Patents by Inventor Yuji Kosaku

Yuji Kosaku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bonding method, method of forming bump and bump
    Patent number: 6715666
    Abstract: A wire bonding method, a bump forming method and a bump which are capable of preventing contact of a wire with a substrate or a conductive lead after the wire is bonded to a bump, and which are capable of preventing generation of bending in the wire during bonding of the wire to the bump are disclosed. When a first conductor and a second conductor are wire bonded, a bump is previously formed on the second conductor by ball bonding. An inclined surface is formed on an upper end of the bump by moving a capillary along a predetermined path to operate the capillary. First bonding of a wire to the first conductor is carried out, then the wire is looped from the first conductor to the bump, and second bonding of the wire onto the inclined surface of the bump is carried out.
    Type: Grant
    Filed: September 13, 2002
    Date of Patent: April 6, 2004
    Assignee: Kaijo Corporation
    Inventors: Rei Imai, Tamanari Yasuda, Shinobu Ishii, Yuji Kosaku
  • WIRE BONDING METHOD, METHOD OF FORMING BUMP AND BUMP
    Publication number: 20040026480
    Abstract: A wire bonding method, a bump forming method and a bump which are capable of preventing contact of a wire with a substrate or a conductive lead after the wire is bonded to a bump, and which are capable of preventing generation of bending in the wire during bonding of the wire to the bump are disclosed. When a first conductor and a second conductor are wire bonded, a bump is previously formed on the second conductor by ball bonding. An inclined surface is formed on an upper end of the bump by moving a capillary along a predetermined path to operate the capillary. First bonding of a wire to the first conductor is carried out, then the wire is looped from the first conductor to the bump, and second bonding of the wire onto the inclined surface of the bump is carried out.
    Type: Application
    Filed: September 13, 2002
    Publication date: February 12, 2004
    Applicant: Kaijo Corporation
    Inventors: Rei Imai, Tamanari Yasuda, Shinobu Ishii, Yuji Kosaku
  • Disk carrier
    Patent number: D381344
    Type: Grant
    Filed: October 2, 1995
    Date of Patent: July 22, 1997
    Assignee: Kaijo Corporation
    Inventor: Yuji Kosaku