Abstract: A CF card (1) comprises: a casing constituted by two panel plates (2, 2) and a frame (3); and a printed wiring board (4) accommodated in the casing. A plurality of claw-like engaging parts (5) are provided to the peripheries of the panel plates (2). When the CF card (1) is assembled, the engaging parts (5) of the first panel plate (2) are inserted into through holes of a long groove (8) provided in the frame (3) and then the printed wiring board (4) is mounted on the panel plate (2) located at the inside of the frame (3). Thereafter, the engaging parts (5) of the second panel plate (2) are inserted into the through holes of the long groove (8) from the surface located in the opposite side of the frame (3). There are two types of engaging parts (5): one having lances and the other having holes. Inside the through holes, the lances of the engaging parts (5) of one panel plate (2) are inserted into the holes of the engaging parts (5) of the other panel plate (2).

Abstract: A resin molded type semiconductor device has: a semiconductor chip (12) which is mounted on a die pad portion (11) of a lead frame (9); thin metal wires (14) which connect terminals of the semiconductor chip (12) to inner lead portions (13) of the lead frame (9); and a sealing resin (15), and the lead frame (9) is subjected to an upsetting process so that a supporting portion (11) is located at a position higher than the inner lead portions (13). Since the sealing resin of a thickness corresponding to the step difference of the upsetting exists below the supporting portion, the adhesiveness between the lead frame and the sealing resin can be improved, and high reliability and thinning are realized.

Abstract: A semiconductor chip which does not increase the thickness or the board area of a semiconductor device wherein semiconductor chips are layered and does not increase the wire length between the semiconductor chips even in the case that a plurality of semiconductor chips are layered on a wiring board and a process thereof, as well as a semiconductor device, and the like, are provided.

Abstract: A liquid crystal display device includes two substrates, a liquid crystal layer sandwiched between the substrates and two alignment films, each being provided on one surface of associated one of the substrates so as to face the liquid crystal layer. The device defines multiple picture elements. At least one of the two alignment films is made of a polymer material that includes a main chain, an atomic group having a bond that is selectively cut when exposed to an actinic ray and a side chain bonded to the main chain via the atomic group. The polymer material with the side chain can give a pretilt angle of greater than 85 degrees but 90 degrees or less to liquid crystal molecules. The polymer material without the side chain can give a pretilt angle of 2 degrees to 15 degrees to the liquid crystal molecules.

Abstract: A resin molded type semiconductor device has: a semiconductor chip (12) which is mounted on a die pad portion (11) of a lead frame (9); thin metal wires (14) which connect terminals of the semiconductor chip (12) to inner lead portions (13) of the lead frame (9); and a sealing resin (15), and the lead frame (9) is subjected to an upsetting process so that a supporting portion (11) is located at a position higher than the inner lead portions (13). Since the sealing resin of a thickness corresponding to the step difference of the upsetting exists below the supporting portion, the adhesiveness between the lead frame and the sealing resin can be improved, and high reliability and thinning are realized.

Abstract: A CF card (1) comprises: a casing constituted by two panel plates (2, 2) and a frame (3); and a printed wiring board (4) accommodated in the casing. A plurality of claw-like engaging parts (5) are provided to the peripheries of the panel plates (2). When the CF card (1) is assembled, the engaging parts (5) of the first panel plate (2) are inserted into through holes of a long groove (8) provided in the frame (3) and then the printed wiring board (4) is mounted on the panel plate (2) located at the inside of the frame (3). Thereafter, the engaging parts (5) of the second panel plate (2) are inserted into the through holes of the long groove (8) from the surface located in the opposite side of the frame (3). There are two types of engaging parts (5): one having lances and the other having holes. Inside the through holes, the lances of the engaging parts (5) of one panel plate (2) are inserted into the holes of the engaging parts (5) of the other panel plate (2).

Abstract: A present invention provides a multi-layer capacitor that can be highly downsized and increased in capacity. A present invention provides a method for manufacturing the multi-layer capacitor including a process of forming a dielectric in the same vacuum chamber, a process of treating a surface of the dielectric, a process of forming a pattern in a metal electrode, a process of forming the metal electrode, and a process of treating a surface of the metal electrode. In this method, etching the dielectric layer flattens a recessed part generated by an electric insulation part.

Abstract: A liquid crystal display device comprises: a layer of a chiral liquid crystal material disposed between first and second substrates; and means for applying a voltage across the liquid crystal layer. A first region of the liquid crystal layer is an active region for display and a second region of the liquid crystal layer is a nucleation region for generating a desired liquid crystal state in the first region when a voltage is applied across the liquid crystal layer. The ratio of the thickness d of the liquid crystal layer to the pitch p of the liquid crystal material has a first value (d/p)A in the first region of the liquid crystal layer and has a second value (d/p)N different from the first value in the second region of the liquid crystal layer.

Abstract: A semiconductor chip which does not increase the thickness or the board area of a semiconductor device wherein semiconductor chips are layered and does not increase the wire length between the semiconductor chips even in the case that a plurality of semiconductor chips are layered on a wiring board and a process thereof, as well as a semiconductor device, and the like, are provided.

Abstract: A semiconductor chip which does not increase the thickness or the board area of a semiconductor device wherein semiconductor chips are layered and does not increase the wire length between the semiconductor chips even in the case that a plurality of semiconductor chips are layered on a wiring board and a process thereof, as well as a semiconductor device, and the like, are provided.

