Patents by Inventor Yuichiro Okuyama
Yuichiro Okuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11967469Abstract: Disclosed herein is an electronic component that includes a substrate, a planarizing layer covering a surface of the substrate, a first conductive layer formed on the planarizing layer and having a lower electrode, a dielectric film made of a material different from that of the planarizing layer and covering the planarizing layer and first conductive layer, an upper electrode laminated on the lower electrode through the dielectric film, and a first insulating layer covering the first conductive layer, dielectric film, and upper electrode. An outer periphery of the first insulating layer directly contacts the planarizing layer without an intervention of the dielectric film.Type: GrantFiled: May 26, 2021Date of Patent: April 23, 2024Assignee: TDK CORPORATIONInventors: Hajime Kuwajima, Takashi Ohtsuka, Takeshi Oohashi, Yuichiro Okuyama
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Patent number: 11776947Abstract: Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.Type: GrantFiled: March 19, 2021Date of Patent: October 3, 2023Assignee: TDK CORPORATIONInventors: Yusuke Oba, Kenichi Yoshida, Takashi Ohtsuka, Yuichiro Okuyama, Tomoya Hanai, Yu Fukae
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Patent number: 11545303Abstract: Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.Type: GrantFiled: January 7, 2021Date of Patent: January 3, 2023Assignee: TDK CORPORATIONInventors: Kazuhiro Yoshikawa, Kenichi Yoshida, Takashi Ohtsuka, Yuichiro Okuyama, Takeshi Oohashi, Hajime Kuwajima
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Patent number: 11515854Abstract: An LC composite component includes a magnetic substrate with magnetism, a magnetic layer with magnetism, inductors, capacitors, and core parts with magnetism. The magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the magnetic substrate. The inductors and the capacitors are disposed between the first surface of the magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core part is 1.0 or more times the thickness of the magnetic layer, the thickness of the magnetic substrate is 1.0 or more times the thickness of the magnetic layer.Type: GrantFiled: December 23, 2019Date of Patent: November 29, 2022Assignee: TDK CorporationInventors: Yoshihiro Shinkai, Yuichiro Okuyama, Yusuke Ariake, Tomoya Hanai, Isao Kanada, Takashi Ohtsuka
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Patent number: 11452209Abstract: Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.Type: GrantFiled: December 26, 2020Date of Patent: September 20, 2022Assignee: TDK CORPORATIONInventors: Yuichiro Okuyama, Takeshi Oohashi, Hajime Kuwajima, Takashi Ohtsuka, Kazuhiro Yoshikawa, Kenichi Yoshida
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Patent number: 11328872Abstract: An LC composite component includes a non-magnetic substrate, a magnetic layer with magnetism, capacitors, inductors, and core parts with magnetism. The non-magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the non-magnetic substrate. The inductors and the capacitors are disposed between the first surface of the non-magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the non-magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core parts is 1.0 or more times the thickness of the magnetic layer in a direction perpendicular to the first surface of the non-magnetic substrate, and each of the magnetic layer and the core parts contains magnetic metal particles and resin.Type: GrantFiled: December 23, 2019Date of Patent: May 10, 2022Assignee: TDK CORPORATIONInventors: Yoshihiro Shinkai, Yuichiro Okuyama, Tomoya Hanai, Yusuke Ariake, Isao Kanada, Takashi Ohtsuka
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Publication number: 20210407737Abstract: Disclosed herein is an electronic component that includes a substrate, a planarizing layer covering a surface of the substrate, a first conductive layer formed on the planarizing layer and having a lower electrode, a dielectric film made of a material different from that of the planarizing layer and covering the planarizing layer and first conductive layer, an upper electrode laminated on the lower electrode through the dielectric film, and a first insulating layer covering the first conductive layer, dielectric film, and upper electrode. An outer periphery of the first insulating layer directly contacts the planarizing layer without an intervention of the dielectric film.Type: ApplicationFiled: May 26, 2021Publication date: December 30, 2021Applicant: TDK CORPORATIONInventors: Hajime KUWAJIMA, Takashi OHTSUKA, Takeshi OOHASHI, Yuichiro OKUYAMA
