Abstract: The present invention aims to provide a circuit module that includes a sheet-like solid electrolytic capacitor and reduces an area and volume required for mounting electronic components. In the sheet-like solid electrolytic capacitor, valve metal sheet 11 has dielectric layer 13 and current collector layer 12 formed on the surface thereof, and is packaged by insulators 14 and 15. The circuit module is structured to embed the sheet-like solid electrolytic capacitor in a circuit board.

Abstract: A solid electrolytic capacitor of the present invention comprises; a valve metal sheet which is made porous, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer and an electrode exposure area formed on the solid electrolyte layer, and an insulating section electrically insulating the electrode exposure area from the collector layer, in which the electrode exposure area and the collector layer are formed on the same surface of the valve metal sheet. It is also possible to laminate a plurality of the capacitor elements. According to the present invention, a solid electrolytic capacitor realizing a reduction in size while achieving a high capacitance and excellent high frequency response is provided.

Abstract: A voltage converter module is formed by multi-layering a first connecting layer, a first inner wiring layer, a component built-in layer, a second inner wiring layer, a second connecting layer, and a capacitor-mounted layer, and a capacitor built-in layer with resin composite. A connecting terminal formed on a terminal surface of the first connecting layer, the first inner wiring layer, the second inner wiring layer and the capacitor-mounted layer are electrically coupled to each other through via-hole conductors. The second inner wiring layer couples a voltage converter IC to peripheral components, both being incorporated in the component built-in layer. A first capacitor and a second capacitor incorporated in the capacitor built-in layer are mounted to the capacitor-mounted layer. This structure forms a circuit, in which the first capacitor is coupled to the second capacitor, between the voltage converter IC and the grounding.

Abstract: A capacitor includes a valve metal foil including a valve metal porous body and a lead portion, a dielectric layer provided on the valve metal porous body, a solid electrolyte layer on the dielectric layer, a collector layer on the solid electrolyte layer, an anode lead connected to the lead portion, a housing for accommodating the valve metal porous body, the dielectric layer, the solid electrolyte layer, the collector layer, and the anode lead, and for having an end of the anode lead exposed from a surface of the housing, an anode external terminal provided over the housing and connected with the end of the anode lead, and a cathode external terminal provided over the housing and coupled with the collector layer. The capacitor has a large capacitance, a small ESR, and a small ESL.

Abstract: A method of manufacturing the solid electrolytic capacitors that can be directly connected to semiconductor components and have a faster response to a high frequency as well as a larger capacitance includes: a dielectric forming stage where a valve metal sheet (2) is made porous and dielectric coating (7) is provided on the porous face (3); an element forming stage where solid electrolytic layer (8) and collector layer (10) are formed on the dielectric coating (7); and a terminal forming stage where connecting terminal (16) to an external electrode is formed. The element forming stage includes the steps of: forming solid electrolytic layer (8); forming through-hole electrode (9) in through-hole (5) that is prepared on valve metal sheet (2); and forming collector (10) on solid electrolytic layer (8).

Abstract: A first capacitor element of a sheet form includes a porous valve metal film, a dielectric layer provided on the porous valve metal film, a solid electrolyte layer provided on the dielectric layer, and a collector layer provided on the solid electrolyte layer. A second capacitor element of a sheet form includes a valve metal film, a porous valve metal body provided on the valve metal film, a dielectric layer provided on the porous valve metal body, a solid electrolyte layer provided on the dielectric layer, and a collector layer provided on the electrolyte layer. The first and second capacitor elements are stacked. The porous valve metal film of the first capacitor element and the valve metal film of the second capacitor element are connected to one external electrode while the collector layers of the first and second capacitor elements are connected to another external electrode, thus providing a solid electrolytic capacitor.