Abstract: A present invention provides a multi-layer capacitor that can be highly downsized and increased in capacity. A present invention provides a method for manufacturing the multi-layer capacitor including a process of forming a dielectric in the same vacuum chamber, a process of treating a surface of the dielectric, a process of forming a pattern in a metal electrode, a process of forming the metal electrode, and a process of treating a surface of the metal electrode. In this method, etching the dielectric layer flattens a recessed part generated by an electric insulation part.

Abstract: The resin-sealed semiconductor device includes a die pad portion, a semiconductor element mounted on the die pad portion and having electrodes, a plurality of lead portions arranged with their respective tips facing the die pad portion, thin metal wires for connecting the electrodes of the semiconductor element to the lead portions, and a sealing resin for sealing the die pad portion, the semiconductor element, the lead portions and connection regions of the thin metal wires except a bottom surface of the die pad portion and respective bottom surfaces and terminal ends of the lead portions. The terminal ends of the lead portions are approximately flush with a side surface of the sealing resin. The die pad portion has a first recess formed in an outer periphery of the bottom surface thereof.

Abstract: An object of the present invention is to provide a prophylactic or ameliorative agent for insulin resistance and/or obesity based on a new concept, and a screening method therefor.

Abstract: The liquid crystal display device of the present invention includes a first substrate, a second substrate placed to face the first substrate, and a liquid crystal layer interposed between the first and second substrates. The liquid crystal layer includes: a splay-aligned region in which a transformation from splay alignment to bend alignment or from bend alignment to splay alignment occurs according to a voltage applied; and a nucleation region serving as a nucleation site for initiating the transformation to occur in the splay-aligned region. The nucleation region includes a plurality of first nucleation regions each extending in a first direction and a plurality of second nucleation regions each extending in a second direction different from the first direction. The splay-aligned region includes a plurality of first splay-aligned regions having a first width in the second direction and a plurality of second splay-aligned regions having a second width smaller than the first width in the second direction.

Abstract: A CF card (1) comprises: a casing constituted by two panel plates (2, 2) and a frame (3); and a printed wiring board (4) accommodated in the casing. A plurality of claw-like engaging parts (5) are provided to the peripheries of the panel plates (2). When the CF card (1) is assembled, the engaging parts (5) of the first panel plate (2) are inserted into through holes of a long groove (8) provided in the frame (3) and then the printed wiring board (4) is mounted on the panel plate (2) located at the inside of the frame (3). Thereafter, the engaging parts (5) of the second panel plate (2) are inserted into the through holes of the long groove (8) from the surface located in the opposite side of the frame (3). There are two types of engaging parts (5): one having lances and the other having holes. Inside the through holes, the lances of the engaging parts (5) of one panel plate (2) are inserted into the holes of the engaging parts (5) of the other panel plate (2).

Abstract: A liquid crystal display device includes two substrates, a liquid crystal layer sandwiched between the substrates and two alignment films, each being provided on one surface of associated one of the substrates so as to face the liquid crystal layer. The device defines multiple picture elements. At least one of the two alignment films is made of a polymer material that includes a main chain, an atomic group having a bond that is selectively cut when exposed to an actinic ray and a side chain bonded to the main chain via the atomic group. The polymer material with the side chain can give a pretilt angle of greater than 85 degrees but 90 degrees or less to liquid crystal molecules. The polymer material without the side chain can give a pretilt angle of 2 degrees to 15 degrees to the liquid crystal molecules.

Abstract: A project management system is disclosed which is easy to use by members belonging to a project and other persons. The system comprises a server 2 and a DB 3 which stores project by project, contents belonging to those projects participated in by some or all of users. The server 2 comprises a communication controller 4 for transmitting prescribed pages to user terminals 1 and receiving operation messages from the pages, a project desktop sheet generator 10 for reading out contents data from the database 3 in response to those operation messages and generating pages for displaying or accessing all the contents belonging to those projects, project by project, as project desktop sheets, and an access controller 12 for controlling communications with user terminals, when there has been an access made via the communication controller 4 for the content of the contents, in unit of project desktop.

Abstract: The resin-sealed semiconductor device includes a die pad portion, a semiconductor element mounted on the die pad portion and having electrodes, a plurality of lead portions arranged with their respective tips facing the die pad portion, thin metal wires for connecting the electrodes of the semiconductor element to the lead portions, and a sealing resin for sealing the die pad portion, the semiconductor element, the lead portions and connection regions of the thin metal wires except a bottom surface of the die pad portion and respective bottom surfaces and terminal ends of the lead portions. The terminal ends of the lead portions are approximately flush with a side surface of the sealing resin.

Abstract: The present invention provides a printed wiring board, an IC card module including the printed wiring board, and a method for fabricating the IC card module, for improving reliability of IC cards. The printed wiring board and the IC card module of the invention include: a base having a resin sealing region, clamped regions in a periphery zone of the resin sealing region clamped with a sealing mold, and non-clamped regions in the periphery zone; and terminals for external connection formed on the top surface of the base. The terminals are formed in a region other than any of the resin sealing region, the clamped regions, and the non-claimed regions.

Abstract: A semiconductor chip which does not increase the thickness or the board area of a semiconductor device wherein semiconductor chips are layered and does not increase the wire length between the semiconductor chips even in the case that a plurality of semiconductor chips are layered on a wiring board and a process thereof, as well as a semiconductor device, and the like, are provided.