Patents by Inventor Yuichi Tokuda

Yuichi Tokuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Comprehensive Glaucoma Determination Method Utilizing Glaucoma Diagnosis Chip And Deformed Proteomics Cluster Analysis
    Publication number: 20130275349
    Abstract: Provided is a technique for determining a physiological attribute in a mammal, including the onset or progression of human glaucoma, with high accuracy. The results of the determination of genotype date and the results of the determination of cytokine date are consolidated by a consolidated determination unit (114); comparison is made for determining as to which is larger, the number of Case determination procedures or the number of control determination procedures (S330); and it is determined as Case (glaucoma) when the number of Case determination procedures is larger and it is determined as Control (normal person) when the number of Control determination procedures is larger.
    Type: Application
    Filed: December 28, 2011
    Publication date: October 17, 2013
    Applicant: SANTEN PHARMACEUTICAL CO., LTD.
    Inventors: Kei Tashiro, Shigeru Kinoshita, Tomohito Yagi, Masakazu Nakano, Kazuhiko Mori, Yoko Ikeda, Morio Ueno, Yuichi Tokuda, Katsumi Yagi, Kengo Yoshii, Masahiro Fuwa
  • Hinge board and method for producing the same
    Patent number: 7381901
    Abstract: A hinge board having a hinge bending part and a rigid part includes: not less than two flexible wiring boards including a polyimide sheet layer, a conductor layer having a circuit formed on both sides or one side of the polyimide sheet layer, and a coverlay film layer covering the conductor layer; and a bonding material for bonding the flexible wiring boards. At least one of the flexible wiring boards is a flexible double-sided wiring board including the conductor layers on both sides of the polyimide sheet layer. Moreover, the flexible wiring boards are bonded to each other in the rigid part by use of the bonding material in such a manner that a space part is formed between the flexible wiring boards in the hinge bending part.
    Type: Grant
    Filed: October 19, 2005
    Date of Patent: June 3, 2008
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Takashi Tanaka, Hidenori Nakajima, Yuichi Tokuda
  • Hinge board and method for producing the same
    Publication number: 20070062722
    Abstract: A hinge board having a hinge bending part and a rigid part includes: not less than two flexible wiring boards including a polyimide sheet layer, a conductor layer having a circuit formed on both sides or one side of the polyimide sheet layer, and a coverlay film layer covering the conductor layer; and a bonding material for bonding the flexible wiring boards. At least one of the flexible wiring boards is a flexible double-sided wiring board including the conductor layers on both sides of the polyimide sheet layer. Moreover, the flexible wiring boards are bonded to each other in the rigid part by use of the bonding material in such a manner that a space part is formed between the flexible wiring boards in the hinge bending part.
    Type: Application
    Filed: October 19, 2005
    Publication date: March 22, 2007
    Inventors: Takashi Tanaka, Hidenori Nakajima, Yuichi Tokuda