Abstract: Provided are a stator for a rotary electric machine and the rotary electric machine. The stator includes a stator core, and a stator winding formed in a plurality of phases, the stator winding including a slot conductor and a crossover conductor configured to connect ends of a pair of the slot conductors, the ends placed at a same side of the pair of slot conductors.

Abstract: A vehicle drive device includes: a rotating electrical machine; a speed change mechanism including an input member and an output member drivingly connected to wheels, and configured to change a speed ratio between the input member and the output member; a friction engagement device interposed between the rotating electrical machine and the input member and including a friction engagement element configured to connect and disconnect power transmission between the rotating electrical machine and the input member as an engagement pressure is supplied and discharged; and a control device that controls the rotating electrical machine and the friction engagement device.

Abstract: A plurality of chip stack devices having different external sizes can be tested accurately and efficiently with low cost. The present invention provides a chip stack device testing method testing a chip stack device configured by stacking a plurality of chips separated by dicing a substrate under test tested in a testing unit. A tray for chip stack devices having equal shape and external dimension to those of the undiced substrate under test is used, one or a plurality of the chip stack devices are attached and supported to an adhesive layer of the tray for chip stack devices to align the chip stack devices with positions of the respective chips of the undiced substrate under test, the tray for chip stack devices is installed in the testing unit in a similar manner to that in a test of the substrate under test, and the respective chip stack devices are tested.

Abstract: A plurality of chip stack devices having different external sizes can be tested accurately and efficiently with low cost. The present invention provides a chip stack device testing method testing a chip stack device configured by stacking a plurality of chips separated by dicing a substrate under test tested in a testing unit. A tray for chip stack devices having equal shape and external dimension to those of the undiced substrate under test is used, one or a plurality of the chip stack devices are attached and supported to an adhesive layer of the tray for chip stack devices to align the chip stack devices with positions of the respective chips of the undiced substrate under test, the tray for chip stack devices is installed in the testing unit in a similar manner to that in a test of the substrate under test, and the respective chip stack devices are tested.

Abstract: A probe having an alignment mark that is hardly influenced by scraps of an electrode scraped by a probe tip is provided. A probe according to the present invention comprises a base portion having an attaching end and extending in a direction distanced from the attaching end, an arm portion extending from the base portion laterally with a space in the extending direction of the base portion from the attaching end, a probe tip portion protruded from the arm portion and having a probe tip formed on its protruding end, and an alignment mark for alignment of the probe tip. The arm portion has a flat surface area on the opposite side of a side where the attaching end of the base portion is located when seen along the extending direction of the arm portion. The probe tip portion is formed to be protruded from the flat surface area, and the alignment mark is constituted by at least a part of the flat surface area.

Abstract: A probe having an alignment mark that is hardly influenced by scraps of an electrode scraped by a probe tip is provided. A probe according to the present invention comprises a base portion having an attaching end and extending in a direction distanced from the attaching end, an arm portion extending from the base portion laterally with a space in the extending direction of the base portion from the attaching end, a probe tip portion protruded from the arm portion and having a probe tip formed on its protruding end, and an alignment mark for alignment of the probe tip. The arm portion has a flat surface area on the opposite side of a side where the attaching end of the base portion is located when seen along the extending direction of the arm portion. The probe tip portion is formed to be protruded from the flat surface area, and the alignment mark is constituted by at least a part of the flat surface area.

Abstract: A probe assembly for use in electrical measurement of a device under test. The probe assembly comprises a plate-like probe base plate with bending deformation produced in a free state without load, and a plurality of probes formed on one face of the probe base plate to project from the face. All the tips of the probes are positioned on the same plane parallel to an imaginary reference plane of the probe base plate.

Abstract: A probe for electrical test provided with positioning marks parallel to a plane where tips are provided and at a height position lower than the plane on a plane directed in the same direction as the plane, the positioning marks are in a predetermined positional relation to said tips. The positioning marks contain information indicating an existing direction of the tips when the positioning marks are observed from the projecting direction of the tips.

Abstract: A mounting apparatus that does not compromise the strength of a probe board. The apparatus comprises a probe board spaced from a support member by a spacer. A fixed portion with a female screw hole is mounted on one surface of the probe board. A male screw member is threaded into the screw hole for the purpose of tightening the support member to the probe board at a fixed distance defined by the length of the spacer. The probe board has a support plate. Pluralities of conductive paths penetrate the support plate. A wiring plate wherein wiring paths are connected to corresponding conductive paths, and whose one surface is fixed to the support plate. The other surface is provided with probes corresponding to the wiring paths. The fixed portion includes a female screw member at an area where no conductive paths are formed.

Abstract: A wiring path of a circuit board has a first vertical path portion penetrating the circuit board at its outer edge in its thickness direction and connected to a connector on one surface, a second vertical path portion penetrating the circuit board in its thickness direction and connected to the electric coupler on the other surface, and a lateral path portion connecting both vertical portions, and the second vertical path portion is formed within an arrangement area (S1) of a reinforcing plate. One connecting end portion (electric coupler side) of the wiring path of the circuit board is disposed within the arrangement area (S1) of the reinforcing plate. On the other hand, the other connecting end portion (probe side) of the wiring path of the circuit board is disposed to be dispersed in an arrangement area (S2) wider than the arrangement area (S1) of the reinforcing plate.