Abstract: A dielectric coating (3), a solid electrolytic layer (4) and a collector layer (5) are provided to one face of a porous valve metal sheet (1). An insulating section (7) covers overall this metal sheet (1) including the layers (3, 4, 5) discussed above. Conductive bodies (101, 111), which are coupled with a first connecting terminal (2) and a second connecting terminal (6) respectively, are surfaced on at least one face of the insulating section (7). Connecting bumps (12) are formed on these conductive bodies (101, 111), so that ICs (17) and other parts are coupled with these bumps (12). This structure realizes a thin composite electronic component excellent in high-frequency response.

Abstract: A method for manufacturing solid electrolytic capacitor that can be mounted direct on a semiconductor component and offers a superior high frequency characteristic. An aluminum foil 20 is provided on one surface with a resist film 23 and then with a through hole 24. Next, an insulation film 25 is formed to cover the other surface of aluminum foil 20 and to fill the first through hole, and then the resist film 23 is removed; and then the surface of aluminum foil 20 is roughened to be provided with a dielectric layer 27 thereon. A second through hole 36 is formed in the insulation film 25, which is filling the first through hole 24. A through hole electrode 28 is formed in the second through hole; and then, on the surface of the dielectric layer 27, a solid electrolytic layer 29 and a collector layer 30 are formed. After an opening 37 is provided, a first connection terminal 31 is formed therein, and a second connection electrode 32 on the exposed surface of the through hole electrode 28.

Abstract: A method for manufacturing large capacitance solid electrolytic capacitors that can be connected direct with semiconductor component, and offer a superior high frequency characteristic. An aluminum foil 3 is made porous in one of the surfaces, a dielectric layer 2 is formed on the porous portion, a through hole 4 is provided in the aluminum foil 3 at a certain specific location. An insulation layer 5 is formed to cover the other surface, viz. non-porous surface, of the aluminum foil 3 and the inner wall surface of through hole 4, a solid electrolytic layer 6 is provided on the dielectric layer 2, and a through hole electrode 7 is formed in the through hole 4, and then a collector layer 8 is formed on the solid electrolytic layer 6. The insulation layer 5 disposed on aluminum foil 3 is provided with an opening 9 at a certain specific location, and a connection terminal 10 is provided at the opening 9 of insulation layer 5 and the exposed surface of the through hole electrode 7, respectively.

Abstract: A composite magnetic body used for a choke coil, etc. is formed by compression molding of a mixture of magnetic alloy powder containing iron (Fe) and nickel (Ni) as the main component, an insulating material and a binder of an acrylic resin. In the composite magnetic body, high packing rate of the magnetic alloy powder and good insulation between the powder particles stand together, exhibiting a low core loss and a high magnetic permeability. The composite magnetic body can be formed in various core pieces of complex shapes.

Abstract: The anode member for a solid electrolytic capacitor according to the present invention comprises an anode body made of a valve metal foil having a purity of not less than 99 wt %, and an anode layer formed on the anode body and made of a sintered body of a valve metal powder. By limiting the amount of impurity contained in the valve metal foil to an amount of not more than 1 wt %, impurities in a dielectric oxide film formed by anodic oxidation, namely defects in the dielectric oxide film can be suppressed, so that the resultant solid electrolytic capacitor can have its leakage current lowered with its ESR (equivalent series resistance) being kept low, and that the electrolytic capacitor can be made to have a smaller size and a higher capacitance. The present invention also provides an electrolytic capacitor having a low leakage current, a low ESR, a small size and a high capacitance by using the above novel anode member as well as a method of making the same.

Abstract: A solid electrolytic capacitor of the present invention includes a sheet of valve metal, of which a part constitutes an positive electrode, a dielectric layer formed on a surface of the valve metal, a solid electrolyte layer formed on the dielectric layer, a negative electrode formed on the solid electrolyte layer, and an insulating protective layer for protecting the positive electrode, the dielectric layer, the solid electrolyte layer and the negative electrode. It is further provided with a bump formed on the insulating protective layer and connected to at least one of the positive electrode and the negative electrode. The solid electrolytic capacitor of the present invention is useful to constitute a semiconductor device or a circuit having outstanding high frequency response.

