Patents by Inventor Yuji Miyoshi

Yuji Miyoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130258351
    Abstract: A surface inspection tool 110 measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200. The surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.
    Type: Application
    Filed: May 28, 2013
    Publication date: October 3, 2013
    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Yuji MIYOSHI, Tomohiro FUNAKOSHI
  • Patent number: 8490385
    Abstract: A catalyst deterioration diagnosis system performs a diagnosis of deterioration of the oxidation catalyst based on a high-temperature-inflow-condition exhaust gas temperature and a low-temperature-inflow-condition exhaust gas temperature. The high-temperature-inflow-condition exhaust gas temperature is a temperature detected by a temperature sensor while the temperature of the exhaust gas that flows into the oxidation catalyst is in a high temperature region H while the reducing agent is supplied from the reducing agent supply means into the exhaust gas that flows into the oxidation catalyst. The low-temperature-inflow-condition exhaust gas temperature is a temperature detected by the temperature sensor while the temperature of the exhaust gas that flows into the oxidation catalyst is in a low temperature region L while the reducing agent is supplied from a reducing agent supply means into the exhaust gas that flows into the oxidation catalyst.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: July 23, 2013
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Yuji Miyoshi, Hiroshi Sawada, Daisuke Shibata
  • Patent number: 8462352
    Abstract: A surface inspection tool 110 measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200. The surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: June 11, 2013
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Yuji Miyoshi, Tomohiro Funakoshi
  • Patent number: 8302378
    Abstract: A temperature increasing degree of the catalytic outflow exhaust temperature at the time the exhaust air-fuel ratio is changed to the rich side is found in respect to each of a plurality of the catalytic inflow exhaust temperatures. A grade (S) of the temperature increasing degree is found based upon the inflow exhaust temperature and the temperature increasing degree to determine degradation of the catalyst based upon at least one of a maximum value (Smax) of the grade and the inflow exhaust temperature (Tinmax) corresponding to the maximum value. An accurate catalyst degradation diagnosis can be carried out since not only the temperature increasing degree but also the inflow exhaust temperature are taken into account.
    Type: Grant
    Filed: June 4, 2008
    Date of Patent: November 6, 2012
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Yuji Miyoshi, Daisuke Shibata
  • Publication number: 20120262723
    Abstract: A surface inspection tool 110 measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200. The surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.
    Type: Application
    Filed: April 18, 2012
    Publication date: October 18, 2012
    Applicant: Hitachi High-Technologies Corporation
    Inventors: Yuji MIYOSHI, Tomohiro Funakoshi
  • Patent number: 8189205
    Abstract: An object of the present invention is to provide a surface inspection tool in which a flat inspection range capable of measuring surface roughness of a wafer with patterns with high accuracy and in a nondestructive manner can be searched without visual search. In order to solve the object, in a surface inspection tool 110 which measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200, the surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: May 29, 2012
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Yuji Miyoshi, Tomohiro Funakoshi
  • Publication number: 20110255080
    Abstract: The inspection conditions of a known inspection apparatus necessary for inspection are such that wafers are individually prepared for respective layer types and layer thicknesses, and standard particles having different sizes are applied to all of the wafers. Moreover, the wafers to which standard particles have been applied and which have been prepared for the respective layer types and layer thicknesses are inspected by the inspection apparatus to determine the optimal inspection conditions for the respective layer types and layer thicknesses. Therefore, there are problems that it requires long time and involves high cost to determine the inspection conditions. In the invention, the relation between the layer thickness and the scattering intensity in the inspection apparatus is calculated. The scattering intensity is divided into a plurality of intensity regions, and the inspection conditions optimized for the respective divided regions are determined.
    Type: Application
    Filed: December 14, 2009
    Publication date: October 20, 2011
    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Yuji Miyoshi, Kazuhisa Hasumi
  • Publication number: 20110126517
    Abstract: A catalyst deterioration diagnosis system performs a diagnosis of deterioration of the oxidation catalyst based on a high-temperature-inflow-condition exhaust gas temperature and a low-temperature-inflow-condition exhaust gas temperature. The high-temperature-inflow-condition exhaust gas temperature is a temperature detected by a temperature sensor while the temperature of the exhaust gas that flows into the oxidation catalyst is in a high temperature region H while the reducing agent is supplied from the reducing agent supply means into the exhaust gas that flows into the oxidation catalyst. The low-temperature-inflow-condition exhaust gas temperature is a temperature detected by the temperature sensor while the temperature of the exhaust gas that flows into the oxidation catalyst is in a low temperature region L while the reducing agent is supplied from a reducing agent supply means into the exhaust gas that flows into the oxidation catalyst.