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Publication number: 20210305231Abstract: Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.Type: ApplicationFiled: March 19, 2021Publication date: September 30, 2021Applicant: TDK CORPORATIONInventors: Yusuke OBA, Kenichi YOSHIDA, Takashi OHTSUKA, Yuichiro OKUYAMA, Tomoya HANAI, Yu FUKAE
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Publication number: 20210225593Abstract: Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.Type: ApplicationFiled: January 7, 2021Publication date: July 22, 2021Applicant: TDK CORPORATIONInventors: Kazuhiro YOSHIKAWA, Kenichi YOSHIDA, Takashi OHTSUKA, Yuichiro OKUYAMA, Takeshi OOHASHI, Hajime KUWAJIMA
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Publication number: 20210219430Abstract: Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.Type: ApplicationFiled: December 26, 2020Publication date: July 15, 2021Applicant: TDK CORPORATIONInventors: Yuichiro OKUYAMA, Takeshi OOHASHI, Hajime KUWAJIMA, Takashi OHTSUKA, Kazuhiro YOSHIKAWA, Kenichi YOSHIDA
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Publication number: 20200211782Abstract: An LC composite component includes a non-magnetic substrate, a magnetic layer with magnetism, capacitors, inductors, and core parts with magnetism. The non-magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the non-magnetic substrate. The inductors and the capacitors are disposed between the first surface of the non-magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the non-magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core parts is 1.0 or more times the thickness of the magnetic layer in a direction perpendicular to the first surface of the non-magnetic substrate, and each of the magnetic layer and the core parts contains magnetic metal particles and resin.Type: ApplicationFiled: December 23, 2019Publication date: July 2, 2020Applicant: TDK CORPORATIONInventors: Yoshihiro SHINKAI, Yuichiro OKUYAMA, Tomoya HANAI, Yusuke ARIAKE, Isao KANADA, Takashi OHTSUKA
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Publication number: 20200211749Abstract: An LC composite component includes a magnetic substrate with magnetism, a magnetic layer with magnetism, inductors, capacitors, and core parts with magnetism. The magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the magnetic substrate. The inductors and the capacitors are disposed between the first surface of the magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core part is 1.0 or more times the thickness of the magnetic layer, the thickness of the magnetic substrate is 1.0 or more times the thickness of the magnetic layer.Type: ApplicationFiled: December 23, 2019Publication date: July 2, 2020Applicant: TDK CorporationInventors: Yoshihiro SHINKAI, Yuichiro OKUYAMA, Yusuke ARIAKE, Tomoya HANAI, Isao KANADA, Takashi OHTSUKA
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Publication number: 20190313528Abstract: Disclosed herein is a multilayer wiring structure that includes a first metal layer; an interlayer insulating film formed on the first metal layer, the interlayer insulating film having an opening that exposes a first area of the first metal layer; a second metal layer formed on an inner wall of the opening; and a third metal layer filling the opening via the second metal layer. The first and third metal layers are direct contact with each other at a bottom of the opening.Type: ApplicationFiled: April 3, 2019Publication date: October 10, 2019Applicant: TDK CorporationInventors: Hajime Kuwajima, Tomonaga Nishikawa, Takashi Ohtsuka, Takeshi Oohashi, Yuichiro Okuyama, Manabu Yamatani
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Patent number: 10426032Abstract: Disclosed herein is a multilayer wiring structure that includes a first metal layer; an interlayer insulating film formed on the first metal layer, the interlayer insulating film having an opening that exposes a first area of the first metal layer; a second metal layer formed on an inner wall of the opening; and a third metal layer filling the opening via the second metal layer. The first and third metal layers are direct contact with each other at a bottom of the opening.Type: GrantFiled: April 3, 2019Date of Patent: September 24, 2019Assignee: TDK CORPORATIONInventors: Hajime Kuwajima, Tomonaga Nishikawa, Takashi Ohtsuka, Takeshi Oohashi, Yuichiro Okuyama, Manabu Yamatani
