Abstract: A light source window member for applying irradiation light from a light source that includes a tubular side wall member extending in a longitudinal direction and constructed to contain the light source therein; and an irradiation window region provided at at least one surface of the tubular side wall member, and the irradiation window region is made of artificial quartz.

Abstract: A method capable of manufacturing a quartz vibrator by disposing a metallic bonding material on one main surface of a ceramic plate having a quartz vibrating element mounted thereon. Thereafter, the bonding of a cap having a recess to the ceramic plate by disposing the cap on the one main surface of the ceramic plate so that an open side of the recess faces the ceramic plate, melting the bonding material, and then allowing the bonding material to set, is carried out.

Abstract: A method for manufacturing an electronic component is provided where resin adhesive rarely spreads before curing. The method includes providing a first sealing member and forming a frame-shaped glass layer on a principal surface of the first sealing member. Moreover, the first sealing member is cut into multiple first sealing members and second sealing members are bonded with resin adhesive to inner frame regions on the principal surface of the first sealing member defined by the glass layer.

Abstract: A quartz vibrator that includes a substrate, a quartz vibrating element, and a dome-shaped cap. The quartz vibrating element is mounted on the substrate. The cap is bonded to the substrate. The cap defines and forms a sealed space that seals the quartz vibrating element along with the substrate. The cap has a side wall portion, a ceiling portion, and a connecting portion. The side wall portion encloses the quartz vibrating element. The ceiling portion is positioned above the quartz vibrating element. The connecting portion connects the side wall portion and the ceiling portion. The connecting portion is thinner than the side wall portion and the ceiling portion.

Abstract: A method for manufacturing a piezoelectric vibration device wherein a substrate is prepared, and a piezoelectric resonator element is mounted on the substrate. Before or after a packaging member is joined to the substrate, the piezoelectric resonator element is exposed to an environment at a higher temperature than ambient temperature and a higher humidity than ambient humidity, and then an electrical property is measured to detect attachment of dust and/or foreign matter according to a variation of the electrical property.

Abstract: A quartz vibrator that includes a substrate, a quartz vibrating element, and a dome-shaped cap. The quartz vibrating element is mounted on the substrate. The cap is bonded to the substrate. The cap defines and forms a sealed space that seals the quartz vibrating element along with the substrate. The cap has a side wall portion, a ceiling portion, and a connecting portion. The side wall portion encloses the quartz vibrating element. The ceiling portion is positioned above the quartz vibrating element. The connecting portion connects the side wall portion and the ceiling portion. The connecting portion is thinner than the side wall portion and the ceiling portion.

Abstract: A method of manufacturing an electronic component includes bonding a dome-shaped cap having a recess to a substrate on which are disposed a vibrator and a bonding material projecting in a rounded shape and surrounding the vibrator while the cap is disposed so that an open side of the recess faces the substrate and is relatively pressed to the substrate side. The bonding material is disposed so that, relative to the vibrator, an outer side end portion of the cap is located on the inner side of the bonding material or an inner side end portion of the cap is located on the outer side of the bonding material.

Abstract: A method capable of manufacturing a quartz vibrator by disposing a metallic bonding material on one main surface of a ceramic plate having a quartz vibrating element mounted thereon. Thereafter, the bonding of a cap having a recess to the ceramic plate by disposing the cap on the one main surface of the ceramic plate so that an open side of the recess faces the ceramic plate, melting the bonding material, and then allowing the bonding material to set, is carried out.

Abstract: There is provided an electronic component in which sealing members are bonded with a resin adhesive and the resin adhesive rarely spreads before curing, and a manufacturing method for an electronic component in which a resin adhesive rarely spreads before curing. An electronic component having a first sealing member and a second sealing member bonded to a principal surface of the first sealing member to form a sealed space, a resin adhesive layer that bonds the first sealing member and the second sealing member on a frame-shaped bonding region of the principal surface, a frame-shaped glass layer provided between the frame-shaped bonding region and a peripheral edge portion of the first sealing member, and an electronic component body provided in the sealed space.

Abstract: A method for manufacturing a piezoelectric vibration device wherein a substrate is prepared, and a piezoelectric resonator element is mounted on the substrate. Before or after a packaging member is joined to the substrate, the piezoelectric resonator element is exposed to an environment at a higher temperature than ambient temperature and a higher humidity than ambient humidity, and then an electrical property is measured to detect attachment of dust and/or foreign matter according to a variation of the electrical property.