Patents by Inventor YuJeong Jang
YuJeong Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240063194Abstract: A semiconductor device has a first semiconductor package, second semiconductor package, and RDL. The first semiconductor package is disposed over a first surface of the RDL and the second semiconductor package is disposed over a second surface of the RDL opposite the first surface of the RDL. A carrier is initially disposed over the second surface of the RDL and removed after disposing the first semiconductor package over the first surface of the RDL. The first semiconductor package has a substrate, plurality of conductive pillars formed over the substrate, electrical component disposed over the substrate, and encapsulant deposited around the conductive pillars and electrical component. A shielding frame can be disposed around the electrical component. An antenna can be disposed over the first semiconductor package. A portion of the encapsulant is removed to planarize a surface of the encapsulant and expose the conductive pillars.Type: ApplicationFiled: August 17, 2022Publication date: February 22, 2024Applicant: STATS ChipPAC Pte. Ltd.Inventors: GunHyuck Lee, Yujeong Jang, Gayeun Kim, YoungUk Noh
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Patent number: 11862478Abstract: A semiconductor device has a semiconductor package including a substrate with a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A metal mask having a fiducial marker is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after forming the shielding layer.Type: GrantFiled: June 14, 2022Date of Patent: January 2, 2024Inventors: ChangOh Kim, KyoungHee Park, JinHee Jung, OMin Kwon, JiWon Lee, YuJeong Jang
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Publication number: 20230386888Abstract: A method for making semiconductor devices includes: attaching a substrate with a plurality of electronic components onto a composite tape having an adhesive layer which is sensitive to ultraviolet (UV) irradiation and a UV-transparent base film, wherein the substrate is attached onto the adhesive layer of the composite tape; placing the substrate and the composite tape on a UV-transparent carrier, wherein the UV-transparent carrier is in contact with the UV-transparent base film of the composite tape; singulating the substrate into a plurality of semiconductor devices each having one of the plurality of electronic components; depositing a shielding material on the plurality of semiconductor devices to form a shielding layer on each of the plurality of semiconductor devices; irradiating a UV light to the composite tape through the UV-transparent carrier to reduce adhesivity of the adhesive layer; and detaching the plurality of semiconductor devices from the UV-transparent carrier.Type: ApplicationFiled: May 15, 2023Publication date: November 30, 2023Inventors: GunHyuck LEE, Yujeong JANG
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Publication number: 20230378088Abstract: An apparatus for selectively forming a shielding layer on a semiconductor package is provided. The apparatus includes: a tray including a plurality of package seats, the tray defines, for each of the plurality of package seats, one or more sets of guide holes outside the package seat; deposition masks, each of the deposition masks includes: a set of pins releasably inserted within one set of the one or more sets of guide holes to place the deposition mask on the tray; and a cover attached to the set of pins, the cover is configured to cover at least a portion of an outer surface of a semiconductor package received within a package seat when the set of pins is inserted within the set of guide holes associated with the package seat; and a deposition source configured to deposit a shielding material.Type: ApplicationFiled: May 10, 2023Publication date: November 23, 2023Inventors: GunHyuck LEE, Yujeong JANG
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Publication number: 20230369241Abstract: A semiconductor device is formed by providing a semiconductor package including a shielding layer and forming a slot in the shielding layer using a laser. The laser is turned on and exposed to the shielding layer with a center of the laser disposed over a first point of the shielding layer. The laser is moved in a loop while the laser remains on and exposed to the shielding layer. Exposure of the laser to the shielding layer is stopped when the center of the laser is disposed over a second point of the shielding layer. A distance between the first point and the second point is approximately equal to a radius of the laser.Type: ApplicationFiled: July 26, 2023Publication date: November 16, 2023Applicant: STATS ChipPAC Pte. Ltd.Inventors: ChangOh Kim, JinHee Jung, JiWon Lee, YuJeong Jang
