Abstract: A light emitting element of one or more embodiments includes a first electrode, a second electrode oppositely to the first electrode, and an emission layer between the first electrode and the second electrode. The light emitting element of one or more embodiments includes a polycyclic compound represented by a specific chemical structure in the emission layer, thereby showing improved emission efficiency and life characteristics.

Abstract: A lower chip is fixed to a surface of an interposer by flip-chip bonding with an under fill acting as an adhesive applied to the surface. A lifted pad having a height of approximately 10 ?m is provided on the surface of the interposer. A bonding wire connects the lifted pad and a bonding pad provided on a surface of an upper chip. A stick-out portion of the under fill at the time of fixing the lower chip to the interposer is dammed by the lifted portion of the lifted pad. This prevents the stick-out portion of the under fill from covering the top of the lifted pad.

Abstract: A semiconductor device of MCP structure, in which multiple semiconductor chips are provided in a single package and a method of manufacturing the same, that prevents damage of semiconductor chip that does not require burn-in and ensures the initial reliability of the semiconductor chip that requires the burn-in, are provided. The method has the steps of resin sealing and packaging the semiconductor chip that requires the burn-in and performing the burn-in to such packaged semiconductor chip; and mounting the semiconductor chip evaluated to be non-defective in the burn-in to the substrate along with the semiconductor chip not requiring the burn-in.

Abstract: In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first semiconductor chip by flip-chip bonding. A second semiconductor chip is secured onto the printed circuit board. The second semiconductor chip is connected to the flexible printed wiring board by wire bonding. The first semiconductor chip is connected to the flexible printed wiring board by wire bonding via the printed circuit board.

Abstract: In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first semiconductor chip by flip-chip bonding. A second semiconductor chip is secured onto the printed circuit board. The second semiconductor chip is connected to the flexible printed wiring board by wire bonding. The first semiconductor chip is connected to the flexible printed wiring board by wire bonding via the printed circuit board.

Abstract: A semiconductor device of MCP structure, in which multiple semiconductor chips are provided in a single package and a method of manufacturing the same, that prevents damage of semiconductor chip that does not require burn-in and ensures the initial reliability of the semiconductor chip that requires the burn-in, are provided. The method has the steps of resin sealing and packaging the semiconductor chip that requires the burn-in and performing the burn-in to such packaged semiconductor chip; and mounting the semiconductor chip evaluated to be non-defective in the burn-in to the substrate along with the semiconductor chip not requiring the burn-in.

Abstract: In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first semiconductor chip by flip-chip bonding. A second semiconductor chip is secured onto the printed circuit board. The second semiconductor chip is connected to the flexible printed wiring board by wire bonding. The first semiconductor chip is connected to the flexible printed wiring board by wire bonding via the printed circuit board.

Abstract: In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first semiconductor chip by flip-chip bonding. A second semiconductor chip is secured onto the printed circuit board. The second semiconductor chip is connected to the flexible printed wiring board by wire bonding. The first semiconductor chip is connected to the flexible printed wiring board by wire bonding via the printed circuit board.

Abstract: A semiconductor device includes a substrate provided with a plurality of leads, a face-down semiconductor element provided on one surface of the substrate, a first stacked semiconductor element and a second stacked semiconductor element provided on another surface of the substrate and connected to the substrate by wires, and an extended wiring mechanism for connecting electrodes of the face-down semiconductor element and electrodes of the first and second semiconductor elements. The connected electrodes are equi-electrodes whose electrical characteristics are equal.

Abstract: A semiconductor device includes the first through third semiconductor devices which are stacked on a substrate and the first through third wires for connecting the semiconductor elements and the substrate. The first wires serve to connect electrodes of the first semiconductor element positioned uppermost and electrodes of the second semiconductor element. The second wires serve to connect the electrodes of the second semiconductor element and electrodes of the third semiconductor element. The third wires serve to connect the electrodes of the third semiconductor element and bonding pads of the substrate. Between the first wires and the electrodes of the second semiconductor element and between the second wires and the electrodes of the third semiconductor element, stud bumps are provided so as to form space therebetween, thereby avoiding short-circuits therebetween.

Abstract: A semiconductor device is provided. This semiconductor device includes a resin package, a semiconductor chip, and leads consisting of inner leads and outer leads. The rear surface of the semiconductor chip and the inner leads are situated substantially on the same plane. The resin package is provided with notches on its mounting surface. The outer leads are bent inward along the exterior of the resin package and pulled around to the mounting surface, so that the edges of the outer leads are engaged with the notches.

Abstract: In chucking, a workpiece is clamped while drawn to the chuck body for positive contact of the workpiece to stoppers, whereby a degree of machining accuracy is remarkably improved.