Patents by Inventor Yuji Ohkuma

Yuji Ohkuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5429642
    Abstract: A method for transferring wafers from one processing station to another station sequentially, utilizing a transfer system which is installed in a clean bench forming a downward flow of clean air. A plurality of stations is provided for processing wafers in the clean bench. The transfer system comprises at least a single transfer robot carrying a plurality of wafers, the transfer robot being movable from one station to another sequentially for processing, and an exhaust duct is provided along a path of the transfer robot movement, the duct having a plurality of inlets for exhausting the air.
    Type: Grant
    Filed: September 29, 1994
    Date of Patent: July 4, 1995
    Assignee: Fujitsu Limited
    Inventor: Yuji Ohkuma
  • Patent number: 5380684
    Abstract: A method for transferring wafers from one processing station to another station sequentially, utilizing a transfer system which is installed in a clean bench forming a downward flow of clean air. A plurality of stations is provided for processing wafers in the clean bench. The transfer system comprises at least a single transfer robot carrying a plurality of wafers, the transfer robot being movable from one station to another sequentially for processing, and an exhaust duct is provided along a path of the transfer robot movement, the duct having a plurality of inlets for exhausting the air.
    Type: Grant
    Filed: September 3, 1993
    Date of Patent: January 10, 1995
    Assignee: Fujitsu Limited
    Inventor: Yuji Ohkuma
  • Patent number: 4637146
    Abstract: A spin dryer including a rotary stage for supporting a substrate to be dried, particularly adapted for use in producing semiconductor devices, and a stationary cover spaced from the substrate. The stationary cover has at least the same area as that of the substrate and is provided with a number of openings for charging a dry and dust-free gas onto the substrate, whereby oxidation and dust-contamination of the substrate are avoided.
    Type: Grant
    Filed: August 14, 1984
    Date of Patent: January 20, 1987
    Assignee: Fujitsu Limited
    Inventors: Yasunari Motoki, Yuji Ohkuma
  • Patent number: 4557785
    Abstract: An apparatus and system for wet processing a substrate, which can be used for chemical processing such as etching or washing a semiconductor substrate are disclosed. The apparatus has a processing chamber in which the substrate is wet processed. Processing liquid is injected into the processing chamber through an opening and nozzles, and the substrate is floated in the injected liquid and rotated about its center axis by streams of the injected liquid. The wet processing system is composed from a processing apparatus as mentioned above, a water bearing system which transfers the substrate by means of a water stream, and a spin dryer. The water bearing system also serves as a washing apparatus. Shutters are provided between the water bearing and the processing chamber or the spin dryer, the shutters controlling the water levels between these elements.
    Type: Grant
    Filed: June 27, 1984
    Date of Patent: December 10, 1985
    Assignee: Fujitsu Limited
    Inventor: Yuji Ohkuma