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Patent number: 11756897Abstract: A semiconductor device is formed by providing a semiconductor package including a shielding layer and forming a slot in the shielding layer using a laser. The laser is turned on and exposed to the shielding layer with a center of the laser disposed over a first point of the shielding layer. The laser is moved in a loop while the laser remains on and exposed to the shielding layer. Exposure of the laser to the shielding layer is stopped when the center of the laser is disposed over a second point of the shielding layer. A distance between the first point and the second point is approximately equal to a radius of the laser.Type: GrantFiled: May 5, 2021Date of Patent: September 12, 2023Assignee: STATS ChipPAC Pte. Ltd.Inventors: ChangOh Kim, JinHee Jung, JiWon Lee, YuJeong Jang
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Publication number: 20230275034Abstract: A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.Type: ApplicationFiled: April 19, 2023Publication date: August 31, 2023Applicant: STATS ChipPAC Pte. Ltd.Inventors: HunTeak Lee, KyungHwan Kim, HeeSoo Lee, ChangOh Kim, KyoungHee Park, JinHee Jung, OMin Kwon, JiWon Lee, YuJeong Jang
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Publication number: 20230238376Abstract: A semiconductor device has a first semiconductor package including a substrate and an encapsulant deposited over the substrate. An adhesive tape is disposed on the encapsulant. A conductive via is formed by trench cutting through the adhesive tape and encapsulant to expose the substrate. A second semiconductor package is disposed over the adhesive tape opposite the first semiconductor package. The first semiconductor package and second semiconductor package are bonded together by the adhesive tape.Type: ApplicationFiled: January 26, 2022Publication date: July 27, 2023Applicant: STATS ChipPAC Pte. Ltd.Inventors: GunHyuck Lee, SangHyun Son, Yujeong Jang, Hyeoneui Lee
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Publication number: 20230215812Abstract: A semiconductor device has a substrate and a slot formed in the substrate. A first electrical component is disposed over the substrate adjacent to the slot. An encapsulant is deposited over the first electrical component with a surface of the encapsulant coplanar to a surface of the substrate within the slot. A shielding layer is formed over the encapsulant and physically contacting the surface of the substrate within the slot. The substrate is singulated to form a semiconductor package with the first electrical component after forming the shielding layer.Type: ApplicationFiled: January 5, 2022Publication date: July 6, 2023Applicant: STATS ChipPAC Pte. Ltd.Inventors: JinHee Jung, ChangOh Kim, JiWon Lee, YuJeong Jang
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Publication number: 20230215721Abstract: A semiconductor manufacturing equipment has a support platform and a substrate disposed over the support platform. A first electrical component is disposed over a first surface of the substrate. A second electrical component is disposed over a second surface of the substrate opposite the first surface of the substrate. A suction hood is disposed over the substrate. A gas is introduced over the substrate to circulate residue while drawing the residue vertically into the suction hood. The gas can be introduced with a gas nozzle or air knife. The gas can be introduced from a gas conduit disposed at least partially around the substrate. The gas conduit can extend completely around the substrate. The gas nozzles are sequentially placed around the gas conduit. The gas can be a stable or inert gas. The residue is displaced away from the second electrical component.Type: ApplicationFiled: January 5, 2022Publication date: July 6, 2023Applicant: STATS ChipPAC Pte. Ltd.Inventors: ChangOh Kim, JinHee Jung, YuJeong Jang, JiWon Lee
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Publication number: 20230207485Abstract: A semiconductor device has a semiconductor package including a substrate comprising a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A fanged metal mask is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The fanged metal mask is removed after forming the shielding layer.Type: ApplicationFiled: February 27, 2023Publication date: June 29, 2023Applicant: STATS ChipPAC Pte. Ltd.Inventors: ChangOh Kim, KyoungHee Park, JinHee Jung, OMin Kwon, JiWon Lee, YuJeong Jang
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Patent number: 11664327Abstract: A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.Type: GrantFiled: November 17, 2020Date of Patent: May 30, 2023Assignee: STATS ChipPAC Pte. Ltd.Inventors: HunTeak Lee, KyungHwan Kim, HeeSoo Lee, ChangOh Kim, KyoungHee Park, JinHee Jung, OMin Kwon, JiWon Lee, YuJeong Jang
