Abstract: An improved sputtering apparatus is provided which can judge whether or not a normal thin film has been satisfactorily deposited on the surface of a substrate to be processed in a film deposition apparatus. The judgment is made immediately after the sputtering process on the basis of the detection results of the pressure in a vacuum chamber and the waveform of discharge output power supplied from a discharge power source.

Abstract: A sucked substrate detecting apparatus is provided which comprises sucking pads for sucking disk substrates, a main pipe connected to the sucking pads, a vacuum pump connected through a first valve to the main pipe, first and second branch pipes connected respectively to the main pipe, a second valve connected to the first branch pipe, for opening and closing with respect to the atmosphere, a pressure sensor connected to the second branch pipe, for substantially detecting the pressure in the main pipe, and a controller connected to the first and second valves. The sucked substrate detecting apparatus can judge on the basis of the output levels produced from the pressure sensor, the presence or absence of a disk substrate sucked by the sucking pads and whether or not the disk substrate has been satisfactorily sucked by the sucking pads.