Abstract: A radio-frequency module includes: transmitting filter and receiving filters for a first communication band; transmitting filter and receiving filters for a second communication band; and a switch including first and second common terminals and first to fifth selection terminals. The second common terminal is connected to a first input terminal. A common terminal of the transmitting and receiving filters for the first communication band and a common terminal of the transmitting and receiving filters for the second communication band are connected respectively to the first and second selection terminals. The transmitting and receiving filters for the first communication band are connected respectively to the third selection terminal and a first output terminal. The transmitting and receiving filters for the second communication band are connected respectively to the fourth selection terminal and a second output terminal. The fifth selection terminal is connected to a third output terminal.

Abstract: A radio-frequency module includes: transmitting filter and receiving filters for a first communication band; transmitting filter and receiving filters for a second communication band; and a switch including first and second common terminals and first to fifth selection terminals. The second common terminal is connected to a first input terminal. A common terminal of the transmitting and receiving filters for the first communication band and a common terminal of the transmitting and receiving filters for the second communication band are connected respectively to the first and second selection terminals. The transmitting and receiving filters for the first communication band are connected respectively to the third selection terminal and a first output terminal. The transmitting and receiving filters for the second communication band are connected respectively to the fourth selection terminal and a second output terminal. The fifth selection terminal is connected to a third output terminal.

Abstract: A radio-frequency module includes duplexers and a phase circuit. A first transmitting-signal input terminal is connected to the duplexer, while a second transmitting-signal input terminal is connected to the duplexer. The phase circuit is connected between the first transmitting-signal input terminal and the duplexer. The phase circuit performs phase adjustment so that impedance matching between the first transmitting-signal input terminal and the duplexer is performed in the fundamental frequency band of a first transmitting signal, and so that the phase of the frequency band of a second transmitting signal in relation to the impedance characteristics of a first transmission path which ranges from the first transmitting-signal input terminal to the duplexer with the phase circuit provided therebetween appears in an open side on a Smith chart.

Abstract: A radio-frequency module includes duplexers and a phase circuit. A first transmitting-signal input terminal is connected to the duplexer, while a second transmitting-signal input terminal is connected to the duplexer. The phase circuit is connected between the first transmitting-signal input terminal and the duplexer. The phase circuit performs phase adjustment so that impedance matching between the first transmitting-signal input terminal and the duplexer is performed in the fundamental frequency band of a first transmitting signal, and so that the phase of the frequency band of a second transmitting signal in relation to the impedance characteristics of a first transmission path which ranges from the first transmitting-signal input terminal to the duplexer with the phase circuit provided therebetween appears in an open side on a Smith chart.

Abstract: A high-frequency module includes a multilayer substrate, a switch IC, a SAW duplexer and a matching circuit. The matching circuit includes a wiring line and first and second inner layer ground electrodes. The matching circuit performs impedance matching between the switch IC and the SAW duplexer in a pass band of the SAW duplexer. The wiring line is an inner layer electrode of the multilayer substrate that is connected between the switch IC and the SAW duplexer. The first and second inner layer ground electrodes face the wiring line in a stacking direction with only dielectric layers of the multilayer substrate therebetween.

Abstract: A high-frequency module includes a multilayer substrate, a switch IC, a SAW duplexer and a matching circuit. The matching circuit includes a wiring line and first and second inner layer ground electrodes. The matching circuit performs impedance matching between the switch IC and the SAW duplexer in a pass band of the SAW duplexer. The wiring line is an inner layer electrode of the multilayer substrate that is connected between the switch IC and the SAW duplexer. The first and second inner layer ground electrodes face the wiring line in a stacking direction with only dielectric layers of the multilayer substrate therebetween.