Patents by Inventor Yuji Kuramoto

Yuji Kuramoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10512197
    Abstract: A power converting device includes a heat sink including a heat sink base portion on an upper face side of which a depressed portion forming a refrigerant channel is provided and a heat sink upper plate covering the depressed portion of the heat sink base portion, wherein the refrigerant channel is sealed using a channel seal provided in an outer peripheral portion of the heat sink upper plate, an upper case caused to cover an upper face side of the heat sink, a lower case caused to cover a lower face side of the heat sink, and a terminal block forming a waterproofing wall that encloses a power module projecting from an upper face of the heat sink upper plate between the power module on the heat sink upper plate and the channel seal in the upper case.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: December 17, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Satoshi Ishibashi, Yuji Kuramoto, Toshio Watanabe
  • Publication number: 20190269031
    Abstract: A power converting device includes a heat sink including a heat sink base portion on an upper face side of which a depressed portion forming a refrigerant channel is provided and a heat sink upper plate covering the depressed portion of the heat sink base portion, wherein the refrigerant channel is sealed using a channel seal provided in an outer peripheral portion of the heat sink upper plate, an upper case caused to cover an upper face side of the heat sink, a lower case caused to cover a lower face side of the heat sink, and a terminal block forming a waterproofing wall that encloses a power module projecting from an upper face of the heat sink upper plate between the power module on the heat sink upper plate and the channel seal in the upper case.
    Type: Application
    Filed: August 13, 2018
    Publication date: August 29, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Satoshi ISHIBASHI, Yuji KURAMOTO, Toshio WATANABE
  • Patent number: 10306798
    Abstract: Provided is a current control apparatus including a first cooler that cools a switch element, a bus bar connected to the switch element, a core penetrated by the bus bar, a magneto-electric transducer, which is inserted into the core in order to detect a value of a current supplied to the switch element, a controller that controls the switch element, a case, and a cover, wherein the core includes an exposed disposal structure in which a part of the core is exposed to the exterior of the case as an exposed portion, and the current control apparatus further includes a divided cooling structure in which the exposed portion is cooled without being affected by the temperature of the first cooler that cools the switch element.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: May 28, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Toru Daigo, Taisuke Iwakiri, Yuji Kuramoto
  • Patent number: 10056774
    Abstract: A discharge device provided with a switching unit configured by a first switch element and a second switch element connected in series, a first power storage element connected in parallel with both ends of the switching unit, a second power storage element connected in parallel with both ends of the second switch element, and a control unit which controls on/off switching of the first switch element and the second switch element in such a manner that a portion of the energy charged in the first power storage element is charged and discharged at least once by the second power storage element, and the energy charged in the first power storage element is discharged while being consumed in one or all of the first switch element and the second switch element.
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: August 21, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Toru Daigo, Nobuhiro Kihara, Yuji Kuramoto
  • Publication number: 20170251568
    Abstract: Provided is a current control apparatus including a first cooler that cools a switch element, a bus bar connected to the switch element, a core penetrated by the bus bar, a magneto-electric transducer, which is inserted into the core in order to detect a value of a current supplied to the switch element, a controller that controls the switch element, a case, and a cover, wherein the core includes an exposed disposal structure in which a part of the core is exposed to the exterior of the case as an exposed portion, and the current control apparatus further includes a divided cooling structure in which the exposed portion is cooled without being affected by the temperature of the first cooler that cools the switch element.
    Type: Application
    Filed: August 30, 2016
    Publication date: August 31, 2017
    Applicant: Mitsubishi Electric Corporation
    Inventors: Toru DAIGO, Taisuke IWAKIRI, Yuji KURAMOTO
  • Publication number: 20160329733
    Abstract: A discharge device provided with a switching unit configured by a first switch element and a second switch element connected in series, a first power storage element connected in parallel with both ends of the switching unit, a second power storage element connected in parallel with both ends of the second switch element, and a control unit which controls on/off switching of the first switch element and the second switch element in such a manner that a portion of the energy charged in the first power storage element is charged and discharged at least once by the second power storage element, and the energy charged in the first power storage element is discharged while being consumed in one or all of the first switch element and the second switch element.
