Patents by Inventor Yuiti Kaiya

Yuiti Kaiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device, and lead frame used therefor
    Patent number: 6005287
    Abstract: A semiconductor device in which a flat inner lead is connected to a semiconductor pellet so that a side edge of the inner lead is connected to the semiconductor pellet. The lead includes a constricted portion that is twisted so that the side edge faces a surface of the pellet to which the lead is connected. A lead frame is arranged so that the side edge can be twisted into position.
    Type: Grant
    Filed: November 4, 1996
    Date of Patent: December 21, 1999
    Assignee: NEC Corporation
    Inventors: Yuiti Kaiya, Takehiko Takahashi, Takemitu Sato