Patents by Inventor Yuichiro Sugita

Yuichiro Sugita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200403226
    Abstract: The invention discloses a positive electrode active material for a magnesium secondary battery or lithium ion secondary battery, including: a particle including a nucleus and a crystal of vanadium oxide grown from the nucleus as a starting point and having a maximum length of 5 ?m or less in the major axis direction.
    Type: Application
    Filed: September 12, 2018
    Publication date: December 24, 2020
    Applicant: Sanoh Industrial Co., Ltd.
    Inventors: Koga-shi, ARAI, Kazuyuki SUGITA, Atsushi HONDA, Yuichiro TAKIMOTO, Hideki KURIHARA, Masashi INAMOTO, Kyousuke DOUMAE
  • Patent number: 8007629
    Abstract: A method of manufacturing a multi-layer circuit board including preparing a laminated member formed of (i) a core circuit board having a circuit pattern thereon and (ii) a prepreg sheet having a through-hole filled with conductive paste, forming a laminated structure such that the laminated member is sandwiched by lamination plates, and applying heat and pressure to the laminated structure. According to this method, selecting a lamination plate that has a thermal expansion coefficient that is equivalent to that of a core circuit board will protect the conductive paste from distortion, thereby offering a high-quality multi-layer circuit board having a reliable connection resistance.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: August 30, 2011
    Assignee: Panasonic Corporation
    Inventors: Toshiaki Takenaka, Yoshihiro Kawakita, Tadashi Tojyo, Yuichiro Sugita
  • Publication number: 20080251193
    Abstract: A method of manufacturing a multi-layer circuit board having the following steps: preparing a laminated member formed of a core circuit board having a circuit pattern thereon and a prepreg sheet having a through-hole filled with conductive paste; forming a laminated structure in a manner that the laminated member is sandwiched by lamination plates; and applying heat and pressure to the laminated structure. According to the method, selecting a lamination plate so as to have thermal expansion coefficient equivalent to that of a core circuit board can protect conductive paste from distortion, thereby offering a high-quality multi-layer circuit board with reliable connection resistance.
    Type: Application
    Filed: September 30, 2005
    Publication date: October 16, 2008
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Toshiaki Takenaka, Yoshihiro Kawakita, Tadashi Tojyo, Yuichiro Sugita
  • Patent number: 7018672
    Abstract: A method of manufacturing multi-layer circuit board comprising: a hole forming step for forming through-holes or blind-holes in a plate-form or sheet-form board material, and a filling step for filling a paste into through-holes or blind-holes formed in the hole forming step by using a filling means. A second paste is supplied to the paste in the filling process by using a paste supplying means to stabilized a viscosity of the paste and the paste is reliably filled into the through-holes or the blind-holes.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: March 28, 2006
    Assignee: Matushita Electric Industrial Co., Ltd.
    Inventors: Toshiaki Takenaka, Toshihiro Nishii, Yuichiro Sugita, Shinji Nakamura, Hideaki Komoda, Toshikazu Kondo
  • Publication number: 20050172483
    Abstract: It is intended to reliably form high-quality via-hole conductor with less variation, and to realize a circuit forming board having excellent connection reliability. It provides a conductive paste comprising primary particles and agglomerate of primary particles, conductive particles of 0.5 to 20 ?m in average particle diameter and 0.07 to 1.7 m2/g in specific surface area, and a binder based on thermosetting resin, and also provides an inexpensive circuit forming board with high connection reliability by using the paste.
    Type: Application
    Filed: January 21, 2004
    Publication date: August 11, 2005
    Inventors: Yuichiro Sugita, Toshiaki Takenaka
  • Patent number: 6776090
    Abstract: A circuit board with high quality is provided by preventing the falling of paste which comes around to the squeegee complementary angle side during the pattern printing or paste filling by the squeegeeing method. While lowering, the squeegee is passed through the inclined portion of a paste removing section (3) provided on a mask (2) before pattern printing or paste filling, whereby the paste on the non-printing side (complementary angle) of the squeegee can be removed; thus, a circuit board superior in quality is obtained.
    Type: Grant
    Filed: January 3, 2002
    Date of Patent: August 17, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiaki Takenaka, Toshikazu Kondo, Mitsunori Maeda, Hiroshi Tahara, Shinji Nakamura, Yuichiro Sugita
  • Publication number: 20040020046
    Abstract: The present invention provides a method for manufacturing a conductive paste. The method includes deforming conductive particles so that a deformation degree is 1.01 to 1.5 by application of a stress to the conductive particles and mixing the deformed conductive particles with a binder that includes a thermosetting resin as the main component. The deformation degree is determined by dividing an average diameter of the conductive particles after deformation by an average diameter of the conductive particles before deformation, where the average diameter is measured by a laser diffraction method. The use of this conductive paste for a prepreg sheet having limited compressibility can suppress a short circuit between via holes and the degradation of insulation properties.
    Type: Application
    Filed: June 6, 2003
    Publication date: February 5, 2004
    Inventors: Takeshi Suzuki, Satoru Tomekawa, Yosihiro Tomita, Yuichiro Sugita, Shigeru Yamane
  • Publication number: 20030138553
    Abstract: A method of manufacturing multi-layer circuit board comprising: a hole forming step for forming through-holes or blind-holes in a plate-form or sheet-form board material, and a filling step for filling a paste into through-holes or blind-holes formed in the hole forming step by using a filling means. A second paste is supplied to the paste in the filling process by using a paste supplying means to stabilized a viscosity of the paste and the paste is reliably filled into the through-holes or the blind-holes.
    Type: Application
    Filed: November 21, 2002
    Publication date: July 24, 2003
    Inventors: Toshiaki Takenaka, Toshihiro Nishii, Yuichiro Sugita, Shinji Nakamura, Hideaki Komoda, Toshikazu Kondo
  • Publication number: 20020178942
    Abstract: A circuit board with high quality is provided by preventing the falling of paste which comes around to the squeegee complementary angle side during the pattern printing or paste filling by the squeegeeing method. While lowering, the squeegee is passed through the inclined portion of a paste removing section (3) provided on a mask (2 ) before pattern printing or paste filling, whereby the paste on the non-printing side (complementary angle) of the squeegee can be removed; thus, a circuit board superior in quality is obtained.
    Type: Application
    Filed: January 3, 2002
    Publication date: December 5, 2002
    Inventors: Toshiaki Takenaka, Toshikazu Kondo, Mitsunori Maeda, Hiroshi Tahara, Shinji Nakamura, Yuichiro Sugita