Patents by Inventor Yuji Sato
Yuji Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11830795Abstract: A semiconductor device includes a base plate, a substrate, a semiconductor element, a case, and a wiring terminal. The case is disposed on the base plate so as to cover the substrate and the semiconductor element. The wiring terminal is electrically connected to the semiconductor element. The case includes a first case unit and a second case unit that is separate from the first case unit. The wiring terminal includes a first wiring unit and a second wiring unit. The first wiring unit is disposed so as to protrude from an inside to an outside of the case, and is electrically connected to the semiconductor element. The second wiring unit is bent with respect to the first wiring unit and disposed outside the case. The first case unit and the second case unit are disposed so as to sandwich the first wiring unit.Type: GrantFiled: July 4, 2019Date of Patent: November 28, 2023Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Yuji Sato, Yoshinori Yokoyama, Motoru Yoshida, Jun Fujita
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Patent number: 11813853Abstract: To provide a technology capable of appropriately suppressing deterioration in cutting accuracy of a slitter although the rigidity of a print medium changes, a printing apparatus is equipped with: a first conveyance unit configured to convey a print medium; a printing unit configured to print an image by applying ink to the print medium conveyed by the first conveyance unit; a cutting unit disposed on a downstream side in a conveyance direction in which the print medium is conveyed by the first conveyance unit and configured to cut the print medium, which is conveyed by the first conveyance unit, along the conveyance direction; and a second conveyance unit disposed on the cutting unit, and the printing apparatus includes a correction unit configured to correct a parameter related to conveyance of at least one of the first conveyance unit and the second conveyance unit, based on information about the print medium.Type: GrantFiled: August 23, 2021Date of Patent: November 14, 2023Assignee: Canon Kabushiki KaishaInventors: Hiroshi Kawafuji, Hiroshi Taira, Kazuhiko Sato, Taku Yokozawa, Noboru Kunimine, Akiko Aichi, Satoshi Azuma, Sae Mogi, Kei Yoshizawa, Shingo Nishioka, Junichi Saito, Hajime Nagai, Naoko Baba, Yuji Konno, Serena Yoshikawa, Satoshi Wada
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Publication number: 20230355349Abstract: A medical device for assisting in a puncture operation on a human body, includes an imaging unit configured to acquire a cross-sectional image of a human body, a laser unit configured to emit laser light and project a marker onto a skin surface of the human body, a controller configured to: determine a first distance from the imaging unit to a blood vessel using the cross-sectional image acquired by the imaging unit, determine a position of a puncture point on the skin surface with respect to the imaging unit based on the determined first distance, and control the laser unit to project onto the skin surface a marker indicating the puncture point at the determined position thereof.Type: ApplicationFiled: July 14, 2023Publication date: November 9, 2023Inventors: Takito INUKAI, Yuji ONIMURA, Hiroshi SATO, Takayuki MORI
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Publication number: 20230312353Abstract: The silicon carbide powder is a powder of silicon carbide having an ?-type crystal system, where the number of small corner portions among corner portions on a surface of a primary particle of silicon carbide constituting the powder of silicon carbide is 2.5 or less per one primary particle. The small corner portion is a corner portion, among corner portions present in a contour of the primary particle in a projection image of the primary particle, where twice a curvature radius of the corner portion is 1/5 or less of a Heywood diameter of the projection image of the primary particle.Type: ApplicationFiled: March 29, 2023Publication date: October 5, 2023Applicant: FUJIMI INCORPORATEDInventors: Yuji Masuda, Taira Otsu, Mina Sato, Naoki Ushida, Takuya Isayama, Haruna Inagaki, Naomi Ban
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Patent number: 11773493Abstract: A material for cold spraying contains a powder of a compound of a rare earth element with a specific surface area of 30 m2/g or more as determined by a BET single-point method. The powder preferably has a volume of pores with a pore size of 3 to 20 nm of 0.08 cm3/g or more as determined by a gas absorption method. The powder also preferably has a crystallite diameter of 25 nm or less. The powder also preferably has a repose angle of from 10 to 60°. In the L*a*b* color system, the powder also preferably has a value L of 85 or more, a value a of from ?0.7 to 0.7, and a value b of from ?1 to 2.5.Type: GrantFiled: October 18, 2019Date of Patent: October 3, 2023Inventors: Ryuichi Sato, Naoki Fukagawa, Kento Matsukura, Shuki Mikoda, Seiji Moriuchi, Yuji Shigeyoshi, Masahiro Fukumoto, Motohiro Yamada
