Abstract: A molding frame made by molding a thermoplastic norbornene resin which hardly deforms even after repeated use is used for production of electronic part sealed bodies by sealing the electronic devices of integrated circuits such as light emitting diodes, diodes, transistors, LSI devices, IC devices and CCD devices and capacitors, resistors, coils, microswitches and dipswitches with thermosetting resins such as epoxy resins as sealants.

Abstract: A resin composition comprising 30-95 parts by weight of a thermoplastic norbornene resin and 5-70 parts by weight of a spherical inorganic filler having an average particle diameter of 0.05-50 .mu.m; and a precision molding produced therefrom.

Abstract: The present invention provides the hydrogenated product of a thermoplastic norbornene polymer excellent in characteristics as optical materials by reducing the residual amounts of the transition metal atoms originating from the polymerization catalyst used at the polymerization to 1 ppm or less of the hydrogenated product.Reduction of the residual amounts to below the desired level is attained by treating the reaction solution with the adsorbent during or after production of the hydrogenated product from the thermoplastic norbornene polymer.The hydrogenated product of the thermoplastic norbornene polymer thus obtained in which the residual amounts of the transition metal atoms are 1 ppm or less, has a wide utilization field, including a material for optical articles having excellent utilization characteristics such as substrates for optical elements, lenses and the like.