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Patent number: 7650120Abstract: A high frequency module comprises: a switch circuit connected to two antenna terminals; a diplexer connected to two reception signal terminals and the switch circuit; and a diplexer connected to two transmission signal terminals and the switch circuit. Each of the diplexers incorporates two band-pass filters and a low-pass filter. Each of the band-pass filters is formed by using a resonant circuit.Type: GrantFiled: July 2, 2008Date of Patent: January 19, 2010Assignee: TDK CorporationInventors: Yuichiro Okuyama, Hideya Matsubara, Masashi Iwata
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Patent number: 7565116Abstract: A high frequency module comprises a layered substrate. Inside the layered substrate, a reception diplexer for processing reception signals and a transmission diplexer for processing transmission signals are provided. The reception diplexer and the transmission diplexer are located in two different regions inside the layered substrate. A conductor portion that is connected to the ground and that electromagnetically separates the reception diplexer and the transmission diplexer from each other is provided between the two regions inside the layered substrate. The conductor portion is formed by using a plurality of through holes.Type: GrantFiled: November 8, 2005Date of Patent: July 21, 2009Assignee: TDK CorporationInventors: Yuichiro Okuyama, Hideya Matsubara, Shinya Nakai, Masashi Iwata
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Patent number: 7471930Abstract: A high frequency module comprises: a switch circuit connected to two antenna terminals; a diplexer connected to two reception signal terminals and the switch circuit; and a diplexter connected to two transmission signal terminals and the switch circuit. Each of the diplexers incorporates two band-pass filters and a low-pass filter. Each of the band-pass filters is formed by using a resonant circuit.Type: GrantFiled: October 21, 2005Date of Patent: December 30, 2008Assignee: TDK CorporationInventors: Yuichiro Okuyama, Hideya Matsubara, Masashi Iwata
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Patent number: 7463115Abstract: A high frequency electronic component comprises a layered substrate. On the bottom surface of the layered substrate, there are provided a plurality of functional terminals for inputting and outputting signals relating to functions of a circuit inside the layered substrate, a plurality of ground terminals, a plurality of terminals that are not connected to external circuits, and a conductor section for grounding. The conductor section for grounding includes: a center portion located in a region surrounded by a plurality of terminals; and a plurality of coupling portions for coupling the center portion to the terminals.Type: GrantFiled: July 17, 2006Date of Patent: December 9, 2008Assignee: TDK CorporationInventor: Yuichiro Okuyama
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Publication number: 20080285531Abstract: A high frequency module comprises: a switch circuit connected to two antenna terminals; a diplexer connected to two reception signal terminals and the switch circuit; and a diplexer connected to two transmission signal terminals and the switch circuit. Each of the diplexers incorporates two band-pass filters and a low-pass filter. Each of the band-pass filters is formed by using a resonant circuit.Type: ApplicationFiled: July 2, 2008Publication date: November 20, 2008Applicant: TDK CorporationInventors: Yuichiro Okuyama, Hideya Matsubara, Masashi Iwata
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Patent number: 7412210Abstract: A high frequency module comprises: a switch circuit connected to first and second antenna terminals; a first diplexer connected to first and second reception signal terminals and the switch circuit; a second diplexer connected to first and second transmission signal terminals and the switch circuit; and a layered substrate for integrating these components. The layered substrate includes a first region and a second region that are divided from each other by an imaginary plane that passes through the center of the bottom surface of the layered substrate and that intersects the bottom surface at a right angle. The first diplexer is located in the first region while the second diplexer is located in the second region. The locations of the first antenna terminal and the first and second reception signal terminals and the locations of the second antenna terminal and the first and second transmission signal terminals are symmetric with respect to the imaginary plane.Type: GrantFiled: June 13, 2006Date of Patent: August 12, 2008Assignee: TDK CorporationInventor: Yuichiro Okuyama