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Patent number: 11772378Abstract: A printing element includes a substrate, an intermediate layer, and a channel forming member layered in this order. The substrate has a common liquid chamber. The channel forming member has a second surface that is a surface facing the substrate via the intermediate layer, and a first surface that is an opposite surface to the second surface. The first surface is formed with a plurality of ejection ports that eject liquid from the common liquid chamber. The second surface is formed with a plurality of channels that allow each of the plurality of ejection ports and the common liquid chamber to communicate with each other, and a plurality of substantially parallel beam structures, the plurality of beam structures forming a slit portion therebetween.Type: GrantFiled: June 4, 2021Date of Patent: October 3, 2023Assignee: Canon Kabushiki KaishaInventors: Atsushi Omura, Yuji Tamaru, Yosuke Takagi, Ryo Sato
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Publication number: 20230253349Abstract: A semiconductor device is obtained, in which the impact of bonding of the wiring member on an underneath structure including a semiconductor element is reduced and thus the reliability is improved. The semiconductor device includes: a semiconductor element with a first main surface; a first metal member formed on the first main surface; a second metal member formed on an upper surface of the first metal member; a third metal member formed on an upper surface of the second metal member; a fourth metal member with copper as a principal component, formed on an upper surface of the third metal member; and a wiring member with copper as a principal component, bonded to an upper surface of the fourth metal member corresponding to a formation position of the third metal member.Type: ApplicationFiled: August 3, 2020Publication date: August 10, 2023Applicant: Mitsubishi Electric CorporationInventor: Yuji SATO
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Publication number: 20230192890Abstract: Provided are anti-PAD4 antibodies having excellent properties and an excellent method for treatment of RA. Used are anti-PAD4 antibodies that specifically bind to an epitope containing positions 345, 347, and 348 of PAD4. These anti-PAD4 antibodies may inhibit the citrullination activity of PAD4. In addition, these anti-PAD4 antibodies may have a KD (M) of 9.0×10?9 or less. Optionally, the anti-PAD4 antibody and a TNF? inhibitor are used in combination.Type: ApplicationFiled: September 19, 2022Publication date: June 22, 2023Inventors: Mamoru SATO, Michiyuki YAMADA, Satoshi KANAZAWA, Masayoshi TOYOURA, Yuji SHOYA, Kenji SAITO, Chihiro YAMAZAKI
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Publication number: 20230197649Abstract: In a semiconductor device, a first structure including a first uneven unit and a second structure covering the first structure and including a second uneven unit are formed in a bonding region defined in a semiconductor substrate. Metal wiring is joined to the second uneven unit in the second structure. A depth of a recess in the second uneven unit is shallower than a depth of a recess in the first uneven unit. An insulating member defining the bonding region is formed so as to reach the semiconductor substrate.Type: ApplicationFiled: May 28, 2020Publication date: June 22, 2023Applicant: Mitsubishi Electric CorporationInventor: Yuji SATO
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Patent number: 11680628Abstract: In the ball screw device, the circulation path that returns balls from the end point to the start point of the load path includes a return path, scooping paths, and connecting paths. The scooping path has an arc-shaped center line that is curved outward in the radial direction as going toward the reference imaginary flat plane including the center axis of the screw shaft and the center line of the return path in the circumferential direction. The connecting path is arranged on the reference imaginary flat plane and includes a straight path having a linear center line extending in a direction orthogonal to the center axis of the screw shaft. When the radius of curvature of the center line of the scooping path is R1, the scooping angle is ?, and the entire length of the straight path is S, R1 cos(90°??)+S is made larger than the diameter of the balls.Type: GrantFiled: March 10, 2021Date of Patent: June 20, 2023Assignee: NSK LTD.Inventors: Kazuya Yamada, Yuji Shimomura, Kanta Sato, Yasuaki Abe
