Patents by Inventor Yuji Moriya

Yuji Moriya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11932240
    Abstract: A control unit performs a lane departure suppression control when a host vehicle is about to depart from a traveling lane. The control unit determines whether a low impact collision has occurred. The control unit performs a secondary collision damage mitigation control when the low impact collision is determined to have occurred while the lane departure suppression control is being performed.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: March 19, 2024
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yusuke Mase, Hideyuki Usui, Masakatsu Onitsuka, Yoshiaki Moriya, Jiro Ohachi, Yuki Tomiku, Tetsuhiro Narita, Yuji Misumi
  • Patent number: 8467642
    Abstract: An arrayed waveguide grating optical multiplexer/demultiplexer according to the present invention including an input channel waveguide, an input slab waveguide, an arrayed waveguide, a polarization dependence eliminating means, an output slab waveguide, a temperature compensating means, and an output channel waveguide is characterized in that the temperature compensating means compensates for the temperature dependence of the optical path lengths in the channel waveguides of the arrayed waveguide, and the polarization dependence eliminating means eliminates the temperature dependence and the polarization dependence of the arrayed waveguide grating optical multiplexer/demultiplexer at the same time.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: June 18, 2013
    Assignees: NTT Electronics Corporation, Nippon Telegraph and Telephone Corporation
    Inventors: Daisuke Ogawa, Takashi Saida, Yuji Moriya, Shigeo Nagashima, Yasuyuki Inoue, Shin Kamei
  • Patent number: 8111955
    Abstract: An optical chip according to the present invention is formed into a projecting shape expanded toward either side at the center. A waveguide substrate has a layout in which arrayed waveguide grating type optical multiplexer/demultiplexer circuits, each having a curve direction of an array waveguide reverse to each other, are arranged in combination, and the optical chips are cut out of the waveguide substrate. A method for fabricating the optical chip according to the present invention can enhance an optical chip yield rate, and further, can fabricate an optical chip having the shape for stabilizing optical characteristics of the arrayed waveguide grating type optical multiplexer/demultiplexer circuit.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: February 7, 2012
    Assignee: NTT Electronics Corporatioin
    Inventors: Shuji Kuwano, Yuji Moriya, Takamitsu Masuda
  • Publication number: 20100322556
    Abstract: An arrayed waveguide grating optical multiplexer/demultiplexer according to the present invention including an input channel waveguide, an input slab waveguide, an arrayed waveguide, a polarization dependence eliminating means, an output slab waveguide, a temperature compensating means, and an output channel waveguide is characterized in that the temperature compensating means compensates for the temperature dependence of the optical path lengths in the channel waveguides of the arrayed waveguide, and the polarization dependence eliminating means eliminates the temperature dependence and the polarization dependence of the arrayed waveguide grating optical multiplexer/demultiplexer at the same time.
    Type: Application
    Filed: February 19, 2009
    Publication date: December 23, 2010
    Inventors: Daisuke Ogawa, Takashi Saida, Yuji Moriya, Shigeo Nagashima, Yasuyuki Inoue, Shin Kamei
  • Publication number: 20100008626
    Abstract: An optical chip according to the present invention is formed into a projecting shape expanded toward either side at the center. A waveguide substrate has a layout in which arrayed waveguide grating type optical multiplexer/demultiplexer circuits, each having a curve direction of an array waveguide reverse to each other, are arranged in combination, and the optical chips are cut out of the waveguide substrate. A method for fabricating the optical chip according to the present invention can enhance an optical chip yield rate, and further, can fabricate an optical chip having the shape for stabilizing optical characteristics of the arrayed waveguide grating type optical multiplexer/demultiplexer circuit.
