Patents by Inventor Yuichiro Miyata

Yuichiro Miyata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLVENT VAPOR SUPPLY APPARATUS AND SOLVENT VAPOR SUPPLY METHOD
    Publication number: 20230173403
    Abstract: A solvent vapor supply apparatus for supplying solvent vapor to a substrate treatment apparatus, includes: a solvent storage which is kept warm at a temperature equal to or higher than a saturation temperature of a solvent stored therein; a precooler which precools the solvent vapor generated in the solvent storage; and a temperature regulator regulates a temperature of the precooled solvent vapor to a target temperature when the solvent vapor is supplied to the substrate treatment apparatus, wherein the temperature regulator supplies the solvent vapor regulated to the target temperature to the substrate treatment apparatus.
    Type: Application
    Filed: November 30, 2022
    Publication date: June 8, 2023
    Inventor: Yuichiro MIYATA
  • Substrate processing method, substrate processing apparatus, and storage medium
    Patent number: 9552987
    Abstract: A substrate processing method is performed to improve surface roughness of a pattern mask formed on a substrate by being exposed and developed. The method includes supplying a first solvent in a gaseous state to a surface of the substrate to dissolve the pattern mask, and supplying a second solvent to the surface of the substrate, which is supplied with the first solvent, to dissolve the pattern mask, wherein a permeability of the second solvent is lower than a permeability of the first solvent.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: January 24, 2017
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yuichiro Miyata, Keiichi Tanaka, Kenichi Ueda, Takahiro Shiozawa
  • SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND STORAGE MEDIUM
    Publication number: 20140363976
    Abstract: A substrate processing method is performed to improve surface roughness of a pattern mask formed on a substrate by being exposed and developed. The method includes supplying a first solvent in a gaseous state to a surface of the substrate to dissolve the pattern mask, and supplying a second solvent to the surface of the substrate, which is supplied with the first solvent, to dissolve the pattern mask, wherein a permeability of the second solvent is lower than a permeability of the first solvent.
    Type: Application
    Filed: June 6, 2014
    Publication date: December 11, 2014
    Inventors: Yuichiro MIYATA, Keiichi TANAKA, Kenichi UEDA, Takahiro SHIOZAWA
  • Coater cup
    Patent number: D610176
    Type: Grant
    Filed: February 11, 2009
    Date of Patent: February 16, 2010
    Assignee: Tokyo Electron Limited
    Inventors: Shuichi Nagamine, Naofumi Kishita, Koji Takayanagi, Yuichiro Miyata, Yasushi Takiguchi