Abstract: The anode member for a solid electrolytic capacitor according to the present invention comprises an anode body made of a valve metal foil having a purity of not less than 99 wt %, and an anode layer formed on the anode body and made of a sintered body of a valve metal powder. By limiting the amount of impurity contained in the valve metal foil to an amount of not more than 1 wt %, impurities in a dielectric oxide film formed by anodic oxidation, namely defects in the dielectric oxide film can be suppressed, so that the resultant solid electrolytic capacitor can have its leakage current lowered with its ESR (equivalent series resistance) being kept low, and that the electrolytic capacitor can be made to have a smaller size and a higher capacitance. The present invention also provides an electrolytic capacitor having a low leakage current, a low ESR, a small size and a high capacitance by using the above novel anode member as well as a method of making the same.

Abstract: A solid electrolytic capacitor of the present invention comprises a sheet of valve metal, of which a part constitutes an positive electrode, a dielectric layer formed on a surface of the valve metal, a solid electrolyte layer formed on the dielectric layer, a negative electrode formed on the solid electrolyte layer, and an insulating protective layer for protecting the positive electrode, the dielectric layer, the solid electrolyte layer and the negative electrode. It is further provided with a bump formed on the insulating protective layer and connected to at least one of the positive electrode and the negative electrode. The solid electrolytic capacitor of the present invention is useful to constitute a semiconductor device or a circuit having outstanding high frequency response.

Abstract: A capacitor comprising a porous metal sheet, part of which forms an electrode section, an organic dielectrics formed on a metal surface, a solid electrolyte layer formed on the organic dielectrics, an electrode layer formed on the solid electrolyte layer, and an insulating protection layer provided for protecting said electrode section, dielectrics, solid electrolyte layer and electrode layer. The capacitor is provided with bumps, which are formed on the insulating protection layer and connected at least with the electrode section or the electrode layer. The capacitor of the present invention provides a semiconductor device or a circuit superior in the high frequency response.

Abstract: A capacitor comprising a porous metal sheet, part of which forms an electrode section, an organic dielectrics formed on a metal surface, a solid electrolyte layer formed on the organic dielectrics, an electrode layer formed on the solid electrolyte layer, and an insulating protection layer provided for protecting said electrode section, dielectrics, solid electrolyte layer and electrode layer. The capacitor is provided with bumps, which are formed on the insulating protection layer and connected at least with the electrode section or the electrode layer. The capacitor of the present invention provides a semiconductor device or a circuit superior in the high frequency response.

Abstract: Soft magnetic powder of Fe—Al—Si system of which magnetostrictive constant &lgr; takes a positive value at the room temperature is employed to produce a magnetic composite article so that a temperature characteristic of core-loss of the article takes a negative value at the room temperature. Excellent magnetic characteristics such as a low core-loss and a high permeability can be obtained at a high frequency band.

Abstract: A magnetic core of a compressed compact comprises a mixture of magnetic powder and a spacing material, wherein the distance between adjacent magnetic powder particles is controlled by the spacing material. In this constitution, a magnetic core low in core loss, high in magnetic permeability, and excellent in direct-current superposing characteristic is realized.

Abstract: A magnetic core of a compressed compact comprises a mixture of magnetic powder and a spacing material, wherein the distance between adjacent magnetic powder particles is controlled by the spacing material. In this constitution, a magnetic core low in core loss, high in magnetic permeability, and excellent in direct-current superposing characteristic is realized.

Abstract: The present invention relates to ceramics and a method for making ceramics having very little dimensional change after sintering and high dimensional accuracies, so that the characteristics of inorganic functional material are fully maintained and utilized. The ceramics of the present invention comprise grains of inorganic functional material and grains of complex oxide. The pores existing between said grains of inorganic functional material are filled with said grains of complex oxide produced by a sintering reaction between an oxidized metal and an inorganic compound.