Patents by Inventor Yuji Miwa
Yuji Miwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10659002Abstract: An elastic wave device includes a lamination layer film including a piezoelectric thin film on a support substrate. The lamination layer film is not partially present in a region located in an outer side portion of a region where IDT electrodes are provided. A first insulation layer extends from at least a portion of a region where the lamination layer film is not present to an upper portion of the piezoelectric thin film. A wiring electrode has a width of about 6 ?m and extends from the upper portion of the piezoelectric thin film to an upper portion of the first insulation layer, and extends onto a section of the first insulation layer in the region.Type: GrantFiled: August 22, 2018Date of Patent: May 19, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Koji Yamamoto, Tsutomu Takai, Seiji Kai, Hisashi Yamazaki, Yuji Miwa, Takashi Yamane, Noriyoshi Ota, Atsushi Tanaka
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Patent number: 10659001Abstract: An elastic wave device includes a lamination layer film including a piezoelectric thin film on a support substrate. The lamination layer film is not partially present in a region located in an outer side portion of a region where IDT electrodes are provided. A first insulation layer extends from at least a portion of a region where the lamination layer film is not present to an upper portion of the piezoelectric thin film. A wiring electrode extends from the upper portion of the piezoelectric thin film to an upper portion of the first insulation layer, and extends onto a section of the first insulation layer in the region.Type: GrantFiled: December 5, 2017Date of Patent: May 19, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Koji Yamamoto, Tsutomu Takai, Seiji Kai, Hisashi Yamazaki, Yuji Miwa, Takashi Yamane
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Patent number: 10320362Abstract: An elastic wave device includes a multilayer film provided on a support substrate and including a piezoelectric thin film and a layer other than the piezoelectric thin film, an interdigital transducer electrode provided on one surface of the piezoelectric thin film, and an external connection terminal electrically connected to the interdigital transducer electrode. In a plan view, the multilayer film is partially absent or omitted in a region outside a region where the interdigital transducer electrode is provided, and the elastic wave device further includes a first insulating layer provided on the support substrate in at least a portion of a region where the multilayer film is absent or omitted.Type: GrantFiled: June 2, 2016Date of Patent: June 11, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Taku Kikuchi, Shin Saijo, Hisashi Yamazaki, Masahiro Fukushima, Yuji Miwa
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Patent number: 10250220Abstract: An elastic wave device includes a piezoelectric substrate, an IDT electrode, wiring, a pad, an under bump metal, a first dielectric layer, and a second dielectric layer. At least a portion of the IDT electrode includes a first electrically conductive film, at least a portion of the wiring includes a multilayer body including the first electrically conductive film and a second electrically conductive film, and at least a portion of the pad includes the second electrically conductive film. The second dielectric layer covers the region other than the contact region between the second electrically conductive film and the under bump metal. Consequently, the second electrically conductive film is covered with the second dielectric layer and the under bump metal and is not exposed to air.Type: GrantFiled: February 3, 2016Date of Patent: April 2, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yuji Miwa, Hijiri Sumii, Junpei Yasuda, Taku Kikuchi, Hisashi Yamazaki
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Publication number: 20180358950Abstract: An elastic wave device includes a lamination layer film including a piezoelectric thin film on a support substrate. The lamination layer film is not partially present in a region located in an outer side portion of a region where IDT electrodes are provided. A first insulation layer extends from at least a portion of a region where the lamination layer film is not present to an upper portion of the piezoelectric thin film. A wiring electrode has a width of about 6 ?m and extends from the upper portion of the piezoelectric thin film to an upper portion of the first insulation layer, and extends onto a section of the first insulation layer in the region.Type: ApplicationFiled: August 22, 2018Publication date: December 13, 2018Inventors: Koji YAMAMOTO, Tsutomu TAKAI, Seiji KAI, Hisashi YAMAZAKI, Yuji MIWA, Takashi YAMANE, Noriyoshi OTA, Atsushi TANAKA
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Publication number: 20180097502Abstract: An elastic wave device includes a lamination layer film including a piezoelectric thin film on a support substrate. The lamination layer film is not partially present in a region located in an outer side portion of a region where IDT electrodes are provided. A first insulation layer extends from at least a portion of a region where the lamination layer film is not present to an upper portion of the piezoelectric thin film. A wiring electrode extends from the upper portion of the piezoelectric thin film to an upper portion of the first insulation layer, and extends onto a section of the first insulation layer in the region.Type: ApplicationFiled: December 5, 2017Publication date: April 5, 2018Inventors: Koji Yamamoto, Tsutomu Takai, Seiji Kai, Hisashi Yamazaki, Yuji Miwa, Takashi Yamane
