Patents by Inventor Yuichiro Ishii
Yuichiro Ishii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978349Abstract: A setting unit sets the operating mode of an aerial vehicle to a first operating mode that transmits, data generated by a host aerial vehicle and data received from another aerial vehicle to a processing device, or a second operating mode that transmits data generated by a host aerial vehicle to another aerial vehicle. At this time, setting unit sets the operating modes of each of a plurality of aerial vehicles using a setting method corresponding to the attributes of an airspace in which aerial vehicle flies, from among a plurality of setting methods that set the operating mode of aerial vehicle. The attributes of an airspace include attributes determined in accordance with a degree of importance pertaining to the process of transmitting data from aerial vehicle to a server device and/or attributes determined in accordance with the extent to which processes are distributed among a plurality of aerial vehicles.Type: GrantFiled: January 24, 2020Date of Patent: May 7, 2024Assignee: NTT DOCOMO, INC.Inventors: Kaori Niihata, Tadao Takami, Koji Ishii, Hiroshi Kawakami, Yuichiro Segawa, Yasuhiro Kitamura
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Patent number: 11959156Abstract: A cubic boron nitride sintered material comprises cubic boron nitride particles and a bonding material, wherein the bonding material comprises at least one first metallic element selected from the group consisting of titanium, zirconium, vanadium, niobium, hafnium, tantalum, chromium, rhenium, molybdenum, and tungsten; cobalt; and aluminum; the cubic boron nitride sintered material has a first interface region sandwiched between an interface between the cubic boron nitride particles and the bonding material, and a first virtual line passing through a point 10 nm apart from the interface to the bonding material side; and when an element that is present at the highest concentration among the first metallic elements in the first interface region is defined as a first element, an atomic concentration of the first element in the first interface region is higher than an atomic concentration of the first element in the bonding material excluding the first interface region.Type: GrantFiled: July 30, 2021Date of Patent: April 16, 2024Assignees: Sumitomo Electric Industries, Ltd., SUMITOMO ELECTRIC HARDMETAL CORP.Inventors: Yuichiro Watanabe, Katsumi Okamura, Akito Ishii, Yoshiki Asakawa, Akihiko Ueda, Satoru Kukino, Hisaya Hama
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Patent number: 11932035Abstract: There is provided a three-dimensional object printing apparatus including an imaging device fixed to a base and imaging an object located inside an imaging range, a first robot supporting a head having a nozzle for discharging a liquid and changing a position and a posture of the head, and a second robot supporting a three-dimensional workpiece and changes a position and a posture of the workpiece. The three-dimensional object printing apparatus performs a material feeding step of causing the second robot to move the workpiece from an outside to an inside of the imaging range, and a printing step of causing the head to discharge the liquid to the workpiece while at least one of the first robot and the second robot relatively moves the head and the workpiece inside the imaging range.Type: GrantFiled: February 21, 2022Date of Patent: March 19, 2024Assignee: SEIKO EPSON CORPORATIONInventors: Tomonaga Hasegawa, Yuichiro Matsuura, Masaru Kumagai, Shinichi Nakamura, Yuki Ishii
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Patent number: 11676681Abstract: A semiconductor device including an SRAM capable of sensing a defective memory cell that does not satisfy desired characteristics is provided. The semiconductor device includes a memory cell, a bit line pair being coupled to the memory cell and having a voltage changed towards a power-supply voltage and a ground voltage in accordance with data of the memory cell in a read mode, and a specifying circuit for specifying a bit line out of the bit line pair. In the semiconductor device, a wiring capacitance is coupled to the bit line specified by the specifying circuit and a voltage of the specified bit line is set to a voltage between a power voltage and a ground voltage in a test mode.Type: GrantFiled: July 22, 2021Date of Patent: June 13, 2023Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Shinji Tanaka, Yuichiro Ishii, Makoto Yabuuchi
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Publication number: 20220036961Abstract: A semiconductor device including an SRAM capable of sensing a defective memory cell that does not satisfy desired characteristics is provided. The semiconductor device includes a memory cell, a bit line pair being coupled to the memory cell and having a voltage changed towards a power-supply voltage and a ground voltage in accordance with data of the memory cell in a read mode, and a specifying circuit for specifying a bit line out of the bit line pair. In the semiconductor device, a wiring capacitance is coupled to the bit line specified by the specifying circuit and a voltage of the specified bit line is set to a voltage between a power voltage and a ground voltage in a test mode.Type: ApplicationFiled: July 22, 2021Publication date: February 3, 2022Inventors: Shinji TANAKA, Yuichiro ISHII, Makoto YABUUCHI
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Patent number: 10832788Abstract: A semiconductor device has a memory circuit and a logic circuit coupled with a memory circuit. the memory circuit included a memory array in which memory cells are arranged in a matrix, an input/output circuit for writing data to the memory cells and reading data from the memory cells, and a control circuit for generating a control signal for controlling the input/output circuit. In a test operation for testing the logic circuit, the input/output circuit receives a test data. The control circuit raises and lowers the control signal based on a rising and a falling of an external clock signal, thereby the test data is output to the logic circuit via the input/output circuit.Type: GrantFiled: November 13, 2019Date of Patent: November 10, 2020Assignee: RENESAS ELECTRONICS CORPORATIONInventor: Yuichiro Ishii
