet of the first coated steel sheet; and quenching the formed body to thereby obtain a hot press formed part, in which the hot press forming object has a thickness ratio from 1.4 to 5.0.
    Type: Application
    Filed: September 8, 2015
    Publication date: July 12, 2018
    Applicants: JFE STEEL CORPORATION, JFE STEEL CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Masaki MORINO, Hideaki KOBIKI, Tatsuya NAKAGAITO, Yuichi TOKITA, Toru MINOTE, Yoshikiyo TAMAI
  • Publication number: 20180009050
    Abstract: A welding structure of a press-formed part made by combining and joining two parts formed by press-forming and each having an opening portion on at least one side of a cross-section, while the opening portions face each other, and includes a step portion that is provided by forming a bent projection projecting outwardly on a tip end portion of a side wall portion of a lower side part, partially or entirely on a joining surface. A tip end side of the step portion is fitted into the opening portion of an upper side part, and the step portion of the lower side part and the tip end of a side wall portion of the upper side part are linearly joined by arc welding.
    Type: Application
    Filed: January 27, 2016
    Publication date: January 11, 2018
    Applicant: JFE STEEL CORPORATION
    Inventors: Yuichi Tokita, Tsuyoshi Shiozaki, Yoshikiyo Tamai
  • Publication number: 20170337304
    Abstract: A method of evaluating a hot stamped part manufactured by hot stamping a coated steel sheet having a Zn—Ni coating layer on a surface of a base steel sheet includes an analysis model setting step, a forming condition setting step, a forming analysis step, and an evaluation step which are performed using a computer, wherein in the evaluation step, a maximum micro-crack depth in the hot stamped part manufactured under a forming condition set in the forming condition setting step is evaluated using a correlation, obtained beforehand, between an equivalent plastic strain in a surface layer of the hot stamped part and the maximum micro-crack depth in the hot stamped part.
    Type: Application
    Filed: November 4, 2015
    Publication date: November 23, 2017
    Applicant: JFE STEEL CORPORATION
    Inventors: Toru MINOTE, Tatsuya NAKAGAITO, Yuichi TOKITA, Yoshikiyo TAMAI