Abstract: To provide an adhesive film by which air bubbles formed at a bonding interface when the adhesive film is used for bonding, readily disappear under normal temperature and normal pressure. One embodiment of the adhesive film of the present invention is characterized by having at least one adhesive layer, wherein the adhesive layer satisfies the following requirements (a) to (c). (a) A diffusion coefficient of nitrogen gas is at least 1.5×10?6 cm2/sec, (b) A shear modulus G? (1 Hz) is from 5×102 to 1.0×105 Pa, at a measurement temperature of 25° C. and a frequency of 1 Hz, and (C) The adhesive layer has an absorption peak at from 800 to 820 cm?1 and no absorption peak at from 1,000 to 1,020 cm?1, in an infrared absorption spectrum.

Abstract: An adhesive film having at least one adhesive layer, where the adhesive layer satisfies the following requirements (a) to (c): (a) a diffusion coefficient of nitrogen gas of at least 1.5×10?6 cm2/sec; (b) a shear modulus G? (1 Hz) of 5×102 to 1.0×105 Pa, at a measurement temperature of 25° C. and a frequency of 1 Hz; and (c) an absorption peak at from 800 to 820 cm?1 and no absorption peak at from 1,000 to 1,020 cm?1, in an infrared absorption spectrum.

Abstract: To provide an adhesive film by which air bubbles formed at a bonding interface when the adhesive film is used for bonding, readily disappear under normal temperature and normal pressure. One embodiment of the adhesion film of the present invention is characterized by having at least one adhesive layer, wherein the adhesive layer satisfies the following requirements (a) to (c). (a) A diffusion coefficient of nitrogen gas is at least 1.5×10?6 cm2/sec. (b) A shear modulus G? (1 Hz) is from 5×102 to 1.0×105 Pa, at a measurement temperature of 25° C. and a frequency of 1 Hz. (c) The adhesive layer has an absorption peak at from 800 to 820 cm?1 and no absorption peak at from 1,000 to 1,020 cm?1, in an infrared absorption spectrum.

Abstract: There are provided a photoelectric conversion element with high photoelectric conversion efficiency, whose light absorption efficiency, charge separation efficiency, and charge transport efficiency are at high level, and a method for efficiently manufacturing the photoelectric conversion element. A photoelectric conversion element has an anode, a cathode opposed to the anode, and an organic film disposed between the anode and the cathode and containing a liquid-crystalline conjugated block polymer. A method of manufacturing the above mentioned photoelectric conversion element has the step of, (1) preparing an organic film forming composition containing the liquid-crystalline conjugated block polymer; (2) forming the one electrode and a coating film using the composition on it; (3) heat treating the coating film within a temperature range in a liquid-crystalline state so as to obtain an organic film; and (4) forming the other electrode which is not formed in the step (2) above the organic film.

Abstract: An object of the invention is to provide a thermosetting resin composition having excellent low temperature curing properties, tack properties, flexibility and electric properties, cured products made from the composition and uses thereof. The thermosetting resin composition of the invention comprises (A) a thermosetting resin, preferably a carboxyl group containing resin, and (B) a polyfunctional aliphatic glycidyl ether compound having a total chlorine amount of less than 0.7% by mass. The cured products of the thermosetting resin composition is used as insulating protective coating films for printed wiring boards, flexible printed wiring boards, chip on films and the like.