Patents by Inventor Yuji Ikezawa

Yuji Ikezawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050209385
    Abstract: Disclosed is an electrically conductive composite including (A) electrically conductive fibers, (B) fibrous or rod-shaped low-melting metal which has a melting point lower than that of component (A) and is free of lead, and (C) a thermoplastic resin, the electrically conductive composite including a composite fiber bundle containing component (A) and component (B), the composite fiber bundle being covered with component (C), wherein in the electrically conductive composite, the ratios of the weights of components (A), (B) and (C) to the combined weight of components (A), (B) and (C) are 50-95% by weight for component (A), 4-40% by weight for component (B) and 1-20% by weight for component (C), wherein in the electrically conductive composite, the weight ratio of component (B) to component (A) is 0.31-0.8, and wherein in the composite fiber bundle, component (B) is enclosed in a bundle of component (A).
    Type: Application
    Filed: March 18, 2005
    Publication date: September 22, 2005
    Applicant: Sumitomo Chemical Company, Limited
    Inventors: Kenichi Higashi, Takashi Fujimoto, Yuji Ikezawa
  • Patent number: 5624991
    Abstract: A polypropylene resin composition, which exhibits an excellent coating adherence, high rigidity, high impact strength at low temperatures, prominent heat resistance and excellent appearance of moldings even without effecting a treatment with trichloroethane as a pretreatment step before coating, comprises 30 to 92% by weight crystalline ethylene propylene block copolymer (A), 5 to 30% by weight ethylene-.alpha. olefin copolymer rubber (B), 3 to 20% by weight ethylene-butene-1 copolymer (C) having the following characteristics:(C1) a density of 0.870 to 0.915 g/cm.sup.3,(C2) a melt index at 190.degree. C. of 5 to 30 g/10 minutes, and(C3) a melt peak at 100.degree. C. or higher as determined in the thermogram with increasing temperature by a Differential Scanning Calorimeter (DSC),and 0 to 20% by weight inorganic filler (D).
    Type: Grant
    Filed: October 24, 1994
    Date of Patent: April 29, 1997
    Assignee: Sumitomo Chemical Company Limited.
    Inventors: Hiroyuki Harada, Yuji Ikezawa, Susumu Kanzaki, Hideo Shinonaga, Satoru Sogabe
  • Patent number: 5556910
    Abstract: A polypropylene resin composition, which exhibits an excellent coating adherence, high rigidity, high impact strength at low temperatures, prominent heat resistance and excellent appearance of moldings as required for coatings on the exterior parts of automobiles even without effecting a treatment with trichloroethane as pretreatment step before coating and without a primer as undercoating and which can be baked at a temperature of 130.degree. C. or higher, comprises 15 to 92% by weight crystalline ethylene propylene block copolymer, 5 to 40% by weight ethylene propylene copolymer rubber, 1 to 15% by weight polypropylene oligomer containing hydroxyl group, and 2 to 30% by weight inorganic filler.
    Type: Grant
    Filed: October 18, 1994
    Date of Patent: September 17, 1996
    Assignee: Sumitomo Chemical Company Limited.
    Inventors: Hiroyuki Harada, Yuji Ikezawa, Susumu Kanzaki, Hideo Shinonaga, Satoru Sogabe
  • Patent number: 5494948
    Abstract: A mica-reinforced propylene resin composition having a volatile matter at 105.degree. C of 0.12% or less is obtained by heating and melting a mixture containing (A) a crystalline polypropylene, (B) mica treated with an organosilane compound, (C) a bismaleimide compound, and (D) an organic peroxide. It has excellent stiffness, heat resistance and dimensional stability, does not corrode a mold, and does not exhale an irritating odor during molding.
    Type: Grant
    Filed: September 26, 1994
    Date of Patent: February 27, 1996
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Taichi Nishio, Yuji Ikezawa
  • Patent number: 4604421
    Abstract: A resin composition is provided which comprises a crystalline propylene-ethylene copolymer resin mixed with mica having a specified average particle diameter and particle size distribution or a rubber-like material so that it shows an excellent balance between rigidity and impact strength and an excellent thermal resistance and provides an excellent appearance when formed in products. In a preferred embodiment, the polypropylene resin composition comprises 50 to 97% by weight of a crystalline propylene-ethylene copolymer resin, 0 to 20% by weight of a rubber-like material, and 3 to 50% by weight of mica having an average particle diameter determined by photo extinction sedimentation method of 0.5 to 4.5.mu. and a particle size distribution of 95% or more by weight for 10.mu. or less, 60% or more by weight for 5.mu. or less, and 10 to 80% by weight for 1.mu. or less.
    Type: Grant
    Filed: March 26, 1985
    Date of Patent: August 5, 1986
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Tatsuyuki Mitsuno, Teruhisa Koyama, Yuji Ikezawa
  • Patent number: 4094854
    Abstract: Polyolefin compositions comprising (I) crystalline polyolefin and (II) a mixture of inorganic fillers 5 to 45% by weight based on the total weight of said polyolefin and mixture, said mixture comprising (1) 40 to 95% by weight of a powder of a mixture of predominant calcium metasilicate and 0.2 to 20% by weight of calcium carbonate, said powder being in the long and narrow shape and more than 98% by weight thereof being passable through a 200-mesh Tyler's standard sieve, and (2) 60 to 5% by weight of hydrated magneium silicate powder which is passable through a 325-mesh Tyler's standard sieve.
    Type: Grant
    Filed: March 24, 1977
    Date of Patent: June 13, 1978
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Taro Harada, Taisuke Okita, Takahisa Hara, Yuji Ikezawa