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Patent number: 10825814Abstract: A semiconductor device includes a semiconductor substrate, a first well region formed on the semiconductor substrate, a first fin integrally formed of the semiconductor substrate on the first well region and extended in a first direction in a plan view, a first electrode formed on the first fin via a first gate insulating film, and extended in a second direction crossing the first direction in the plan view, a tap region formed on the semiconductor substrate adjacent to the first well region in the second direction, and supplying a first potential to the first well region, a second fin integrally formed of the semiconductor substrate on the tap region and extended in the first direction in the plan view, and a first wiring layer formed on the second fin in a portion overlapping the tap region in the plan view.Type: GrantFiled: February 27, 2019Date of Patent: November 3, 2020Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Makoto Yabuuchi, Yuichiro Ishii
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Patent number: 10706917Abstract: Provided is a semiconductor memory device having a low power consumption write assist circuit. The semiconductor memory device includes multiple word lines, multiple bit line pairs, multiple memory cells, multiple auxiliary line pairs, a write driver circuit, a write assist circuit, and a select circuit. The memory cells are coupled to the word lines and the bit line pairs in such a manner that one memory cell is coupled to one word line and one bit line pair. The auxiliary line pairs run parallel to the bit line pairs in such a manner that one auxiliary line pair runs parallel to one bit line pair. The select circuit couples, to the write driver circuit, one bit line pair selected from the bit line pairs in accordance with a select signal, and couples, to the write assist circuit, an associated auxiliary line pair running parallel to the selected bit line pair.Type: GrantFiled: October 31, 2018Date of Patent: July 7, 2020Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Koji Nii, Yuichiro Ishii, Yohei Sawada, Makoto Yabuuchi
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Patent number: 10706902Abstract: A semiconductor device includes: memory cells, first word lined arranged for first ports and each arranging corresponding to respective rows of the memory cells; second word lines arranged for second ports and each arranged corresponding to respective rows of the memory cells, first dummy word lines each provided above the respective first word lines, second dummy word lines each provided above the respective second word lines, a word line driver driving the first and second word lines, and a dummy word line driver driving, in an opposite phase, the second dummy word line for the adjacent second word line according to driving of the first word line from among the first and second word lines, or the first dummy word line for the adjacent first word line according to driving of the second word line from among the first and second word lines.Type: GrantFiled: November 15, 2018Date of Patent: July 7, 2020Assignee: RENESAS ELECTRONICS CORPORATIONInventor: Yuichiro Ishii
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Publication number: 20200202968Abstract: A semiconductor device has a memory circuit and a logic circuit coupled with a memory circuit. the memory circuit included a memory array in which memory cells are arranged in a matrix, an input/output circuit for writing data to the memory cells and reading data from the memory cells, and a control circuit for generating a control signal for controlling the input/output circuit. In a test operation for testing the logic circuit, the input/output circuit receives a test data. The control circuit raises and lowers the control signal based on a rising and a falling of an external clock signal, thereby the test data is output to the logic circuit via the input/output circuit.Type: ApplicationFiled: November 13, 2019Publication date: June 25, 2020Inventor: Yuichiro ISHII
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Patent number: 10658028Abstract: A semiconductor storage device includes a plurality of memory cells arranged in a matrix, a word line provided corresponding to a memory cell row, a dummy word line formed in a metal interconnection layer adjacent to a metal interconnection layer in which the word line is formed, a word driver circuit configured to drive the word line, and a dummy word driver circuit configured to increase voltage on the word line based on interline capacitance between the word line and the dummy word line.Type: GrantFiled: November 14, 2016Date of Patent: May 19, 2020Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Yuichiro Ishii, Shinji Tanaka
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Patent number: 10515672Abstract: A semiconductor memory device including a pair of first bit lines extended in a first direction, a pair of second bit lines extended in the first direction, a first word line extended in a second direction crossing the first direction, a second word line extended in the second direction, a memory cell surrounded by the first bit line, the second bit line, the first word line, and the second word line, and including a drive transistor, a first transfer transistor coupled with one of the pair of first bit lines, and having a gate coupled with the first word line, a second transfer transistor coupled with one of the pair of second bit lines, and having a gate coupled with the second word line, and a load transistor, a write drive circuit that transfers data to the memory cell.Type: GrantFiled: December 21, 2018Date of Patent: December 24, 2019Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Shinji Tanaka, Yuichiro Ishii, Masaki Tsukude, Yoshikazu Saito
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Patent number: 10482949Abstract: A semiconductor device includes a first mode and a second mode different from the first mode, includes a memory circuit including a first switch, a memory array, and a peripheral circuit. A first power source line is electrically coupled with an I/O circuit of the peripheral circuit and is supplied with a first voltage in the first mode. A second power source line is electrically coupled with a memory cell of the memory array, and supplied with a second voltage lower than the first voltage in the second mode.Type: GrantFiled: February 11, 2019Date of Patent: November 19, 2019Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Yuichiro Ishii, Atsushi Miyanishi, Kazumasa Yanagisawa
