Patents by Inventor Yuji Kira

Yuji Kira has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240155261
    Abstract: An imaging device according to the present disclosure includes the plurality of normal pixels arranged in a matrix, the special pixel arranged by replacing a part of the normal pixels, the color filter corresponding to the normal pixels and arranged according to a predetermined rule, the special filter arranged corresponding to the special pixel, and the special pixel color filter arranged to surround at least a part of the periphery of the special filter.
    Type: Application
    Filed: October 26, 2020
    Publication date: May 9, 2024
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yuji ISERI, Hodaka KIRA, Daisuke HAGIHARA, Kazuki YOSHIDA, Syo YASUNAGA, Koji YAMARYO, Takeo ONO, Kimihiko SATO
  • Patent number: 5296554
    Abstract: An adhesive resin composition comprises (A) 2 to 98% by weight of an ethylene copolymer resin containing 0.01 to 20% by weight of the unit of an unsaturated carboxylic acid anhydride in the main chain; and (B) 98 to 2% by weight of a resin mixture comprising (i) 50 to 90% by weight of a copolymer resin of ethylene/vinyl acetate, (ii) 40 to 9.5% by weight of a binary copolymer resin of ethylene and an .alpha.-olefin having 3 to 12 carbon atoms, and (iii) 10 to 0.5% by weight of an ethylene/propylene/unconjugated diene terpolymer. The resin mixture is obtained by mixing (i), (ii) and (iii) in a molten state and has a toluene extraction residue of 10 to 60% by weight. The adhesive resin composition is utilized as an adhesive material between layers of a multi-layer laminate and scrap or waste material from the adhesive resin composition or from the multilayer laminate can be recycled as an adhesive resin composition having excellent interlayer strength and compatibility.
    Type: Grant
    Filed: April 7, 1993
    Date of Patent: March 22, 1994
    Assignee: Showa Denko K.K.
    Inventors: Kazuyuki Watanabe, Yuji Kira