    Type: Application
    Filed: July 22, 2009
    Publication date: June 2, 2011
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yuji Miyoshi, Hiroshi Sawada, Daisuke Shibata
  • Publication number: 20110090512
    Abstract: An object of the present invention is to provide a surface inspection tool in which a flat inspection range capable of measuring surface roughness of a wafer with patterns with high accuracy and in a nondestructive manner can be searched without visual search. In order to solve the object, in a surface inspection tool 110 which measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200, the surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.
    Type: Application
    Filed: December 28, 2010
    Publication date: April 21, 2011
    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Yuji MIYOSHI, Tomohiro Funakoshi
  • Patent number: 7884948
    Abstract: An object of the present invention is to provide a surface inspection tool in which a flat inspection range capable of measuring surface roughness of a wafer with patterns with high accuracy and in a nondestructive manner can be searched without visual search. In order to solve the object, in a surface inspection tool 110 which measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200, the surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.
    Type: Grant
    Filed: January 14, 2009
    Date of Patent: February 8, 2011
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Yuji Miyoshi, Tomohiro Funakoshi
  • Publication number: 20100319318
    Abstract: A temperature increasing degree of the catalytic outflow exhaust temperature at the time the exhaust air-fuel ratio is changed to the rich side is found in respect to each of a plurality of the catalytic inflow exhaust temperatures. A grade (S) of the temperature increasing degree is found based upon the inflow exhaust temperature and the temperature increasing degree to determine degradation of the catalyst based upon at least one of a maximum value (Smax) of the grade and the inflow exhaust temperature (Tinmax) corresponding to the maximum value. An accurate catalyst degradation diagnosis can be carried out since not only the temperature increasing degree but also the inflow exhaust temperature are taken into account.
    Type: Application
    Filed: June 4, 2008
    Publication date: December 23, 2010
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yuji Miyoshi, Daisuke Shibata
  • Publication number: 20090185178
    Abstract: An object of the present invention is to provide a surface inspection tool in which a flat inspection range capable of measuring surface roughness of a wafer with patterns with high accuracy and in a nondestructive manner can be searched without visual search. In order to solve the object, in a surface inspection tool 110 which measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200, the surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.
    Type: Application
    Filed: January 14, 2009
    Publication date: July 23, 2009
    Inventors: Yuji Miyoshi, Tomohiro Funakoshi
  • Patent number: 5336935
    Abstract: An electronic parts mounting apparatus includes a plurality of parallel parts feeder units each of which accommodates a plurality of electronic parts and sequentially feeds the electronic parts to a predetermined parts pickup position; the parts feeder units being arranged in parallel so as to form a parts feeding section; a positioning device for positioning a member on which the electronic parts are to be mounted; a parts mounting device which seizes each of the electronic parts at a predetermined position of the parts feeding section and which mounts each of the electronic parts on the member; and a detection device for detecting a distal end of each of the parts feeder units so as to determine whether a particular parts feeder unit deviates from a present position.
    Type: Grant
    Filed: February 1, 1993
    Date of Patent: August 9, 1994
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Motoshi Shitanda, Takao Eguchi, Yuji Miyoshi
  • Patent number: 5070601
    Abstract: An electronic component mounting apparatus has a movable table on which plural component supply units are arranged in parallel. Each of the component supply units accommodate an electronic component to be mounted on a component mounting member. A guide frame supports the table to move in a direction intersecting perpendicularly to a component supply direction of the component supply unit. A driving shaft is arranged in the direction intersecting perpendicularly to the component supply direction of the component supply unit for moving the table. A positioning device positions the component mounting member. A component mounting device holds the components and mounts the components on the mounting member, and a support member supports the driving shaft at a middle thereof.
    Type: Grant
    Filed: September 24, 1990
    Date of Patent: December 10, 1991
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Motoshi Shitanda, Takao Eguchi, Yuji Miyoshi, Kanji Hata