Patents by Inventor Yuichiro TESHIMA
Yuichiro TESHIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230119728Abstract: An electromagnetic relay includes a housing, a movable contact piece, a first fixed terminal, and a drive device. The movable contact piece is disposed in the housing. The first fixed terminal includes a first contact portion and a first terminal portion. The first contact portion faces the movable contact piece in the housing. The first terminal portion protrudes out of the housing. The first terminal portion has a bent shape. The drive device moves the movable contact piece in a contact direction and an opening direction.Type: ApplicationFiled: September 26, 2022Publication date: April 20, 2023Inventors: Kei TAKAHASHI, Yuichiro TESHIMA, Tomohiro YAMAKITA, Koichiro MATSUSHIMA
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Publication number: 20230121441Abstract: An electromagnetic relay includes a housing, a first fixed terminal, a movable contact piece, and a drive device. The first fixed terminal includes a first main member and a first layer member. The first main member protrudes from inside the housing to outside the housing. The first layer member is provided separately from the first main member. The first layer member is laminated on the first main member. The first layer member protrudes from inside the housing to outside the housing. The first layer member has a shape branched from the first main member. The movable contact piece is disposed in the housing and faces the first fixed terminal. The drive device moves the movable contact piece in a contact direction and an opening direction.Type: ApplicationFiled: September 26, 2022Publication date: April 20, 2023Inventors: Kei TAKAHASHI, Tomohiro YAMAKITA, Yuichiro TESHIMA, Koichiro MATSUSHIMA
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Publication number: 20230109139Abstract: An electromagnetic relay includes a housing, a first fixed terminal, a movable contact piece, a drive device, and a first heat dissipation member. The first fixed terminal protrudes from inside the housing to outside the housing. The movable contact piece is disposed in the housing. The movable contact piece faces the first fixed terminal. The drive device moves the movable contact piece in a contact direction and an opening direction. The first heat dissipation member is disposed outside the housing. The first heat dissipation member is provided separately from the first fixed terminal. The first heat dissipation member is connected to the first fixed terminal.Type: ApplicationFiled: September 26, 2022Publication date: April 6, 2023Inventors: Kei TAKAHASHI, Yuichiro TESHIMA, Tomohiro YAMAKITA, Koichiro MATSUSHIMA
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Patent number: 10964504Abstract: The movable body includes a pivot and a contact portion. The pivot is rotatably supported. The contact portion is disposed at a position contactable with a contact piece. The movable body rotates around the pivot and presses the contact piece via the contact portion to move the second contact close to the first contact. The actuator presses the movable body to rotate the movable body around the pivot. The contact piece has a curved portion located between the second contact and the support. The pivot is located on a side where the support is disposed with respect to the curved portion. The actuator includes a pressing member which presses the movable body. The pressing member moves in an axial direction of the pressing member to press the movable body.Type: GrantFiled: November 16, 2016Date of Patent: March 30, 2021Assignee: OMRON CorporationInventors: Seiki Shimoda, Yuichiro Teshima, Akira Tsurusaki
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Publication number: 20200227224Abstract: The movable body includes a pivot and a contact portion. The pivot is rotatably supported. The contact portion is disposed at a position contactable with a contact piece. The movable body rotates around the pivot and presses the contact piece via the contact portion to move the second contact close to the first contact. The actuator presses the movable body to rotate the movable body around the pivot. The contact piece has a curved portion located between the second contact and the support. The pivot is located on a side where the support is disposed with respect to the curved portion. The actuator includes a pressing member which presses the movable body. The pressing member moves in an axial direction of the pressing member to press the movable body.Type: ApplicationFiled: November 16, 2016Publication date: July 16, 2020Applicant: OMRON CORPORATIONInventors: Seiki SHIMODA, Yuichiro TESHIMA, Akira TSURUSAKI
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Patent number: 10348266Abstract: An impedance conversion circuit includes an auto-transformer circuit including a first inductor connected between a first port connected on a power supply portion side and a second port connected on an antenna side and a second inductor connected between a third port that is grounded and the second port; a first phase shifter with a first end connected to the first port; an inductor connected in series between a second end of the first phase shifter and the power supply portion; and a capacitor connected in series to the inductor and connected in series between the second end of the first phase shifter and the power supply portion.Type: GrantFiled: March 1, 2016Date of Patent: July 9, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yuichiro Teshima, Kenichi Ishizuka
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Patent number: 9847299Abstract: A semiconductor package includes an interposer, a semiconductor element installed on a first surface of the interposer, bumps formed on a second surface of the interposer, and a chip component installed on the second surface of the interposer. The interposer is a silicon interposer; the semiconductor element is flip-chip mounted on the first surface of the interposer; the chip component is a thin film passive element formed by carrying out a thin film process on a silicon substrate, and a pad being formed on one surface of the thin film passive element; and the pad of the chip component is connected to a land formed on the second surface of the interposer using a conductive bonding material. According to this structure, the reliability of a bond between the interposer and the chip component of the semiconductor package can be ensured while achieving a small size.Type: GrantFiled: August 10, 2016Date of Patent: December 19, 2017Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yuichiro Teshima, Toshiyuki Nakaiso, Yutaka Takeshima
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Publication number: 20160351504Abstract: A semiconductor package includes an interposer, a semiconductor element installed on a first surface of the interposer, bumps formed on a second surface of the interposer, and a chip component installed on the second surface of the interposer. The interposer is a silicon interposer; the semiconductor element is flip-chip mounted on the first surface of the interposer; the chip component is a thin film passive element formed by carrying out a thin film process on a silicon substrate, and a pad being formed on one surface of the thin film passive element; and the pad of the chip component is connected to a land formed on the second surface of the interposer using a conductive bonding material. According to this structure, the reliability of a bond between the interposer and the chip component of the semiconductor package can be ensured while achieving a small size.Type: ApplicationFiled: August 10, 2016Publication date: December 1, 2016Inventors: Yuichiro Teshima, Toshiyuki Nakaiso, Yutaka Takeshima
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Publication number: 20160182003Abstract: An impedance conversion circuit includes an auto-transformer circuit including a first inductor connected between a first port connected on a power supply portion side and a second port connected on an antenna side and a second inductor connected between a third port that is grounded and the second port; a first phase shifter with a first end connected to the first port; an inductor connected in series between a second end of the first phase shifter and the power supply portion; and a capacitor connected in series to the inductor and connected in series between the second end of the first phase shifter and the power supply portion.Type: ApplicationFiled: March 1, 2016Publication date: June 23, 2016Inventors: Yuichiro TESHIMA, Kenichi ISHIZUKA