Patents by Inventor Yuji MIMURA

Yuji MIMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240234363
    Abstract: A method includes providing a first substrate with a first surface including an alkyne moiety. The method includes providing a second substrate with a second surface including an azide moiety. The method further includes bonding the first substrate to the second substrate. The bonding of the first substrate to the second substrate includes making physical contact between the first surface and the second surface at an interface and chemically reacting the alkyne moiety with the azide moiety through a cycloaddition mechanism, thereby forming a triazole moiety-linked layer at the interface.
    Type: Application
    Filed: May 19, 2023
    Publication date: July 11, 2024
    Applicant: Tokyo Electron Limited
    Inventors: Scott LEFEVRE, Adam GILDEA, Satohiko HOSHINO, Sophia MADELONE, Yuji MIMURA
  • Publication number: 20240194478
    Abstract: A method for manufacturing semiconductor devices. The method includes placing a semiconductor wafer in a chamber. The method includes applying, in the chamber, a plasma that contains no fluorine. The plasma causes one or more components, in contact with the chamber, that each comprise a fluorinated coating to release its fluorine on a surface of the semiconductor wafer.
    Type: Application
    Filed: December 9, 2022
    Publication date: June 13, 2024
    Applicant: Tokyo Electron Limited
    Inventors: Satohiko Hoshino, Scott Lefevre, Yuji Mimura
  • Publication number: 20240170444
    Abstract: A method includes providing a first bonding surface on a first substrate, the first bonding surface including a bonding layer that is thermally curable or photocurable. The method includes providing a second bonding surface on a second substrate. The method includes bonding the first substrate to the second substrate by making physical contact between the first bonding surface and second bonding surface. The method further includes applying thermal energy or light to the bonding layer.
    Type: Application
    Filed: May 19, 2023
    Publication date: May 23, 2024
    Applicant: Tokyo Electron Limited
    Inventors: Scott LEFEVRE, Adam GILDEA, Satohiko HOSHINO, Sophia MADELONE, Yuji MIMURA
  • Publication number: 20240079222
    Abstract: A surface modifying apparatus is configured to modify a bonding surface of a substrate to be bonded to another substrate by plasma of a processing gas. The surface modifying apparatus includes a processing vessel; a measuring unit; and a controller. The processing vessel is configured to accommodate the substrate therein. The measuring unit is configured to measure a value indicating an amount of moisture in the processing vessel. The controller is configured to determine whether or not bonding strength between the substrate and the another substrate, when it is assumed that the substrate modified in the processing vessel is bonded to the another substrate, is good based on the value indicating the amount of moisture in the processing vessel measured by the measuring unit.
    Type: Application
    Filed: January 19, 2022
    Publication date: March 7, 2024
    Inventors: Takashi Terada, Yuji Mimura, Hiroshi Maeda, Takuro Masuzumi, Masaru Honda, Ryoichi Sakamoto
  • Publication number: 20240079214
    Abstract: A surface modifying method of modifying a bonding surface of a substrate to be bonded to another substrate by plasma of a processing gas includes an adjusting process and a modifying process. In the adjusting process, an amount of moisture in a processing vessel is adjusted by supplying a humidified gas into the processing vessel allowed to accommodate the substrate therein. In the modifying process, the bonding surface of the substrate is modified by forming the plasma of the processing gas in the processing vessel in a state that the amount of moisture in the processing vessel is adjusted.
    Type: Application
    Filed: January 13, 2022
    Publication date: March 7, 2024
    Inventors: Yuji Mimura, Hiroshi Maeda, Takuro Masuzumi, Takashi Terada, Masaru Honda, Ryoichi Sakamoto, Takashi Fuse, Yusuke Kubota
  • Patent number: 11791182
    Abstract: A measuring method includes measuring a displacement A1, placing an imaging unit 20 at a position where the imaging unit is allowed to image a measurement mark MI and imaging the measurement mark M1. In the measuring of the displacement A1, the displacement A1 of a surface of a combined substrate, which is composed of two sheets of substrates bonded to each other, on a side of the imaging unit 20 at a position where the measurement mark M1 for position deviation measurement, which is provided within the combined substrate, is placed is measured. In the imaging of the measurement mark M1, the measurement mark M1 is imaged by the imaging unit 20 while putting the measurement mark M1 in focus by moving a focal position back and forth with respect to a focal position which is previously set based on the displacement A1.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: October 17, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yuji Mimura, Shigeto Tsuruta, Eiji Manabe, Hisanori Hizume
  • Patent number: 11626302
    Abstract: A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.
