Patents by Inventor Yuichiro Ohtsuka

Yuichiro Ohtsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967469
    Abstract: Disclosed herein is an electronic component that includes a substrate, a planarizing layer covering a surface of the substrate, a first conductive layer formed on the planarizing layer and having a lower electrode, a dielectric film made of a material different from that of the planarizing layer and covering the planarizing layer and first conductive layer, an upper electrode laminated on the lower electrode through the dielectric film, and a first insulating layer covering the first conductive layer, dielectric film, and upper electrode. An outer periphery of the first insulating layer directly contacts the planarizing layer without an intervention of the dielectric film.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: April 23, 2024
    Assignee: TDK CORPORATION
    Inventors: Hajime Kuwajima, Takashi Ohtsuka, Takeshi Oohashi, Yuichiro Okuyama
  • Patent number: 11165233
    Abstract: An electrical connection box includes: a frame accommodating electronic components; and a lower cover located below the frame and closing a lower opening. The frame includes double walls including a first outer wall and a first inner wall and formed along the lower opening. The lower cover includes: a second outer wall located between the first outer wall and the first inner wall in a placement state; and a second inner wall formed inside the second outer wall and along the second outer wall. The first inner wall includes: a body formed in such a manner that a lower end is located between the second outer wall and the second inner wall in the placement state; and a bulge protruding toward the first outer wall from an opposed surface, being opposite to the first outer wall, of the body.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: November 2, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Yuichiro Ohtsuka, Takaaki Kakimi, Takao Nogaki
  • Publication number: 20210083464
    Abstract: An electrical connection box includes: a frame accommodating electronic components; and a lower cover located below the frame and closing a lower opening. The frame includes double walls including a first outer wall and a first inner wall and formed along the lower opening. The lower cover includes: a second outer wall located between the first outer wall and the first inner wall in a placement state; and a second inner wall formed inside the second outer wall and along the second outer wall. The first inner wall includes: a body formed in such a manner that a lower end is located between the second outer wall and the second inner wall in the placement state; and a bulge protruding toward the first outer wall from an opposed surface, being opposite to the first outer wall, of the body.
    Type: Application
    Filed: September 11, 2020
    Publication date: March 18, 2021
    Applicant: Yazaki Corporation
    Inventors: Yuichiro Ohtsuka, Takaaki Kakimi, Takao Nogaki