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Publication number: 20160277003Abstract: An elastic wave device includes a multilayer film provided on a support substrate and including a piezoelectric thin film and a layer other than the piezoelectric thin film, an interdigital transducer electrode provided on one surface of the piezoelectric thin film, and an external connection terminal electrically connected to the interdigital transducer electrode. In a plan view, the multilayer film is partially absent or omitted in a region outside a region where the interdigital transducer electrode is provided, and the elastic wave device further includes a first insulating layer provided on the support substrate in at least a portion of a region where the multilayer film is absent or omitted.Type: ApplicationFiled: June 2, 2016Publication date: September 22, 2016Inventors: Taku KIKUCHI, Shin SAIJO, Hisashi YAMAZAKI, Masahiro FUKUSHIMA, Yuji MIWA
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Publication number: 20160156331Abstract: An elastic wave device includes a piezoelectric substrate, an IDT electrode, wiring, a pad, an under bump metal, a first dielectric layer, and a second dielectric layer. At least a portion of the IDT electrode includes a first electrically conductive film, at least a portion of the wiring includes a multilayer body including the first electrically conductive film and a second electrically conductive film, and at least a portion of the pad includes the second electrically conductive film. The second dielectric layer covers the region other than the contact region between the second electrically conductive film and the under bump metal. Consequently, the second electrically conductive film is covered with the second dielectric layer and the under bump metal and is not exposed to air.Type: ApplicationFiled: February 3, 2016Publication date: June 2, 2016Inventors: Yuji MIWA, Hijiri SUMII, Junpei YASUDA, Taku KIKUCHI, Hisashi YAMAZAKI
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Patent number: 7798617Abstract: An inkjet recording apparatus includes a passage unit in which individual ink passages are formed, an actuator unit fixed to the passage unit, a flat flexible substrate, and a drive signal outputting unit. The actuator unit includes individual electrodes, a common electrode, a piezoelectric layer, and individual lands. The flat flexible substrate includes output terminals connected to the respective individual lands, and a check terminal bonded to a bonding face of the actuator unit. The drive signal outputting unit outputs drive signals to be supplied to the individual electrodes via the respective output terminals. Based on a measurement result of an electrical characteristic with respect to the check terminal, it is judged whether the check terminal has been peeled off from the bonding face of the actuator unit.Type: GrantFiled: February 5, 2008Date of Patent: September 21, 2010Assignee: Brother Kogyo Kabushiki KaishaInventors: Koji Ito, Yuji Miwa
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Publication number: 20080186342Abstract: An inkjet recording apparatus includes a passage unit in which individual ink passages are formed, an actuator unit fixed to the passage unit, a flat flexible substrate, and a drive signal outputting unit. The actuator unit includes individual electrodes, a common electrode, a piezoelectric layer, and individual lands. The flat flexible substrate includes output terminals connected to the respective individual lands, and a check terminal bonded to a bonding face of the actuator unit. The drive signal outputting unit outputs drive signals to be supplied to the individual electrodes via the respective output terminals. Based on a measurement result of an electrical characteristic with respect to the check terminal, it is judged whether the check terminal has been peeled off from the bonding face of the actuator unit.Type: ApplicationFiled: February 5, 2008Publication date: August 7, 2008Applicant: BROTHER KOGYO KABUSHIKI KAISHAInventors: Koji Ito, Yuji Miwa
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Publication number: 20080108018Abstract: An artificial tooth is bonded to a malformed tooth without cutting the tooth, whereby a row of teeth is changed in a rapid and straightforward manner. The muscles surrounding the mouth cavity are pushed by the artificial tooth, thereby changing the appearance of the face. The present invention provides a bonding tooth (1) that is bonded to a tooth (T) in a row of malformed teeth so that muscles of the mouth in front of the maxillary and mandibular bodies, which muscles constitute most of the mouth muscles that control the appearance of the mouth, are subjected to pressure from an interior of the mouth cavity, and the appearance of the mouth is caused to change.Type: ApplicationFiled: December 8, 2006Publication date: May 8, 2008Inventor: Yuji Miwa
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Patent number: 5828820Abstract: There is provided by the present invention a mirror disk device, in which specific numbers identical to those written in disks and name of a drive used as for a master disk are recorded in a set-up memory incorporated therein, this data is compared to a specific number written in a disk to determine a master disk or to transfer data to a slave disk. In the mirror disk according to the present invention, ranges of specific numbers are discretely defined without any conflict according to switching positions of a rotary switch. A first specific number is decided within each of the ranges by a random function and then serial numbers subsequent to the first specific number are assigned as specific numbers. With this feature, it is possible to prevent effective data from being lost due to, for instance, instruction miss because of manual operation.Type: GrantFiled: July 19, 1995Date of Patent: October 27, 1998Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Sakuyuki Onishi, Yuji Miwa