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Patent number: 11662293Abstract: An inspection method for a pillar-shaped honeycomb filter having a honeycomb-shaped first end face and a honeycomb-shaped second end face, including: allowing gas containing fine particles to flow into the first end face; imaging the entire second end face covered with the sheet-like light using a camera while the gas that has flowed into the first end face flows out of the second end face through the filter, and generating an image of the entire second end face covered with the sheet-like light; selecting an inspection area of the second end face and measuring information concerning a sum of luminance of all pixels in the inspection area; and determining quality of the filter based on at least the information concerning the concentration of the fine particles in the gas before the gas flows into the first end face and the information concerning the sum of luminance.Type: GrantFiled: February 25, 2021Date of Patent: May 30, 2023Assignee: NGK INSULATORS, LTD.Inventors: Yoshihiro Sato, Takakazu Koyama, Yuji Watanabe, Yutaka Ishii, Takaaki Kanemitsu, Makoto Murai, Masanari Iwade, Takafumi Terahai, Ryota Kurahashi, Akinari Fukaya, Kenji Ebisutani
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Patent number: 11662003Abstract: A ball screw device has a screw shaft; a nut; a circulation part; and balls; a housing concave groove provided on the outer circumferential surface of the nut and linearly extending in the axial direction and opening to end surfaces on both outer sides in the axial direction of the nut, a circulation part arranged inside the housing concave groove, and the circulation part being prevented from displacing toward the outer side in the radial direction and displacing in the circumferential direction with respect to the nut by engaging an engaging convex portion of a fixing portion provided in the end portion on each of both outer sides in the axial direction of the circulation part with an engaging recess portion provided in the end portion of each of both outer sides in the axial direction of the housing concave groove.Type: GrantFiled: March 12, 2021Date of Patent: May 30, 2023Assignee: NSK LTD.Inventors: Kazuya Yamada, Yuji Shimomura, Yasuaki Abe, Kanta Sato
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Publication number: 20230159339Abstract: There is provided a silicon carbide powder having a small mean particle diameter and a narrow particle diameter distribution width. A silicon carbide powder is a powder of silicon carbide (SiC) having an ?-type crystal form and has a mean particle diameter of 300 nm or less. In the silicon carbide powder, a ratio D90/D10 between a particle diameter D10 and a particle diameter D90 is 4 or less, the particle diameter D10 being a particle diameter at which the cumulative particle volume from the small particle diameter side in a volume-based cumulative particle diameter distribution reaches 10% of the total particle volume and the particle diameter D90 being a particle diameter at which the cumulative particle volume from the small particle diameter side in the volume-based cumulative particle diameter distribution reaches 90% of the total particle volume.Type: ApplicationFiled: December 11, 2020Publication date: May 25, 2023Applicant: FUJIMI INCORPORATEDInventors: Naoki Ushida, Yuji Masuda, Mina Sato
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Publication number: 20230122575Abstract: According to the present disclosure, a semiconductor device includes a semiconductor substrate, a first metal layer provided above the semiconductor substrate, a second metal layer provided above the first metal layer and containing Ni as a material and a third metal layer provided above the second metal layer and containing Cu or Ni as a material, wherein the second metal layer has a Vickers hardness of 400 Hv or more and is harder than the third metal layer, and the third metal layer is harder than the first metal layer.Type: ApplicationFiled: June 13, 2022Publication date: April 20, 2023Applicant: Mitsubishi Electric CorporationInventors: Koji TANAKA, Yuji SATO, Yoshihisa UCHIDA, Shotaro NAKAMURA
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Publication number: 20230109952Abstract: Provided is a light-emitting device having a high luminous flux. The light-emitting device comprises a light-emitting element 11 that has a dominant wavelength in a range of 380 nm or more and 485 nm or less, and a fluorescent material layer 31 that includes a fluorescent material emitting light by being excited by light emitted from the light-emitting element 11, and a neodymium compound, wherein the light-emitting device emits light having a dominant wavelength in a range of 584 nm or more and 780 nm or less.Type: ApplicationFiled: February 10, 2021Publication date: April 13, 2023Applicant: NICHIA CORPORATIONInventors: Makiko IWASA, Yuji SATO
