Patents by Inventor Yuji Miura

Yuji Miura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240109552
    Abstract: According to an embodiment, a driving assistance device includes a recognizer configured to recognize a surrounding situation of a mobile object, a decider configured to decide whether or not to prompt a driver of the mobile object to perform acceleration or deceleration on the basis of the surrounding situation, and a notification controller configured to cause a speaker to output a notification sound for prompting the driver of the mobile object to perform the acceleration or deceleration on the basis of a decision result. The notification sound is a notification sound obtained by continuously changing a structure of a sound.
    Type: Application
    Filed: September 27, 2023
    Publication date: April 4, 2024
    Inventors: Kosuke Toda, Yuji Yasui, Takeru Goto, Aya Miura, Kenjiro Torii, Keming Ding
  • Publication number: 20230147149
    Abstract: The method includes: determine a first integrated value by integrating measured values of widths of reference patterns (210A) belonging to a first group; determine a second integrated value by integrating measured values of widths of reference patterns (210B) belonging to a second group; performing second matching between patterns on an image of a second region and corresponding CAD patterns; determining a third integrated value by integrating measured values of widths of patterns (220A) belonging to a first group; determining a fourth integrated value by integrating measured values of widths of patterns (220B) belonging to a second group; and determining that the second matching has been performed correctly when the magnitude relationship between the third integrated value and the fourth integrated value coincides with the magnitude relationship between the first integrated value and the second integrated value.
    Type: Application
    Filed: April 9, 2021
    Publication date: May 11, 2023
    Inventor: Yuji MIURA
  • Patent number: 10589369
    Abstract: To provide an electrode wire for electrical discharge machining including ?-brass and ?-brass arranged on an outer peripheral surface of a core and a method of manufacturing the electrode wire, capable of enhancing wire connection performance and cutting down manufacturing cost while trying to increase a processing speed. The electrode wire for electrical discharge machining according to this invention comprises: an external layer including ?-brass and ?-brass; and a core having an undulating shape formed at a boundary surface with the external layer. The ?-brass and the ?-brass are arranged densely and sparsely at the boundary surface of the undulating shape.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: March 17, 2020
    Assignees: OKI ELECTRIC CABLE CO., LTD., MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yoichiro Kimoto, Yuji Miura, Yuki Hashimoto, Hengbo Su, Takayuki Nakagawa, Yoshikazu Ukai
  • Publication number: 20170320153
    Abstract: To provide an electrode wire for electrical discharge machining including ?-brass and ?-brass arranged on an outer peripheral surface of a core and a method of manufacturing the electrode wire, capable of enhancing wire connection performance and cutting down manufacturing cost while trying to increase a processing speed. The electrode wire for electrical discharge machining according to this invention comprises: an external layer including ?-brass and ?-brass; and a core having an undulating shape formed at a boundary surface with the external layer. The ?-brass and the ?-brass are arranged densely and sparsely at the boundary surface of the undulating shape.
    Type: Application
    Filed: October 28, 2015
    Publication date: November 9, 2017
    Applicants: MITSUBISHI ELECTRIC CORPORATION, OKI ELECTRIC CABLE CO., LTD.
    Inventors: YOICHIRO KIMOTO, YUJI MIURA, YUKI HASHIMOTO, HENGBO SU, TAKAYUKI NAKAGAWA, YOSHIKAZU UKAI
  • Publication number: 20130154681
    Abstract: A substrate inspection jig for use in inspection of an electrical property of a printed board to be inspected on which an electronic component is mounted includes a spacer which is mounted on the printed board to be inspected, a conductive plate which is connected to the spacer, and is disposed along an arrangement direction of electrode terminals of the electronic component to be inspected, and a fastener which fastens the spacer on the printed board to be inspected, wherein the plate is disposed above the printed board to be inspected so as to avoid contact with the printed board to be inspected, and a predetermined potential of the printed board to be inspected is set to the plate through the spacer or/and the fastener.
    Type: Application
    Filed: December 14, 2012
    Publication date: June 20, 2013
    Applicant: RICOH COMPANY, LTD.