    Type: Grant
    Filed: July 19, 2022
    Date of Patent: April 11, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yuji Mimura, Hiroshi Maeda, Satoshi Nishimura
  • Publication number: 20230055853
    Abstract: A separating method includes holding a combined substrate and separating a first substrate. In the holding of the combined substrate, the combined substrate in which the first substrate and a second substrate are bonded is held. In the separating of the first substrate, the first substrate is separated from the combined substrate, starting from a side surface of the combined substrate. The separating of the first substrate includes brining a fluid containing water into contact with the side surface.
    Type: Application
    Filed: August 17, 2022
    Publication date: February 23, 2023
    Inventors: Takashi Terada, Yuji Mimura, Hiroshi Maeda, Kazutaka Noda, Masaru Honda, Ryoichi Sakamoto, Yutaka Yamasaki, Tatsuya Kitayama, Akira Fukutomi
  • Publication number: 20220415673
    Abstract: A bonding system includes a bonding device, an inspection device and a controller. The bonding device forms a combined substrate by bonding a first substrate and a second substrate to each other. The inspection device inspects the combined substrate. The controller controls the inspection device. The controller includes a measurement controller, a comparison unit and a re-measurement controller. The measurement controller causes the inspection device to measure the combined substrate at a first number of measurement points. The comparison unit compares, with a reference, an inspection result including a deviation amount between the first substrate and the second substrate in the combined substrate based on a measurement result. The re-measurement controller causes the inspection device to re-measure the combined substrate at a second number of measurement points greater than the first number of measurement points based on a comparison result obtained by the comparison unit.
    Type: Application
    Filed: September 28, 2020
    Publication date: December 29, 2022
    Inventors: Yoshitaka Otsuka, Shigeto Tsuruta, Yuji Mimura, Hiroshi Maeda, Eiji Manabe, Hisanori Hizume, Shinichi Shinozuka, Hironori Tanoue
  • Publication number: 20220384386
    Abstract: A bonding system includes a surface modifying apparatus and a bonding apparatus. The surface modifying apparatus is configured to modify a bonding surface of a substrate to be bonded to another substrate with plasma of a processing gas. The bonding apparatus is configured to bond two substrates modified by the surface modifying apparatus by an intermolecular force. The surface modifying apparatus includes: a processing chamber configured to accommodate therein the substrate; a processing gas supply configured to supply a processing gas containing moisture into the processing chamber; and a plasma forming unit configured to form the plasma of the processing gas containing the moisture.
    Type: Application
    Filed: May 26, 2022
    Publication date: December 1, 2022
    Inventors: Yuji Mimura, Hiroshi Maeda, Takashi Terada, Masaru Honda, Ryoichi Sakamoto, Yutaka Yamasaki
  • Publication number: 20220351987
    Abstract: A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.
    Type: Application
    Filed: July 19, 2022
    Publication date: November 3, 2022
    Inventors: Yuji Mimura, Hiroshi Maeda, Satoshi Nishimura
  • Patent number: 11424142
    Abstract: A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: August 23, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yuji Mimura, Hiroshi Maeda, Satoshi Nishimura
  • Patent number: 11315789
    Abstract: Described herein is a method of bonding and/or debonding substrates. In one embodiment, at least one of the surfaces of the substrates to be bonded is comprised of an oxide. In one embodiment, the surfaces of both substrates comprise an oxide. A wet etch may then be utilized to debond the substrates by etching away the layers that have been bonded. In one embodiment, a fusion bonding process is utilized to bond two substrates, at least one substrate having a silicon oxide surface. In one exemplary etch, a dilute hydrofluoric (DHF) etch is utilized to etch the bonded silicon oxide surface, allowing for two bonded substrates to be debonded. In another embodiment, the silicon oxide may be a low density silicon oxide. In one embodiment, both substrates may have a surface layer of the low density silicon oxide which may be fusion bonded together.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: April 26, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kiyotaka Imai, Hirokazu Aizawa, Hiroshi Maeda, Kaoru Maekawa, Yuji Mimura, Harunobu Suenaga
  • Publication number: 20210249287
    Abstract: A measuring method includes measuring a displacement A1, placing an imaging unit 20 at a position where the imaging unit is allowed to image a measurement mark M1 and imaging the measurement mark M1. In the measuring of the displacement A1, the displacement A1 of a surface of a combined substrate, which is composed of two sheets of substrates bonded to each other, on a side of the imaging unit 20 at a position where the measurement mark M1 for position deviation measurement, which is provided within the combined substrate, is placed is measured. In the imaging of the measurement mark M1, the measurement mark M1 is imaged by the imaging unit 20 while putting the measurement mark M1 in focus by moving a focal position back and forth with respect to a focal position which is previously set based on the displacement A1.