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Patent number: 11598645Abstract: Driving assistance systems, methods, and programs accept an inputted planned travel route from the route guidance system, provide driving assistance of the vehicle on the planned travel route, based on driving assistance map data, and obtain, when versions of the route guidance map data and the driving assistance map data do not match each other, the driving assistance map data whose version matches the version of the route guidance map data from a map provider. Route guidance systems search for a planned travel route based on route guidance map data, provide guidance on the planned travel route, output the planned travel route to the driving assistance system, and obtain, when versions of the route guidance map data and the driving assistance map data do not match each other, the route guidance map data whose version matches the version of the driving assistance map data from a map provider.Type: GrantFiled: May 28, 2018Date of Patent: March 7, 2023Assignees: AISIN CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Sadahiro Koshiba, Kazuteru Maekawa, Seiji Takahata, Takahiro Yamaguchi, Shingo Kinashi, Yuji Sato, Hironobu Sugimoto, Xin Jin, Hiroaki Sakakibara
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Patent number: 11593574Abstract: In a printer, a controller controls a printing portion to execute a sample print to print on a sheet a plurality of barcodes. Each of the plurality of barcodes is represented by a received barcode data and printed in a different printing condition. The controller controls a reading portion to read the plurality of barcodes printed on the sheet in the sample print process to obtain a plurality of sets of scan data corresponding to respective ones of the plurality of barcodes. The controller performs a quality determination process to determine qualities of the plurality of printed barcodes based on the respective ones of the plurality of sets of scan data, and a printing condition setting process to set a printing condition based on the qualities determined in the quality determination process. The set printing condition is to be used to print a barcode by the printing portion.Type: GrantFiled: March 25, 2021Date of Patent: February 28, 2023Assignee: BROTHER KOGYO KABUSHIKI KAISHAInventors: Mitsuru Nakamura, Hideyuki Kusunoki, Yuji Sato, Keita Koyama, Katsunori Sakai, Akidi Yoshida, Ayaka Oba
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Publication number: 20230047789Abstract: Provided is a semiconductor device capable of suppressing an Al slide at a time of an operation under a high temperature in a laminated structure of an aluminum electrode layer and a copper electrode layer. Accordingly, in the semiconductor device according to the present disclosure, a first copper electrode layer includes a plurality of protruding regions as regions protruding toward the aluminum electrode layer in an interface with the aluminum electrode layer.Type: ApplicationFiled: April 6, 2020Publication date: February 16, 2023Applicant: Mitsubishi Electric CorporationInventors: Motoru YOSHIDA, Yuji SATO, Kazuyuki SUGAHARA
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Publication number: 20230050577Abstract: A laser welding method is usable to weld a material containing copper as a main component. The laser welding method includes heating the material by irradiation with a first laser light and welding the material by irradiation of a portion, which has been irradiated with the first laser light, of the material with a second laser light with which an energy absorption rate of the copper contained in the material increases by an increase in a temperature of the material. A wavelength of the first laser light is 400 nm to 470 nm.Type: ApplicationFiled: October 28, 2022Publication date: February 16, 2023Inventors: Masatoshi ITOU, Takashi NISHIKAWA, Masahiro TSUKAMOTO, Yuji SATO, Tetsuo SUGA
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Publication number: 20230045870Abstract: Provided is a light emitting device that is bright in both scotopic vision and photopic vision, and has reduced glare for humans. The light emitting device includes a light emitting element having a dominant wavelength in a range of 430 nm or more and 500 nm or less, and a fluorescent material that is excited by light emitted from the light emitting element and has a light emission peak wavelength in a range of 507 nm or more and 660 nm or less, wherein the light emitting device emits light having a dominant wavelength in a range of 490 nm or more and 500 nm or less, wherein the light emitting device has an S/P ratio, which is the ratio of a luminous flux in photopic vision to a luminous flux in scotopic vision, being 6.5 or less, and wherein the light emitting device has a light emission intensity in the light emission peak wavelength of the light emitting element that is greater than that in the light emission peak wavelength of the fluorescent material.Type: ApplicationFiled: October 23, 2020Publication date: February 16, 2023Applicant: NICHIA CORPORATIONInventors: Makiko IWASA, Yuji SATO