Patents by Inventor Yuji ASAHINA

Yuji ASAHINA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermosetting resin composition, cured film and method for producing same, and flexible printed board with cured film and method for producing same
    Patent number: 10975263
    Abstract: A thermosetting resin composition contains an epoxy resin, a curing accelerator, a compound having a (meth) acryloyl group, and a compound having an acidic functional group and a weight average molecular weight of 1000 or more. The thermosetting resin composition may further contain a phosphorus-based flame retardant, organic spherical beads, and the like. The thermosetting resin composition preferably substantially does not contain a photopolymerization initiator and a thermal polymerization initiator. The thermosetting resin composition can be used, for example, for forming a cured film on a flexible printed wiring board.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: April 13, 2021
    Assignee: KANEKA CORPORATION
    Inventors: Masayoshi Kido, Tetsuya Kogiso, Tomohiro Koda, Yuji Asahina
  • PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME
    Publication number: 20200045833
    Abstract: A printed wiring board has conductor patterns (12) having a thickness (t1) of 50 ?m or more on an insulating substrate (11). An insulating layer (5) is provided in regions (L) on the conductor patterns and on the insulating substrate in regions (S) between the conductor patterns. A thickness (tL) of the insulating layer on the conductor patterns is preferably 0.1-1 times the conductor thickness (t1). The insulating layer is formed on the conductor patterns and on the insulating substrate between the conductor patterns by printing a resin composition using screen printing and then curing the resin composition. The resin composition has a viscosity of 50-300 P at 25° C. and a thixotropic index of 1.1-3.5. A screen printing plate used for screen printing has a mesh thickness of 2.2 or more times a yarn diameter of yarns.
    Type: Application
    Filed: April 17, 2017
    Publication date: February 6, 2020
    Applicant: KANEKA CORPORATION
    Inventors: Yuji ASAHINA, Tetsuya KOGISO, Tomohiro KODA, Masayoshi KIDO
  • THERMOSETTING RESIN COMPOSITION, CURED FILM AND METHOD FOR PRODUCING SAME, AND FLEXIBLE PRINTED BOARD WITH CURED FILM AND METHOD FOR PRODUCING SAME
    Publication number: 20190161638
    Abstract: A thermosetting resin composition contains an epoxy resin, a curing accelerator, a compound having a (meth) acryloyl group, and a compound having an acidic functional group and a weight average molecular weight of 1000 or more. The thermosetting resin composition may further contain a phosphorus-based flame retardant, organic spherical beads, and the like. The thermosetting resin composition preferably substantially does not contain a photopolymerization initiator and a thermal polymerization initiator. The thermosetting resin composition can be used, for example, for forming a cured film on a flexible printed wiring board.
    Type: Application
    Filed: April 21, 2017
    Publication date: May 30, 2019
    Applicant: KANEKA CORPORATION
    Inventors: Masayoshi KIDO, Tetsuya KOGISO, Tomohiro KODA, Yuji ASAHINA