    Type: Application
    Filed: April 10, 2019
    Publication date: August 12, 2021
    Inventors: Yuji Mimura, Shigeto Tsuruta, Eiji Manabe, Hisanori Hizume
  • Publication number: 20200343092
    Abstract: Described herein is a method of bonding and/or debonding substrates. In one embodiment, at least one of the surfaces of the substrates to be bonded is comprised of an oxide. In one embodiment, the surfaces of both substrates comprise an oxide. A wet etch may then be utilized to debond the substrates by etching away the layers that have been bonded. In one embodiment, a fusion bonding process is utilized to bond two substrates, at least one substrate having a silicon oxide surface. In one exemplary etch, a dilute hydrofluoric (DHF) etch is utilized to etch the bonded silicon oxide surface, allowing for two bonded substrates to be debonded. In another embodiment, the silicon oxide may be a low density silicon oxide. In one embodiment, both substrates may have a surface layer of the low density silicon oxide which may be fusion bonded together.
    Type: Application
    Filed: September 17, 2019
    Publication date: October 29, 2020
    Inventors: Kiyotaka Imai, Hirokazu Aizawa, Hiroshi Maeda, Kaoru Maekawa, Yuji Mimura, Harunobu Suenaga
  • Publication number: 20200294824
    Abstract: A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.
    Type: Application
    Filed: March 10, 2020
    Publication date: September 17, 2020
    Inventors: Yuji Mimura, Hiroshi Maeda, Satoshi Nishimura
  • Patent number: 10340248
    Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: July 2, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Masataka Matsunaga, Takashi Koga, Takeshi Tamura, Takahiro Masunaga, Yuji Mimura, Masaru Honda, Toshifumi Inamasu, Satoshi Nishimura
  • Publication number: 20180019225
    Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.
    Type: Application
    Filed: July 7, 2017
    Publication date: January 18, 2018
    Inventors: Masataka MATSUNAGA, Takashi KOGA, Takeshi TAMURA, Takahiro MASUNAGA, Yuji MIMURA, Masaru HONDA, Toshifumi INAMASU, Satoshi NISHIMURA
  • Patent number: 9741595
    Abstract: There is provided a method of bonding substrates to each other, which includes: holding a first substrate on a lower surface of a first holding part; adjusting a temperature of a second substrate by a temperature adjusting part to become higher than a temperature of the first substrate; holding the second substrate on an upper surface of a second holding part; inspecting a state of the second substrate by imaging a plurality of reference points of the second substrate with a first imaging part, measuring positions of the reference points, and comparing a measurement result with a predetermined permissible range; and pressing a central portion of the first substrate with a pressing member, bringing the central portion of the first substrate into contact with a central portion of the second substrate, and sequentially bonding the first substrate and the second substrate.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: August 22, 2017
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kenji Sugakawa, Yuji Mimura, Shuhei Matsumoto, Takahiro Masunaga, Makoto Tsukishima
  • Patent number: 9401291
    Abstract: A coating apparatus includes: a slit nozzle including a retention chamber that retains the coating material; a moving mechanism that moves the slit nozzle; a pressure regulation unit that regulates a pressure inside the retention chamber; and a control unit that controls the moving mechanism and the pressure regulation unit to relatively move the slit nozzle with respect to the substrate while changing the pressure inside the retention chamber toward an atmospheric pressure from a negative pressure, wherein the control unit is configured to control the pressure regulation unit so that a change in the pressure inside the retention chamber in a start zone including a coating start position and an end zone including a coating end position becomes slower than a change in the pressure inside the retention chamber in a middle zone except the start zone and the end zone.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: July 26, 2016
    Assignee: Tokyo Electron Limited
    Inventors: Yuji Mimura, Tetsuya Maki, Shigeto Tsuruta, Tatsumi Oonishi, Daisuke Ikemoto, Takahiro Masunaga