Patents by Inventor Yuichiro AKIBA

Yuichiro AKIBA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low-temperature curable conductive paste for plating and electric wiring using the same
    Patent number: 8986575
    Abstract: A conductive paste containing a conductive powder (A), a vinyl chloride-vinyl acetate resin (B), a polyester resin and/or polyurethane resin (C), a blocked isocyanate (D) blocked with an active methylene compound, and an organic solvent (E), wherein the resin (C) has a glass transition temperature of ?50° C. to 20° C., a sum of amounts of the resin (C) is 50 to 400 parts by weight relative to 100 parts by weight of the resin (B), and a sum of amounts of the resin (B), the resin (C) component, and the blocked isocyanate (D) is 10 to 60 parts by weight relative to 100 parts by weight of the conductive powder (A). An electric wiring in which this conductive paste is formed on an insulating substrate.
    Type: Grant
    Filed: October 22, 2009
    Date of Patent: March 24, 2015
    Assignees: Toyo Boseki Kabushiki Kaisha, Kabushiki Kaisha Toshiba
    Inventors: Yuichiro Akiba, Tomoko Honda, Fujio Takahashi, Shinji Nakata
  • LOW-TEMPERATURE CURABLE CONDUCTIVE PASTE FOR PLATING AND ELECTRIC WIRING USING THE SAME
    Publication number: 20100101842
    Abstract: A conductive paste containing a conductive powder (A), a vinyl chloride-vinyl acetate resin (B), a polyester resin and/or polyurethane resin (C), a blocked isocyanate (D) blocked with an active methylene compound, and an organic solvent (E), wherein the resin (C) has a glass transition temperature of ?50° C. to 20° C., a sum of amounts of the resin (C) is 50 to 400 parts by weight relative to 100 parts by weight of the resin (B), and a sum of amounts of the resin (B), the resin (C) component, and the blocked isocyanate (D) is 10 to 60 parts by weight relative to 100 parts by weight of the conductive powder (A). An electric wiring in which this conductive paste is formed on an insulating substrate.
    Type: Application
    Filed: October 22, 2009
    Publication date: April 29, 2010
    Applicants: Toyo Boseki Kabushiki Kaisha, Kabushiki Kaisha Toshiba
    Inventors: Yuichiro AKIBA, Tomoko HONDA, Fujio TAKAHASHI, Shinji NAKATA