    Type: Application
    Filed: August 30, 2007
    Publication date: January 14, 2010
    Applicant: NTT ELECTRONICS CORPORATION
    Inventors: Shuji Kuwano, Yuji Moriya, Takamitsu Masuda
  • Patent number: 7317056
    Abstract: There is provided a synthetic resin emulsion comprising polymer particles having a core/shell structure, wherein the shell comprises a copolymer of an unsaturated carboxylic acid and a hydrophilic comonomer, the core comprises a copolymer of a monomer mixture comprising a radically polymerizable main monomer and a radically polymerizable functional monomer, and the monomers constituting the monomer mixture are selected so that the glass transition point (Tg) of the copolymer produced by polymerization is ?20° C. or below, and the synthetic resin emulsion has been produced by adding the monomer mixture for core formation and a pH adjustor to an aqueous copolymer solution, which has not been neutralized, produced by polymerizing the unsaturated carboxylic acid and the hydrophilic comonomer in an aqueous medium, and allowing a polymerization reaction to proceed.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: January 8, 2008
    Assignee: Celanese International Corporation
    Inventors: Nobuyoshi Yoshimura, Yuji Moriya
  • Patent number: 7054707
    Abstract: This invention is directed to prevention of setting a component feeding unit set with other storage member than a storage member storing same type of components as components in shortage in an electronic component mounting apparatus. A component mounting apparatus sends notice information about component shortage to a control computer when a number of electronic components in a storage member reduces and reaches a level for sending the notice information of component shortage during mounting operations. The control computer stores the notice information, and sends the notice information to a monitor computer to display this information on a monitor. A new storage member having the corresponding components is set in the component feeding unit based on the displayed notice information, and an operator inputs information A about which component feeding unit is set with the storage member and which components are stored in the storage member set in the component feeding unit.
    Type: Grant
    Filed: December 15, 2004
    Date of Patent: May 30, 2006
    Assignee: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Yuji Moriya, Tomise Koyama, Hiroshi Nakamura, Manabu Okamoto, Kenichi Hayashi, Toshio Azuma
  • Publication number: 20060021215
    Abstract: The invention is directed to performing electronic component mounting operations by the suction nozzles of the mounting heads in each of the plurality of the rotary tables independently, moving each of the positioning tables for positioning a printed board in a component mounting position independently, and performing the electronic component mounting operation on the plurality of the printed boards independently. A component feeding device moves a plurality of component feeding tables having a plurality of component feeding units in an arraying direction thereof respectively and independently. Mounting heads having a plurality of suction nozzles for picking up electronic components from the component feeding devices respectively are provided at predetermined intervals corresponding to intermittent pitches on an outer circumference of two rotary tables intermittently rotating.
    Type: Application
    Filed: July 29, 2005
    Publication date: February 2, 2006
    Applicant: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Yoshinori Kano, Yoshinao Usui, Ikuo Takemura, Yuji Moriya, Haruhiko Yamaguchi, Manabu Okamoto, Koichi Izuhara, Kenji Kurata, Jun Asai
  • Publication number: 20050165505
    Abstract: This invention is directed to prevention of setting a component feeding unit set with other storage member than a storage member storing same type of components as components in shortage in an electronic component mounting apparatus. A component mounting apparatus sends notice information about component shortage to a control computer when a number of electronic components in a storage member reduces and reaches a level for sending the notice information of component shortage during mounting operations. The control computer stores the notice information, and sends the notice information to a monitor computer to display this information on a monitor. A new storage member having the corresponding components is set in the component feeding unit based on the displayed notice information, and an operator inputs information A about which component feeding unit is set with the storage member and which components are stored in the storage member set in the component feeding unit.
    Type: Application
    Filed: December 15, 2004
    Publication date: July 28, 2005
    Applicant: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Yuji Moriya, Tomise Koyama, Hiroshi Nakamura, Manabu Okamoto, Kenichi Hayashi, Toshio Azuma
  • Publication number: 20050090619
    Abstract: There is provided a synthetic resin emulsion comprising polymer particles having a core/shell structure, wherein the shell comprises a copolymer of an unsaturated carboxylic acid and a hydrophilic comonomer, the core comprises a copolymer of a monomer mixture comprising a radically polymerizable main monomer and a radically polymerizable functional monomer, and the monomers constituting the monomer mixture are selected so that the glass transition point (Tg) of the copolymer produced by polymerization is ?20° C. or below, and the synthetic resin emulsion has been produced by adding the monomer mixture for core formation and a pH adjustor to an aqueous copolymer solution, which has not been neutralized, produced by polymerizing the unsaturated carboxylic acid and the hydrophilic comonomer in an aqueous medium, and allowing a polymerization reaction to proceed.
    Type: Application
    Filed: December 27, 2002
    Publication date: April 28, 2005
    Inventors: Nobuyoshi Yoshimura, Yuji Moriya