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Patent number: 5285045Abstract: A laser processing apparatus which is high in production efficiency, and capable of easily and automatically changing processing heads from one to another according to the type of the thermal processing to be done is disclosed. The laser processing apparatus includes a plurality of processing heads composed of a processing head for cutting work, a processing head for welding work and a processing head for hardening work. The laser processing apparatus moves one processing head toward a processing position with respect to the frame having a laser beam generator by a processing head driving unit. The apparatus includes a workpiece moving system for moving a workpiece with respect to the processing head positioned in the processing position. Therefore, a compact laser processing apparatus, high in production efficiency, and which is capable of selecting an optimum processing head from processing heads according to the type of the thermal processing to be done, results.Type: GrantFiled: July 31, 1992Date of Patent: February 8, 1994Assignee: Brother Kogyo Kabushiki KaishaInventors: Susumu Ito, Hikoharu Aoki, Yuji Miwa, Akihiko Oshima
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Patent number: 5187900Abstract: An auxiliary device for a machining tool that converts a standard rotary machining tool into an oscillation-machining tool. The device has a chuck, or other workpiece gripping device, at an upper end of a shaft. The shaft may be rotated around an axis parallel to the axis of the rotary machining tool and may be oscillated along the rotary axis. The degree of oscillation may be adjusted dependent on the length of the surface to be machined.Type: GrantFiled: September 26, 1991Date of Patent: February 23, 1993Assignee: Brother Kogyo Kabushiki KaishaInventor: Yuji Miwa
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Patent number: 5144771Abstract: In an ultrasonic machine including an ultrasonic horn connected with a piezoelectric transducer and a machining liquid passage, a tool mounted on the ultrasonic horn and provided with a bore inside thereof that communicates with the machining liquid passage, the ultrasonic machine comprising: a fixed side member fixed to the machining body and having a machining liquid supply passage, an annular groove; a horn communication passage communicating with the machining liquid passage; a first thin portion provided near the opening; a pressure chamber drop means provided near the first thin portion; a drain provided in the fixed side member and communicating with the pressure chamber drop means; a second thin portion provided near the pressure chamber drop means; and an air supply passage provided in the fixed side member and communicating with the second thin portion.Type: GrantFiled: January 28, 1991Date of Patent: September 8, 1992Assignee: Brother Kogyo Kabushiki KaishaInventor: Yuji Miwa
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Patent number: 5140773Abstract: This invention is directed to an ultrasonic machine and its method of operation. The machine has a main shaft rotatably supported in a housing, a machining head attached to one end of the main shaft, a piezoelectric transducer provided on the machining head, and a tool attached to an end of the machining head. The machine also includes slip rings provided on the periphery of either the machining head or the main shaft as an input terminal, brushes being in slidable touch with the slip rings and connected to a power source, and a brush detach apparatus for detaching the brushes from the slip rings to reduce friction and disconnect ultrasonic operation. The tool is rotated and pressed onto the work, hence starting a boring operation. After the rotation forms a pre-determined depth of a bore, the tool is ultrasonically vibrated to bore further into the work. The method and apparatus are particularly suited to boring small holes in ceramics and the like.Type: GrantFiled: February 5, 1991Date of Patent: August 25, 1992Assignee: Brother Kogyo Kabushiki KaishaInventors: Yuji Miwa, Hideki Takabayashi
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Patent number: 5058927Abstract: A fluid coupling device of non-contact type having a stationary main coupling body and a rotary shaft rotatably supported through bearings to the coupling body and formed with an axial fluid passage extending along a length thereof. A minute space is provided at an end portion of the rotary shaft relative to the coupling body, and a pressure reduction chamber is defined beside the minute space for reducing a pressure of fluid leaking thereinto through the first minute space. A second minute space is provided between an outer peripheral surface of the rotary shaft and an inner peripheral surface of the coupling body. The second minute space is in fluid communication with the pressure reduction chamber and is applied with a pneumatic pressure for blocking the bearing against entry of the leaked fluid.Type: GrantFiled: June 18, 1990Date of Patent: October 22, 1991Assignee: Brother Kogyo Kabushiki KaishaInventor: Yuji Miwa
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Patent number: 4921376Abstract: An arbor for mounting a tool such as a drill or a grindstone to the end of a spindle of a machine tool and a machining method of employing such arbor. The arbor comprises a lubricant receiving member provided in the main body for receiving a lubricant supplied, and a lubricant passageway provided in the main body and extending between the lubricant receiving member and the tool mounting portion for flowing the lubricant from the lubricant receiving member to the tool mounting portion so as to supply the lubricant into an interior of the tool. The lubricant supplied from the spindle or another source of supply is allowed to flow through the lubricant receiving member and the lubricant passageway, and is supplied into an interior of the tool to ensure the appropriate supply of the lubricant to the area in which the tool acts upon the workpiece.Type: GrantFiled: April 26, 1989Date of Patent: May 1, 1990Assignee: Brother Kogyo Kabushiki KaishaInventors: Naohiko Tani, Masahiro Kouda, Atsushi Ito, Yuji Miwa