Abstract: A wiring board assembly (1) includes: a flexible printed wiring board (2) which includes at least an insulating substrate (5) including a through-hole (53), and wiring patterns (61) and (62) provided on the insulating substrate (5) and extending to peripheral edge portions (531n) and (532n) of the through-hole (53); a metal reinforcing plate (3) attached to the flexible printed wiring board (2) and facing the through-hole (53); and a solder connection portion (4) covering an inner wall surface (534) of the through-hole (53) and electrically connecting the wiring patterns (61) and (62) to the metal reinforcing plate (3).

Abstract: A wiring board assembly (1) includes: a flexible printed wiring board (2) which includes at least an insulating substrate (5) including a through-hole (53), and wiring patterns (61) and (62) provided on the insulating substrate (5) and extending to peripheral edge portions (531n) and (532n) of the through-hole (53); a metal reinforcing plate (3) attached to the flexible printed wiring board (2) and facing the through-hole (53); and a solder connection portion (4) covering an inner wall surface (534) of the through-hole (53) and electrically connecting the wiring patterns (61) and (62) to the metal reinforcing plate (3).

Abstract: A multi-layer circuit board having a connector portion of an inner layer substrate being exposed, the multi-layer circuit board comprising: an inner layer substrate in which an inner layer circuit is formed, the inner layer circuit including the connector portion; and an outer layer substrate having an outer layer circuit formed on an insulating layer and having a region corresponding to the connector portion peeled off, an inner layer circuit side of the inner layer substrate and an insulating layer side of the outer layer substrate being adhered to one another via an adhesive layer so as to face one another, and a conductor layer other than the connector portion of the inner layer circuit being adhered to the outer layer substrate directly by the adhesive layer.

Abstract: A method for manufacturing a wiring board comprising an insulating member, comprising: a penetrating hole formation process of forming a penetrating hole in the insulating member; a placement process of inserting a conductive connecting particle into the penetrating hole; a connecting particle pressing process of disposing the conductive layers on both surfaces of the insulating member, pressing the conductive layers toward the connecting particle in the penetrating hole, and deforming the connecting particle in the pressing direction to obtain the connecting member; and a patterning process of patterning the conductive layers, wherein, in the connecting particle pressing process, the pressing is performed such that the cross-sectional area in the direction along the insulating member surface of at least a portion of the connecting member is greater than the contact area of the connecting member with the conductive layers.

Abstract: A method for manufacturing a wiring board comprising an insulating member, comprising: a penetrating hole formation process of forming a penetrating hole in the insulating member; a placement process of inserting a conductive connecting particle into the penetrating hole; a connecting particle pressing process of disposing the conductive layers on both surfaces of the insulating member, pressing the conductive layers toward the connecting particle in the penetrating hole, and deforming the connecting particle in the pressing direction to obtain the connecting member; and a patterning process of patterning the conductive layers, wherein, in the connecting particle pressing process, the pressing is performed such that the cross-sectional area in the direction along the insulating member surface of at least a portion of the connecting member is greater than the contact area of the connecting member with the conductive layers.

Abstract: A method for manufacturing a wiring board comprising an insulating member, comprising: a penetrating hole formation process of forming a penetrating hole in the insulating member; a placement process of inserting a conductive connecting particle into the penetrating hole; a connecting particle pressing process of disposing the conductive layers on both surfaces of the insulating member, pressing the conductive layers toward the connecting particle in the penetrating hole, and deforming the connecting particle in the pressing direction to obtain the connecting member; and a patterning process of patterning the conductive layers, wherein, in the connecting particle pressing process, the pressing is performed such that the cross-sectional area in the direction along the insulating member surface of at least a portion of the connecting member is greater than the contact area of the connecting member with the conductive layers.