Patents by Inventor Yuji Miyoshi
Yuji Miyoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20130258351Abstract: A surface inspection tool 110 measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200. The surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.Type: ApplicationFiled: May 28, 2013Publication date: October 3, 2013Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Yuji MIYOSHI, Tomohiro FUNAKOSHI
-
Patent number: 8490385Abstract: A catalyst deterioration diagnosis system performs a diagnosis of deterioration of the oxidation catalyst based on a high-temperature-inflow-condition exhaust gas temperature and a low-temperature-inflow-condition exhaust gas temperature. The high-temperature-inflow-condition exhaust gas temperature is a temperature detected by a temperature sensor while the temperature of the exhaust gas that flows into the oxidation catalyst is in a high temperature region H while the reducing agent is supplied from the reducing agent supply means into the exhaust gas that flows into the oxidation catalyst. The low-temperature-inflow-condition exhaust gas temperature is a temperature detected by the temperature sensor while the temperature of the exhaust gas that flows into the oxidation catalyst is in a low temperature region L while the reducing agent is supplied from a reducing agent supply means into the exhaust gas that flows into the oxidation catalyst.Type: GrantFiled: July 22, 2009Date of Patent: July 23, 2013Assignee: Toyota Jidosha Kabushiki KaishaInventors: Yuji Miyoshi, Hiroshi Sawada, Daisuke Shibata
-
Patent number: 8462352Abstract: A surface inspection tool 110 measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200. The surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.Type: GrantFiled: April 18, 2012Date of Patent: June 11, 2013Assignee: Hitachi High-Technologies CorporationInventors: Yuji Miyoshi, Tomohiro Funakoshi
-
Patent number: 8302378Abstract: A temperature increasing degree of the catalytic outflow exhaust temperature at the time the exhaust air-fuel ratio is changed to the rich side is found in respect to each of a plurality of the catalytic inflow exhaust temperatures. A grade (S) of the temperature increasing degree is found based upon the inflow exhaust temperature and the temperature increasing degree to determine degradation of the catalyst based upon at least one of a maximum value (Smax) of the grade and the inflow exhaust temperature (Tinmax) corresponding to the maximum value. An accurate catalyst degradation diagnosis can be carried out since not only the temperature increasing degree but also the inflow exhaust temperature are taken into account.Type: GrantFiled: June 4, 2008Date of Patent: November 6, 2012Assignee: Toyota Jidosha Kabushiki KaishaInventors: Yuji Miyoshi, Daisuke Shibata
-
Publication number: 20120262723Abstract: A surface inspection tool 110 measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200. The surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.Type: ApplicationFiled: April 18, 2012Publication date: October 18, 2012Applicant: Hitachi High-Technologies CorporationInventors: Yuji MIYOSHI, Tomohiro Funakoshi
-
Patent number: 8189205Abstract: An object of the present invention is to provide a surface inspection tool in which a flat inspection range capable of measuring surface roughness of a wafer with patterns with high accuracy and in a nondestructive manner can be searched without visual search. In order to solve the object, in a surface inspection tool 110 which measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200, the surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.Type: GrantFiled: December 28, 2010Date of Patent: May 29, 2012Assignee: Hitachi High-Technologies CorporationInventors: Yuji Miyoshi, Tomohiro Funakoshi
-
Publication number: 20110255080Abstract: The inspection conditions of a known inspection apparatus necessary for inspection are such that wafers are individually prepared for respective layer types and layer thicknesses, and standard particles having different sizes are applied to all of the wafers. Moreover, the wafers to which standard particles have been applied and which have been prepared for the respective layer types and layer thicknesses are inspected by the inspection apparatus to determine the optimal inspection conditions for the respective layer types and layer thicknesses. Therefore, there are problems that it requires long time and involves high cost to determine the inspection conditions. In the invention, the relation between the layer thickness and the scattering intensity in the inspection apparatus is calculated. The scattering intensity is divided into a plurality of intensity regions, and the inspection conditions optimized for the respective divided regions are determined.Type: ApplicationFiled: December 14, 2009Publication date: October 20, 2011Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Yuji Miyoshi, Kazuhisa Hasumi
-
