Patents by Inventor Yuji Ikegami

Yuji Ikegami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Production process of ferrite stainless steel covered with oxide whisker
    Patent number: 5017544
    Abstract: This invention concerns a production process of ferrite stainless steel covered with oxide whisker suitable for metal catalyst supports in automobile's exhaust gas converters, which comprises plating a ferrite stainless steel with aluminum, diffusing the aluminum into the stainless steel by heating in vacuum or in a non-oxidizing gas so that the surface of the ferrite stainless steel turns into an aluminum-enriched ferrite phase, and allowing oxide whisker to grow there by heating in the air.
    Type: Grant
    Filed: November 29, 1988
    Date of Patent: May 21, 1991
    Assignee: Nippon Yakin Kogyo Co., Ltd.
    Inventors: Yuji Ikegami, Shinichi Sasayama, Noboru Tachino, Takeshi Kamiya
  • Catalyst support for catalytic reactors
    Patent number: 5002923
    Abstract: Disclosed is a catalyst support for catalytic reactors for cleaning exhaust gas, characterized in that flat steel band plates and corrugated steel band plates, each of which is heat-resistance and covered with catalyst, are superposed in such a way that one comes on top of the other alternately, and brazed together on their center line running along the longitudinal direction thereof.
    Type: Grant
    Filed: July 21, 1989
    Date of Patent: March 26, 1991
    Assignee: Nippon Yakin Kogyo Co., Ltd.
    Inventors: Yoshikazu Koshiba, Takeshi Kamiya, Yuji Ikegami, Noboru Tachino
  • Mechanical plating process
    Patent number: 4987000
    Abstract: This invention concerns a mechanical plating process comprising: shaving metal off from a pure metal or alloy block and plating an object to be plated with the shaved off metal by the use of at least a single metal brush, wherein the metal block and the metal brush are in frictional contact with each other, and the object to be plated and the metal brush are concurrently in frictional contact with each other.
    Type: Grant
    Filed: December 12, 1988
    Date of Patent: January 22, 1991
    Assignee: Nippon Yakin Kogyo Co., Ltd.
    Inventors: Yoshikazu Koshiba, Yuji Ikegami, Noboru Tachino, Takeshi Kamiya
  • Circuit board
    Patent number: 4677252
    Abstract: A circuit board comprises a rigid metal substrate, a conductive metal layer formed into a predetermined circuit pattern, and a resinous layer interposed between the metal substrate and the metal layer for electrically insulating and bonding the metal substrate and the metal layer, the conductive metal layer having an elongation at break of not less than 15%, and the resinous layer comprising a first resinous layer having a volume resistivity of not less than 10.sup.10 .OMEGA.. cm, and a second resinous layer having an elongation at break of not less than 100%. The circuit board has a desired dielectric strength between the metal substrate and the conductive metal layer and can be bent without resulting disconnection in the metal layer or the like.
    Type: Grant
    Filed: November 18, 1986
    Date of Patent: June 30, 1987
    Assignee: Sony Corporation
    Inventors: Satoshi Takahashi, Akira Tsutsumi, Junji Suzuki, Hiroshi Kumakura, Takao Ito, Kenji Ohsawa, Yuji Ikegami, Muneyuki Haruki, Nobuyuki Yasuda, Masayuki Ohta