    Inventors: Keishi Miyanishi, Yuji Miura, Shinji Nagai, Tomohiko Shiki, Tadayoshi Shibasaki, Hideo Watanabe, Katsuhiro Tanabe, Hiroyuki Inakazu, Yasukazu Sadakane, Tomoko Kawakami
  • Patent number: 6111021
    Abstract: A vulcanizable rubber composition comprising a blend which is prepared by micro-dispersing a polyolefin resin (B) in an ethylene-.alpha.-olefin-nonconjugated polyene copolymer rubber (A) comprising ethylene, a C.sub.3 -C.sub.20 .alpha.-olefin and a nonconjugated polyene in a molten state and in which the mean diameter of dispersed particles of the polyolefin resin (B) is 2 .mu.m or below and the (B) to (A) weight ratio ranges from 5/95 to 50/50. The micro-dispersion of a polyolefin resin (B) can easily be attained by kneading the components (A) and (B) together with compounding ingredients (such as reinforcement, filler, softener, vulcanization accelerator, vulcanizing agent and so on) in a rubber kneader, through the resin (B) is essentially difficult of micro-dispersion. Further, the composition enables the provision of rubber articles having a high and constant quality at a low cost, because the resin (B) can well be dispersed by conventional rubber kneaders in a short time without fail.
    Type: Grant
    Filed: January 2, 1998
    Date of Patent: August 29, 2000
    Assignee: Mitsui Chemicals Inc
    Inventors: Hidenari Nakahama, Masaaki Kawasaki, Yuji Ishii, Tetsuo Tojo, Taku Koda, Yoshio Maejima, Yuji Miura, Yasuhiro Hosomi
  • Patent number: 5809301
    Abstract: An information processing system in which a plurality of information processing apparatuses perform inter-communication with each other. A first information processing apparatus defines information processes and adds identifiers to the information processes. A second information processing apparatus processes the information defined by the first information process in accordance with selected identifiers.
    Type: Grant
    Filed: May 16, 1995
    Date of Patent: September 15, 1998
    Assignee: Ricoh Company, Ltd.
    Inventor: Yuji Miura
  • Patent number: 4398457
    Abstract: A marking apparatus is for marking at least one plastics encapsulated semiconductor device with marking-obstructive substances thereon. The marking apparatus comprises a conveying mechanism for conveying the semiconductor device, a pretreatment mechanism for removing the marking-obstructive substances on the semiconductor device conveyed thereto by the conveying mechanism, a stamping mechanism for stamping a mark on the semiconductor device removed of the marking-obstructive substances by the pretreatment mechanism and transferred thereto by the conveying mechanism, and a fixing mechanism for fixing the mark stamped on the semiconductor device transferred thereto by the conveying mechanism.
    Type: Grant
    Filed: June 23, 1981
    Date of Patent: August 16, 1983
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Fumio Takahashi, Yuji Miura
  • Patent number: 4186382
    Abstract: In a switching network having cross-points constituted by semiconductor switch elements of four-layer structure of PNPN, communication channels are connected in an unbalanced configuration, and all vertical or column buses and horizontal or row buses constituting the switching matrix are individually grounded through respective capacitors, whereby the semiconductor switch elements are inhibited from erroneous firings due to application of voltages having a high raise-up rate such as high frequency noises, thereby to protect the switching network from erroneous switching operations without increasing cross-talk.
    Type: Grant
    Filed: May 10, 1977
    Date of Patent: January 29, 1980
    Assignee: Hitachi, Ltd.
    Inventors: Hidetaka Yamashita, Yuji Miura
  • Patent number: 4151374
    Abstract: A bus connection detector circuit used for a switching network comprising a plurality of semiconductor switch elements of PNPN semiconductor four-layered structure, which are arranged in a matrix array and adapted to conduct upon the application of a potential thereacross. A plurality of diodes are connected at their one end to horizontal and vertical buses, respectively, and connected at their other end in common to one end of a voltage regulating diode for detection of the potential of the buses, and the other end of the voltage regulating diode is connected to a voltage level sensor, thus making up a single bus connection detector circuit, so that the connection of each bus can be detected by the single bus connection detector circuit.
    Type: Grant
    Filed: May 9, 1977
    Date of Patent: April 24, 1979
    Assignee: Hitachi, Ltd.
    Inventors: Takeshi Fukuhara, Yuji Miura