Abstract: A probe assembly for use in electrical measurement of a device under test. The probe assembly comprises a plate-like probe base plate with bending deformation produced in a free state without load, and a plurality of probes formed on one face of the probe base plate to project from the face. All the tips of the probes are positioned on the same plane parallel to an imaginary reference plane of the probe base plate.

Abstract: A probe for electrical test provided with positioning marks parallel to a plane where tips are provided and at a height position lower than the plane on a plane directed in the same direction as the plane, the positioning marks are in a predetermined positional relation to said tips. The positioning marks contain information indicating an existing direction of the tips when the positioning marks are observed from the projecting direction of the tips.

Abstract: The present invention provides an electrical connecting apparatus that does not cause lack of mechanical strength in a probe board. The electrical connecting apparatus comprises a probe board spaced from a support member and arranged with its one surface opposed to the support member. On one surface of the probe board is provided a fixed portion having an opened screw hole at its top portion, and on the other surface are provided probes that are connected to a tester. The electrical connecting apparatus comprises a cylindrical spacer keeping a distance from the support member to a top surface of the fixed portion and a male screw member screwed in the screw hole for the purpose of tightening the support member and the probe board at a distance in accordance with the length of the spacer.

Abstract: An electrical connecting apparatus comprising: a circuit board on which a reinforcing plate is mounted and a plurality of first electric connections are provided; a probe board on which second electric connections corresponding to the first electric connections are provided, with a plurality of probes electrically connected to the corresponding second electric connections; an elastic connector having plural pairs of both contacts capable of contacting the first and second electric connections corresponding to each other of both boards therebetween and receiving a biasing force in directions for both contacts to separate from each other; screw members for integrally combining them; and a spacer member for holding the probe tips substantially on the same plane by tightening of the screw members. Between the reinforcing plate and the probe board, a spacer plate is inserted for adjusting a distance from the other surface of the probe board to the probe tips.

Abstract: The present invention provides a cleaning apparatus capable of removing foreign matters attached to a tip of a probe effectively without impairing the durability of the probe. The cleaning apparatus for the probe comprises a base plate having a rough surface and a surface layer formed to conform to and cover the rough surface for the purpose of providing a polishing surface for the probe and having lower hardness than hardness of the probe tip of the probe.

Abstract: A probe having a first and a second arm portion extending between first and second connecting portions connecting the first and second arm portions respectively at their front end portion and base end portion, and a needle point portion below the first connecting portion. At least one of the entire first and second arm portions or the upper or lower edge portions of the first and second arm portions are arcuate.

Abstract: To restrain misregistration of tips due to change in temperature, an electrical connecting apparatus is used for connection of a tester, and electrical connection terminals of a device under test to undergo electrical test by the tester. The electrical connecting apparatus comprises a probe board having a plurality of probe lands on its underside; and a plurality of contacts having tip portions to be brought into contact with a base end portion fixed at the respective probe lands and the connection terminals of the device under test. The measure from the tip of each contact and the probe land ranges from 1.1 to 1.3 mm, and the coefficient of thermal expansion of the probe board is greater than the coefficient of thermal expansion of the device under test within the range from 1 to 2 ppm/° C.

Abstract: An electrical connecting apparatus comprising: a circuit board on which a reinforcing plate is mounted and a plurality of first electric connections are provided; a probe board on which second electric connections corresponding to the first electric connections are provided, with a plurality of probes electrically connected to the corresponding second electric connections; an elastic connector having plural pairs of both contacts capable of contacting the first and second electric connections corresponding to each other of both boards therebetween and receiving a biasing force in directions for both contacts to separate from each other; screw members for integrally combining them; and a spacer member for holding the probe tips substantially on the same plane by tightening of the screw members. Between the reinforcing plate and the probe board, a spacer plate is inserted for adjusting a distance from the other surface of the probe board to the probe tips.

Abstract: A wiring path of a circuit board has a first vertical path portion penetrating the circuit board at its outer edge in its thickness direction and connected to a connector on one surface, a second vertical path portion penetrating the circuit board in its thickness direction and connected to the electric coupler on the other surface, and a lateral path portion connecting both vertical portions, and the second vertical path portion is formed within an arrangement area (S1) of a reinforcing plate. One connecting end portion (electric coupler side) of the wiring path of the circuit board is disposed within the arrangement area (S1) of the reinforcing plate. On the other hand, the other connecting end portion (probe side) of the wiring path of the circuit board is disposed to be dispersed in an arrangement area (S2) wider than the arrangement area (S1) of the reinforcing plate.

Abstract: A probe comprises a first and a second arm portions extending in the rightward and leftward direction at a vertical interval, a first and a second connecting portions connecting the first and second arm portions respectively at their front end portion and base end portion, and a needle point portion following one side in the upward and downward direction of the first connecting portion. At least one of the first and second arm portions has at least one of the whole arm portion, an edge portion on one side in the upward and downward direction of the arm portion, and an edge portion on the other side in the upward and downward direction of the arm portion made arcuate.