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Patent number: 11616025Abstract: A semiconductor device has a semiconductor package including a substrate comprising a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A fanged metal mask is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The fanged metal mask is removed after forming the shielding layer.Type: GrantFiled: December 18, 2020Date of Patent: March 28, 2023Assignee: STATS ChipPAC Pte. Ltd.Inventors: ChangOh Kim, KyoungHee Park, JinHee Jung, OMin Kwon, JiWon Lee, YuJeong Jang
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Publication number: 20220367381Abstract: A semiconductor device has a substrate and electrical components disposed over the substrate. An encapsulant is disposed over the substrate and electrical components. A multi-layer shielding structure is formed over the encapsulant. The multi-layer shielding structure has a first layer of ferromagnetic material and second layer of a protective layer or conductive layer. The ferromagnetic material can be iron, nickel, nickel iron alloy, iron silicon alloy, silicon steel, nickel iron molybdenum alloy, nickel iron molybdenum copper alloy, iron silicon aluminum alloy, nickel zinc, manganese zinc, other ferrites, amorphous magnetic alloy, amorphous metal alloy, or nanocrystalline alloy. The first layer can be a single, homogeneous material. The protective layer can be stainless steel, tantalum, molybdenum, titanium, nickel, or chromium. The conductive layer can be copper, silver, gold, or aluminum.Type: ApplicationFiled: May 11, 2021Publication date: November 17, 2022Applicant: STATS ChipPAC Pte. Ltd.Inventors: ChangOh Kim, JinHee Jung, JiWon Lee, YuJeong Jang
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Publication number: 20220359419Abstract: A semiconductor device is formed by providing a semiconductor package including a shielding layer and forming a slot in the shielding layer using a laser. The laser is turned on and exposed to the shielding layer with a center of the laser disposed over a first point of the shielding layer. The laser is moved in a loop while the laser remains on and exposed to the shielding layer. Exposure of the laser to the shielding layer is stopped when the center of the laser is disposed over a second point of the shielding layer. A distance between the first point and the second point is approximately equal to a radius of the laser.Type: ApplicationFiled: May 5, 2021Publication date: November 10, 2022Applicant: STATS ChipPAC Pte. Ltd.Inventors: ChangOh Kim, JinHee Jung, JiWon Lee, YuJeong Jang
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Publication number: 20220310408Abstract: A semiconductor device has a semiconductor package including a substrate with a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A metal mask having a fiducial marker is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after forming the shielding layer.Type: ApplicationFiled: June 14, 2022Publication date: September 29, 2022Applicant: STATS ChipPAC Pte. Ltd.Inventors: ChangOh Kim, KyoungHee Park, JinHee Jung, OMin Kwon, JiWon Lee, YuJeong Jang
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Patent number: 11393698Abstract: A semiconductor device has a semiconductor package including a substrate with a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A metal mask having a fiducial marker is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after forming the shielding layer.Type: GrantFiled: December 18, 2020Date of Patent: July 19, 2022Assignee: STATS ChipPAC Pte. Ltd.Inventors: ChangOh Kim, KyoungHee Park, JinHee Jung, OMin Kwon, JiWon Lee, YuJeong Jang
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Publication number: 20220199423Abstract: A semiconductor device has a semiconductor package including a substrate with a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A metal mask having a fiducial marker is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after forming the shielding layer.Type: ApplicationFiled: December 18, 2020Publication date: June 23, 2022Applicant: STATS ChipPAC Pte. Ltd.Inventors: ChangOh Kim, KyoungHee Park, JinHee Jung, OMin Kwon, JiWon Lee, YuJeong Jang
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Publication number: 20220199545Abstract: A semiconductor device has a semiconductor package including a substrate comprising a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A fanged metal mask is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The fanged metal mask is removed after forming the shielding layer.Type: ApplicationFiled: December 18, 2020Publication date: June 23, 2022Applicant: STATS ChipPAC Pte. Ltd.Inventors: ChangOh Kim, KyoungHee Park, JinHee Jung, OMin Kwon, JiWon Lee, YuJeong Jang
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Publication number: 20220157739Abstract: A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.Type: ApplicationFiled: November 17, 2020Publication date: May 19, 2022Applicant: STATS ChipPAC Pte. Ltd.Inventors: HunTeak Lee, KyungHwan Kim, HeeSoo Lee, ChangOh Kim, KyoungHee Park, JinHee Jung, OMin Kwon, JiWon Lee, YuJeong Jang