Patents by Inventor Yuji KAZEHAYA

Yuji KAZEHAYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10920009
    Abstract: The thermosetting resin composition according to an embodiment of the present invention contains a component (A) which is a novolac vinyl ester resin having a hydroxyl group and an ethylenically unsaturated group in the molecule, a component (B) which is an ethylenically unsaturated monomer, and a component (D) which is a polyisocyanate compound, wherein the component (A) has a hydroxyl value of 30-150 mgKOH/g, and the mole number of the hydroxyl group with respect to the mole number of the ethylenically unsaturated group per gram of the component (A) ((the amount of the hydroxyl group [mol/g])/(the amount of the ethylenically unsaturated group [mol/g])) is 0.1-0.8.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: February 16, 2021
    Assignee: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Hayato Ogasawara, Yuji Kazehaya
  • Patent number: 10899856
    Abstract: The present invention provides a SMC of which excessive thickening with time is suppressed while of which sufficient initial thickening by an isocyanate-based thickener is maintained, particularly of which a decrease in flowability at the time of molding to be easily actualized in the case of containing an aromatic vinyl compound such as styrene is suppressed, and which exhibits excellent storage stability and moldability, a molding material for obtaining the SMC, and a fiber-reinforced composite material using the SMC. The invention provides a molding material including: a matrix resin composition containing the following Component (A), the following Component (B), the following Component (D) and the following Component (E); and the following Component (C), in which a proportion of the Component (E) with respect to 100 parts by mass of a sum of the Component (A) and the Component (B) is 0.002 part by mass or more and 0.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: January 26, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Yukichi Konami, Seiji Tsuchiya, Yuji Kazehaya
  • Patent number: 10323133
    Abstract: The present invention relates to a molding material, having: (A): a fiber substrate made of carbon fibers 5 mm or longer; (B): at least either an epoxy (meth)acrylate resin or an unsaturated polyester resin; (C): (C-1) inorganic fibrous filler with a cross-sectional area of at least 0.8 ?m2, or (C-2) inorganic flaky filler with a cross-sectional area of at least 0.05 ?m2, both of which have an aspect ratio of 2.0 or higher and a length of less than 3 mm; and (D): a polyisocyanate compound.
    Type: Grant
    Filed: September 8, 2015
    Date of Patent: June 18, 2019
    Assignee: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Koichi Akiyama, Yuji Kazehaya, Mitsushi Nishimura, Shinichiro Furuya
  • Publication number: 20190040163
    Abstract: The present invention provides a SMC of which excessive thickening with time is suppressed while of which sufficient initial thickening by an isocyanate-based thickener is maintained, particularly of which a decrease in flowability at the time of molding to be easily actualized in the case of containing an aromatic vinyl compound such as styrene is suppressed, and which exhibits excellent storage stability and moldability, a molding material for obtaining the SMC, and a fiber-reinforced composite material using the SMC. The invention provides a molding material including: a matrix resin composition containing the following Component (A), the following Component (B), the following Component (D) and the following Component (E); and the following Component (C), in which a proportion of the Component (E) with respect to 100 parts by mass of a sum of the Component (A) and the Component (B) is 0.002 part by mass or more and 0.
    Type: Application
    Filed: October 4, 2018
    Publication date: February 7, 2019
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Yukichi Konami, Seiji Tsuchiya, Yuji Kazehaya
  • Publication number: 20190031817
    Abstract: The thermosetting resin composition according to an embodiment of the present invention contains a component (A) which is a novolac vinyl ester resin having a hydroxyl group and an ethylenically unsaturated group in the molecule, a component (B) which is an ethylenically unsaturated monomer, and a component (D) which is a polyisocyanate compound, wherein the component (A) has a hydroxyl value of 30-150 mgKOH/g, and the mole number of the hydroxyl group with respect to the mole number of the ethylenically unsaturated group per gram of the component (A) ((the amount of the hydroxyl group [mol/g])/(the amount of the ethylenically unsaturated group [mol/g])) is 0.1-0.8.
    Type: Application
    Filed: October 4, 2018
    Publication date: January 31, 2019
    Applicant: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Hayato OGASAWARA, Yuji KAZEHAYA
  • Publication number: 20170298199
    Abstract: The present invention relates to a molding material, having: (A): a fiber substrate made of carbon fibers 5 mm or longer; (B): at least either an epoxy (meth)acrylate resin or an unsaturated polyester resin; (C): (C-1) inorganic fibrous filler with a cross-sectional area of at least 0.8 ?m2, or (C-2) inorganic flaky filler with a cross-sectional area of at least 0.05 ?m2, both of which have an aspect ratio of 2.0 or higher and a length of less than 3 mm; and (D): a polyisocyanate compound.
    Type: Application
    Filed: September 8, 2015
    Publication date: October 19, 2017
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Koichi AKIYAMA, Yuji KAZEHAYA, Mitsushi NISHIMURA, Shinichiro FURUYA