Abstract: An air conditioning apparatus includes a plurality of third heat exchangers and flow rate control valves. In a heating mode, a controller opens a flow rate control valve corresponding to a heat exchanger that is being requested to perform air conditioning of the plurality of third heat exchangers, and closes a flow rate control valve corresponding to a heat exchanger that is not being requested to perform air conditioning of the plurality of third heat exchangers. In a defrosting mode, when a temperature of a second heat medium is lower than a first determination temperature, the controller opens a flow rate control valve corresponding to at least one of the heat exchangers that are not being requested to perform air conditioning. The at least one of the heat exchangers is assigned a higher priority than a remaining heat exchanger that is not being requested to perform air conditioning.

Abstract: A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.

Abstract: A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying liquid resist on the seed layer formed on the surface of the resin insulating layer, drying the liquid resist applied on the seed layer such that a resist layer is formed on the seed layer, applying pressure and heat simultaneously to an entire surface of the resist layer formed on the seed layer, forming a plating resist on the seed layer from the resist layer formed on the seed layer using a photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the plating resist, removing the plating resist from the seed layer, and removing part of the seed layer exposed from the electrolytic plating film.

Abstract: A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.

Abstract: A resin composition may include: an ethylene-vinyl acetate copolymer (A); and a propylene-based resin (B). The melt flow rate (MFR: 190° C., 2.16 kg) MFR (A) of the ethylene-vinyl acetate copolymer (A) and the melt flow rate (MFR: 190° C., 2.16 kg) MFR (B) of the propylene-based resin (B) may satisfy relational expression (i) 4 g/10 min?MFR(A)?MFR(B)?35 g/10 min??(i). The resin composition may have an endothermic peak at 120 to 170° C. in differential scanning calorimetry and a heat of fusion in a range of from 15 to 40 mJ/mg at 120 to 170° C.

Abstract: A printed wiring board includes a first conductor layer, a first insulating layer on the first conductor layer, a second conductor layer on the first insulating layer, a second insulating layer on the second conductor layer, a third conductor layer on the second insulating layer, a first via conductor in the first insulating layer such that the first via conductor is penetrating through the first insulating layer and connecting the first and second conductor layers, a second via conductor in the second insulating layer such that the second via conductor is penetrating through the second insulating layer and connecting the second and third conductor layers, and a magnetic resin portion formed in opening of the first insulating layer and covering part of the first conductor layer such that the second conductor layer is not formed in a region of the first insulating layer where the magnetic resin portion is formed.

Abstract: The invention discloses a multilayer propylene resin sheet and a heat-treatable packaging material which have an excellent transparency, flexibility and very-low-temperature impact resistance, and which reduce the thickness variation during lamination, suppress appearance defects such as interfacial roughness and mitigate thinning during fabrication. The multilayer propylene resin sheet is composed of at least two layers, which are (1) an inner layer and (2) an outer layer. The inner layer (1) is made of a resin composition containing 40 to 89 wt % of a specific propylene resin composition (A), 10 to 40 wt % of a specific ethylene-?-olefin copolymer (B), and 1 to 20 wt % of a specific propylene resin (C). The outer layer (2) is made of a specific propylene resin composition.

Abstract: The invention provides a multilayer sheet and a heat-treatable packaging material which have excellent flexibility, transparency, impact resistance, heat resistance, heat-sealability and cleanliness, which are endowed with a good formability without readily incurring drawbacks such as external defects and thickness fluctuations when subjected to multilayer formation, and which, even at a reduced thickness, have an excellent sheet substrate strength decrease-inhibiting effect.

Abstract: The invention discloses a propylene resin sheet and a heat-treatable packaging material which have an excellent transparency, flexibility and very-low-temperature impact resistance, and which reduce the thickness variation during lamination, suppress appearance defects such as interfacial roughness. A propylene resin sheet composed of at least one layer, the main layer being made up of a resin composition containing: (1) 50 to 90 wt % of a propylene resin composition (A) which includes from 30 to 70 wt % of a propylene-?-olefin random copolymer component (A1) having a melting peak temperature of 120 to 150° C., and from 70 to 30 wt % of a propylene-?-olefin random copolymer component (A2) having a C2 or C4-8 ?-olefin content of at least 10 wt % but less than 20 wt %; and (2) 10 to 50 wt % of a specific ethylene-?-olefin copolymer (B).

Abstract: The invention discloses a multilayer propylene resin sheet and a heat-treatable packaging material which have an excellent transparency, flexibility and very-low-temperature impact resistance, and which reduce the thickness variation during lamination, suppress appearance defects such as interfacial roughness and mitigate thinning during fabrication. The multilayer propylene resin sheet is composed of at least two layers, which are (1) an inner layer and (2) an outer layer. The inner layer (1) is made of a resin composition containing 40 to 89 wt % of a specific propylene resin composition (A), 10 to 40 wt % of a specific ethylene-?-olefin copolymer (B), and 1 to 20 wt % of a specific propylene resin (C). The outer layer (2) is made of a specific propylene resin composition.

Abstract: The invention provides a multilayer sheet and a heat-treatable packaging material which have excellent flexibility, transparency, impact resistance, heat resistance, heat-sealability and cleanliness, which are endowed with a good formability without readily incurring drawbacks such as external defects and thickness fluctuations when subjected to multilayer formation, and which, even at a reduced thickness, have an excellent sheet substrate strength decrease-inhibiting effect.