Publication number: 20110126517Abstract: A catalyst deterioration diagnosis system performs a diagnosis of deterioration of the oxidation catalyst based on a high-temperature-inflow-condition exhaust gas temperature and a low-temperature-inflow-condition exhaust gas temperature. The high-temperature-inflow-condition exhaust gas temperature is a temperature detected by a temperature sensor while the temperature of the exhaust gas that flows into the oxidation catalyst is in a high temperature region H while the reducing agent is supplied from the reducing agent supply means into the exhaust gas that flows into the oxidation catalyst. The low-temperature-inflow-condition exhaust gas temperature is a temperature detected by the temperature sensor while the temperature of the exhaust gas that flows into the oxidation catalyst is in a low temperature region L while the reducing agent is supplied from a reducing agent supply means into the exhaust gas that flows into the oxidation catalyst.Type: ApplicationFiled: July 22, 2009Publication date: June 2, 2011Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yuji Miyoshi, Hiroshi Sawada, Daisuke Shibata
-
Publication number: 20110090512Abstract: An object of the present invention is to provide a surface inspection tool in which a flat inspection range capable of measuring surface roughness of a wafer with patterns with high accuracy and in a nondestructive manner can be searched without visual search. In order to solve the object, in a surface inspection tool 110 which measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200, the surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.Type: ApplicationFiled: December 28, 2010Publication date: April 21, 2011Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Yuji MIYOSHI, Tomohiro Funakoshi
-
Patent number: 7884948Abstract: An object of the present invention is to provide a surface inspection tool in which a flat inspection range capable of measuring surface roughness of a wafer with patterns with high accuracy and in a nondestructive manner can be searched without visual search. In order to solve the object, in a surface inspection tool 110 which measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200, the surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.Type: GrantFiled: January 14, 2009Date of Patent: February 8, 2011Assignee: Hitachi High-Technologies CorporationInventors: Yuji Miyoshi, Tomohiro Funakoshi
-
Publication number: 20100319318Abstract: A temperature increasing degree of the catalytic outflow exhaust temperature at the time the exhaust air-fuel ratio is changed to the rich side is found in respect to each of a plurality of the catalytic inflow exhaust temperatures. A grade (S) of the temperature increasing degree is found based upon the inflow exhaust temperature and the temperature increasing degree to determine degradation of the catalyst based upon at least one of a maximum value (Smax) of the grade and the inflow exhaust temperature (Tinmax) corresponding to the maximum value. An accurate catalyst degradation diagnosis can be carried out since not only the temperature increasing degree but also the inflow exhaust temperature are taken into account.Type: ApplicationFiled: June 4, 2008Publication date: December 23, 2010Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yuji Miyoshi, Daisuke Shibata
-
Publication number: 20090185178Abstract: An object of the present invention is to provide a surface inspection tool in which a flat inspection range capable of measuring surface roughness of a wafer with patterns with high accuracy and in a nondestructive manner can be searched without visual search. In order to solve the object, in a surface inspection tool 110 which measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200, the surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.Type: ApplicationFiled: January 14, 2009Publication date: July 23, 2009Inventors: Yuji Miyoshi, Tomohiro Funakoshi
-
Patent number: 5336935Abstract: An electronic parts mounting apparatus includes a plurality of parallel parts feeder units each of which accommodates a plurality of electronic parts and sequentially feeds the electronic parts to a predetermined parts pickup position; the parts feeder units being arranged in parallel so as to form a parts feeding section; a positioning device for positioning a member on which the electronic parts are to be mounted; a parts mounting device which seizes each of the electronic parts at a predetermined position of the parts feeding section and which mounts each of the electronic parts on the member; and a detection device for detecting a distal end of each of the parts feeder units so as to determine whether a particular parts feeder unit deviates from a present position.Type: GrantFiled: February 1, 1993Date of Patent: August 9, 1994Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Motoshi Shitanda, Takao Eguchi, Yuji Miyoshi
-
Patent number: 5070601Abstract: An electronic component mounting apparatus has a movable table on which plural component supply units are arranged in parallel. Each of the component supply units accommodate an electronic component to be mounted on a component mounting member. A guide frame supports the table to move in a direction intersecting perpendicularly to a component supply direction of the component supply unit. A driving shaft is arranged in the direction intersecting perpendicularly to the component supply direction of the component supply unit for moving the table. A positioning device positions the component mounting member. A component mounting device holds the components and mounts the components on the mounting member, and a support member supports the driving shaft at a middle thereof.Type: GrantFiled: September 24, 1990Date of Patent: December 10, 1991Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Motoshi Shitanda, Takao Eguchi, Yuji Miyoshi, Kanji Hata