    Type: Application
    Filed: February 6, 2014
    Publication date: November 10, 2016
    Applicant: Mitsubishi Electric Corporation
    Inventors: Toru DAIGO, Nobuhiro KIHARA, Yuji KURAMOTO
  • Patent number: 8686601
    Abstract: A power conversion apparatus for vehicle use having a small size and a light weight is obtained. The power conversion apparatus is provided with: a plurality of semiconductor modules in which semiconductor devices are molded with a resin, and each of which has a module body, an input terminal, and an output terminal; a heat sink of a rectangular parallelepiped shape which has cooling principal planes on opposite surfaces thereof, respectively, for cooling these semiconductor modules; and a plurality of control boards which control the driving of the semiconductor modules. Each of the semiconductor modules is arranged such that its module body has a principal plane in surface contact with one of the cooling principal planes of the heat sink, and each of the control boards is arranged in opposition to a surface of the module body at an opposed side of the principal plane thereof.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: April 1, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takuya Michinaka, Satoshi Ishibashi, Masaru Kobayashi, Haruyuki Matsuo, Yuji Kuramoto
  • Patent number: 8031478
    Abstract: A power conversion apparatus comprising a base 110 which includes a first fixation portion 110a and a second fixation portion 110b that are coupled to each other at a desired angle, wherein power modules IPM1, IPM2 and IPM3 are fixed on the first fixation portion 110a of the base 110, a control circuit board 10 is fixed with its first principal surface 10a held in direct or indirect touch with the second fixation portion 110b of the base 110, and components constituting a control circuit are packaged on the second principal surface 10b of the control circuit board 10. Owing to the configuration, a versatility for the installation of the power conversion apparatus on a vehicle becomes high, the vibration-proofness of the control circuit board is enhanced, and heats generated by the electronic components, etc. packaged on the control circuit board are sufficiently emitted.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: October 4, 2011
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroshi Yamabuchi, Yuji Kuramoto, Hirotoshi Maekawa, Ryoji Nishiyama
  • Publication number: 20110181105
    Abstract: A power conversion apparatus for vehicle use having a small size and a light weight is obtained. The power conversion apparatus is provided with: a plurality of semiconductor modules in which semiconductor devices are molded with a resin, and each of which has a module body, an input terminal, and an output terminal; a heat sink of a rectangular parallelepiped shape which has cooling principal planes on opposite surfaces thereof, respectively, for cooling these semiconductor modules; and a plurality of control boards which control the driving of the semiconductor modules. Each of the semiconductor modules is arranged such that its module body has a principal plane in surface contact with one of the cooling principal planes of the heat sink, and each of the control boards is arranged in opposition to a surface of the module body at an opposed side of the principal plane thereof.
    Type: Application
    Filed: August 10, 2010
    Publication date: July 28, 2011
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takuya Michinaka, Satoshi Ishibashi, Masaru Kobayashi, Haruyuki Matsuo, Yuji Kuramoto
  • Publication number: 20110013439
    Abstract: A power conversion apparatus comprising a base 110 which includes a first fixation portion 110a and a second fixation portion 110b that are coupled to each other at a desired angle, wherein power modules IPM1, IPM2 and IPM3 are fixed on the first fixation portion 110a of the base 110, a control circuit board 10 is fixed with its first principal surface 10a held in direct or indirect touch with the second fixation portion 110b of the base 110, and components constituting a control circuit are packaged on the second principal surface 10b of the control circuit board 10. Owing to the configuration, a versatility for the installation of the power conversion apparatus on a vehicle becomes high, the vibration-proofness of the control circuit board is enhanced, and heats generated by the electronic components, etc. packaged on the control circuit board are sufficiently emitted.
    Type: Application
    Filed: August 20, 2010
    Publication date: January 20, 2011
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hiroshi Yamabuchi, Yuji Kuramoto, Hirotoshi Maekawa, Ryoji Nishiyama
  • Patent number: 7826231
    Abstract: A power conversion apparatus comprising a base which includes a first fixation portion and a second fixation portion that are coupled to each other at a desired angle, wherein power modules are fixed on the first fixation portion of the base, a control circuit board is fixed with its first principal surface held in direct or indirect touch with the second fixation portion of the base, and components constituting a control circuit are packaged on the second principal surface of the control circuit board. Owing to the configuration, a versatility for the installation of the power conversion apparatus on a vehicle becomes high, the vibration-proofness of the control circuit board is enhanced, and heats generated by the electronic components, etc. packaged on the control circuit board are sufficiently emitted.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: November 2, 2010
    Assignee: Mitsubishi Electric Company
    Inventors: Hiroshi Yamabuchi, Yuji Kuramoto, Hirotoshi Maekawa, Ryoji Nishiyama
  • Patent number: 7538426
    Abstract: A cooling system of a power semiconductor module of the invention includes a temperature detection sensor provided in a semiconductor element as a heat source provided in a power semiconductor module, and a controller which estimates a change of a heat transfer coefficient from the power semiconductor module to cooling water based on output information Tj of the temperature detection sensor and drive output information Sr of a rotation speed detection sensor for a pump motor to drive a cooling pump, controls the pump motor according to this estimated result, and controls cooling capacity of the cooling water.
    Type: Grant
    Filed: July 22, 2005
    Date of Patent: May 26, 2009
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hiroshi Yamabuchi, Ryoji Nishiyama, Yuji Kuramoto, Satoshi Ishibashi
  • Patent number: 7471003
    Abstract: A protection operation control part switches a gate signal interruption switch for protection of power elements to a gate signal interruption side, and invalidates a switching signal from a hybrid control unit to place transistors into a nonconducting operation. A motor current signal from a motor current detector is converted into a current value by a motor current calculation unit, and is inputted to a short-circuit abnormality detection unit through a motor control arithmetic part, and a short-circuit abnormality is detected. At a time of detecting the short-circuit abnormality, an internal combustion engine operation instruction unit gives an instruction to an internal combustion engine control unit so as to limit output of an internal combustion engine, and releases a conduction state of an abnormal motor current.