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Patent number: 10460795Abstract: A semiconductor device includes a latch circuit receiving a first signal, generated in synchronization with a clock signal, from a pulse generation circuit, and generating a second signal; a first delay circuit receiving the second signal from the latch circuit, and generating a third signal by delaying the second signal; a second delay circuit receiving the third signal from the first delay circuit, and generating a fourth signal by delaying the third signal; and a logic circuit receiving the second and fourth signals from the latch and second delay circuits, respectively, and generating a word line control signal based on one of the second signal and the fourth signal. The latch circuit generates the second signal of a first level based on the first signal, and generates the second signal of a second level, which is different from the first level, based on the third signal.Type: GrantFiled: December 10, 2018Date of Patent: October 29, 2019Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Yuichiro Ishii, Makoto Yabuuchi, Masao Morimoto
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Patent number: 10453520Abstract: A memory circuit includes: a control circuit generating first and second start signals within a single signal cycle of an input clock signal; an address control circuit coupled to a plurality of address ports for receiving a plurality of address signals and activating one of word lines corresponding to one of the address signals based on the first or second start signals; and a data input/output circuit for writing or reading data by selecting one of memory cells coupled to the activated word line. The control circuit includes: a start signal generation unit that generates the first start signal in response to a first pulse signal and the second start signal in response to a second pulse signal, and a pulse signal generation unit that generates the first pulse signal in response to the input clock signal and the second signal in response to the first start signal.Type: GrantFiled: June 20, 2018Date of Patent: October 22, 2019Assignee: RENESAS ELECTRONICS CORPORATIONInventor: Yuichiro Ishii
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Patent number: 10453519Abstract: A semiconductor device includes a SRAM (Static Random Access Memory) circuit. The SRAM circuit includes a static memory cell, a word line coupled with the static memory cell, a pair of bit lines coupled with the static memory cell, a first interconnection coupled with the static memory cell, and supplying a first potential, a second interconnection coupled with the static memory cell, and supplying a second potential lower than the first potential, a first potential control circuit controlling a potential of the second interconnection, and a second potential control circuit controlling a potential of the first interconnection. The SRAM circuit includes, as an operation mode a first operation mode for reading data from the SRAM circuit, or for writing data into the SRAM circuit, and a second operation mode for reducing power consumption than the first operation mode.Type: GrantFiled: September 27, 2018Date of Patent: October 22, 2019Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Yohei Sawada, Makoto Yabuuchi, Yuichiro Ishii
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Patent number: 10381056Abstract: A dual port static random access memory (DPSRAM) cell includes a first power line, a first bit line and a second bit line. The first power line is disposed between a first word line and a second word line. The first bit line is disposed between the first word line and the first power line. The second bit line is disposed between the second word line and the first power line.Type: GrantFiled: May 29, 2018Date of Patent: August 13, 2019Assignee: UNITED MICROELECTRONICS CORP.Inventors: Tien-Yu Lu, Chun-Hsien Huang, Ching-Cheng Lung, Yu-Tse Kuo, Shou-Sian Chen, Koji Nii, Yuichiro Ishii
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Patent number: 10373675Abstract: A semiconductor storage device includes, a memory array, a plurality of memory cells provided in rows and columns, and a control circuit for controlling the memory array, each of the memory cells being a static-type memory cell comprising driving transistors, transfer transistors, and load elements.Type: GrantFiled: April 20, 2017Date of Patent: August 6, 2019Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Yoshisato Yokoyama, Yuichiro Ishii
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Patent number: 10360091Abstract: The present invention provides a semiconductor memory device that can perform failure detection of an address decoder by a simple method with a low area overhead. The semiconductor memory device includes: a first memory array having a plurality of first memory cells arrange in matrix; a plurality of word lines provided corresponding to each of the memory cell rows; an address decoder for selecting a word line from the word lines based on the input address information; a second memory array that is provided adjacent to the first memory array in the column direction, having a plurality of second memory cells able to read address information used in the selection of the previously stored word line, according to the selection of the word line extended to the second memory array; and a comparison circuit for comparing the input address information with the address information read from the second memory array.Type: GrantFiled: October 4, 2018Date of Patent: July 23, 2019Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Yuichiro Ishii, Atsushi Miyanishi, Yoshikazu Saito
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Patent number: 10354722Abstract: An assist driver is coupled to an end of a word line to which a word line driver is not coupled, and couples the other end of the word line to a first power source, in accordance with a voltage of the other end of the word line.Type: GrantFiled: September 28, 2018Date of Patent: July 16, 2019Assignee: Renesas Electronics CorporationInventor: Yuichiro Ishii