Patents by Inventor Yuichiro Miyamori

Yuichiro Miyamori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming dummy wafer
    Patent number: 7060622
    Abstract: According to the present invention, a dummy wafer is formed by forming a masking film on a rear surface of a silicon wafer; spray coating aluminum and depositing an aluminum film on a front surface of the silicon wafer; spray coating ceramics or carbon and depositing a ceramic film or carbon film on the aluminum film so that the aluminum film may be completely covered; and removing the masking film formed on the rear surface. Also, a dummy wafer can be formed by using an aluminum wafer as a wafer substrate and subjecting it to anodic oxidation to form a film of aluminum oxide.
    Type: Grant
    Filed: September 23, 2003
    Date of Patent: June 13, 2006
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Yuichiro Miyamori, Munenori Hidaka, Masashi Yoshida
  • Method of forming dummy wafer
    Publication number: 20040063324
    Abstract: According to the present invention, a dummy wafer is formed by forming a masking film on a rear surface of a silicon wafer; spray coating aluminum and depositing an aluminum film on a front surface of the silicon wafer; spray coating ceramics or carbon and depositing a ceramic film or carbon film on the aluminum film so that the aluminum film may be completely covered; and removing the masking film formed on the rear surface. Also, a dummy wafer can be formed by using an aluminum wafer as a wafer substrate and subjecting it to anodic oxidation to form a film of aluminum oxide.
    Type: Application
    Filed: September 23, 2003
    Publication date: April 1, 2004
    Inventors: Yuichiro Miyamori, Munenori Hidaka, Masashi Yoshida