    Type: Grant
    Filed: June 12, 2006
    Date of Patent: December 30, 2008
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masaru Kobayashi, Hirotoshi Maekawa, Ryoji Nishiyama, Yuji Kuramoto, Kiyoharu Anzai
  • Patent number: 7333331
    Abstract: A power unit device which can be made small, with which special measures of plant and labor at the time of assembly are unnecessary, and of which assembly is easy and universality in its manufacturing aspect is excellent. The power unit device has a heat sink having a first heat-receiving part and formed on the opposite side from this a second heat-receiving part; a power module, in firm contact with the first heat-receiving part, containing a power semiconductor element for performing DC-AC conversion and/or AC-DC conversion for one phase; a smoothing condenser, in firm contact with the second heat-receiving part, for suppressing ripple current of the power semiconductor element; and fixing means passing through the power module, the heat sink and the smoothing condenser.
    Type: Grant
    Filed: February 3, 2006
    Date of Patent: February 19, 2008
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hiroshi Yamabuchi, Yuji Kuramoto, Toru Kimura
  • Publication number: 20070183130
    Abstract: A power conversion apparatus comprising a base 110 which includes a first fixation portion 110a and a second fixation portion 110b that are coupled to each other at a desired angle, wherein power modules IPM1, IPM2 and IPM3 are fixed on the first fixation portion 110a of the base 110, a control circuit board 10 is fixed with its first principal surface 10a held in direct or indirect touch with the second fixation portion 110b of the base 110, and components constituting a control circuit are packaged on the second principal surface 10b of the control circuit board 10. Owing to the configuration, a versatility for the installation of the power conversion apparatus on a vehicle becomes high, the vibration-proofness of the control circuit board is enhanced, and heats generated by the electronic components, etc. packaged on the control circuit board are sufficiently emitted.
    Type: Application
    Filed: December 21, 2006
    Publication date: August 9, 2007
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hiroshi Yamabuchi, Yuji Kuramoto, Hirotoshi Maekawa, Ryoji Nishiyama
  • Publication number: 20070093359
    Abstract: A protection operation control part switches a gate signal interruption switch for protection of power elements to a gate signal interruption side, and invalidates a switching signal from a hybrid control unit to place transistors into a nonconducting operation. A motor current signal from a motor current detector is converted into a current value by a motor current calculation unit, and is inputted to a short-circuit abnormality detection unit through a motor control arithmetic part, and a short-circuit abnormality is detected. At a time of detecting the short-circuit abnormality, an internal combustion engine operation instruction unit gives an instruction to an internal combustion engine control unit so as to limit output of an internal combustion engine, and releases a conduction state of an abnormal motor current.
    Type: Application
    Filed: June 12, 2006
    Publication date: April 26, 2007
    Inventors: Masaru Kobayashi, Hirotoshi Maekawa, Ryoji Nishiyama, Yuji Kuramoto, Kiyoharu Anzai
  • Publication number: 20060273592
    Abstract: A power unit includes a plurality of power modules for controlling individual phases of a pair of rotating electric machines and a heat sink on which the power modules are mounted. Each of the power modules includes a metal block, four power electronic semiconductor devices which are heat-generating elements mounted on the metal block with electrically conductive device bonding layers placed in between, and a plastic case. The plastic case is made of a plastic material sealing the power electronic semiconductor devices and the metal block in a single package with leads connected to top- and bottom-side electrodes of the power electronic semiconductor devices extending outward from the plastic case.
    Type: Application
    Filed: June 2, 2006
    Publication date: December 7, 2006
    Inventors: Hiroshi Yamabuchi, Yuji Kuramoto, Toru Kimura
  • Publication number: 20060250765
    Abstract: A power unit device which can be made small, with which special measures of plant and labor at the time of assembly are unnecessary, and of which assembly is easy and universality in its manufacturing aspect is excellent. The power unit device has a heat sink having a first heat-receiving part and formed on the opposite side from this a second heat-receiving part; a power module, in firm contact with the first heat-receiving part, containing a power semiconductor element for performing DC-AC conversion and/or AC-DC conversion for one phase; a smoothing condenser, in firm contact with the second heat-receiving part, for suppressing ripple current of the power semiconductor element; and fixing means passing through the power module, the heat sink and the smoothing condenser.
    Type: Application
    Filed: February 3, 2006
    Publication date: November 9, 2006
    Inventors: Hiroshi Yamabuchi, Yuji Kuramoto, Toru Kimura
  • Publication number: 20060113661
    Abstract: A cooling system of a power semiconductor module of the invention includes a temperature detection sensor provided in a semiconductor element as a heat source provided in a power semiconductor module, and a controller which estimates a change of a heat transfer coefficient from the power semiconductor module to cooling water based on output information Tj of the temperature detection sensor and drive output information Sr of a rotation speed detection sensor for a pump motor to drive a cooling pump, controls the pump motor according to this estimated result, and controls cooling capacity of the cooling water.
    Type: Application
    Filed: July 22, 2005
    Publication date: June 1, 2006
    Inventors: Hiroshi Yamabuchi, Ryoji Nishiyama, Yuji Kuramoto, Satoshi Ishibashi