Abstract: An imaging device according to the present disclosure includes the plurality of normal pixels arranged in a matrix, the special pixel arranged by replacing a part of the normal pixels, the color filter corresponding to the normal pixels and arranged according to a predetermined rule, the special filter arranged corresponding to the special pixel, and the special pixel color filter arranged to surround at least a part of the periphery of the special filter.

Abstract: In one aspect, a reception means receives, from a roadside device, first information transmitted from a mobile body by using a first wireless communication. An identification means identifies, based on information of a terminal apparatus to be managed by an information management means, the terminal apparatus being located in the vicinity of the mobile body that has transmitted the first information. A transmission means transmits second information generated based on the first information, to the terminal apparatus identified by the identification means via a second wireless communication.

Abstract: The load port includes a FOUP configured to accommodate a plurality of substrates in multiple stages, cameras configured to image each of the substrates accommodated in the FOUP and including a low-magnification camera with a wide horizontal angle of view and a high-magnification camera with a narrow horizontal angle of view, and a CPU configured to detect the accommodation state of each of the substrates based on the imaging data acquired from the low-magnification camera and the high-magnification camera, respectively.

Abstract: A power converter includes a capacitor and a substrate on which a plurality of switching elements for power conversion are mounted. The power converter includes a cooler for cooling the plurality of switching elements and a housing that accommodates the capacitor, the substrate, and the cooler. The power converter includes a power connector exposed from the housing and an output connector exposed from the housing. The power converter includes a plurality of lines that include a plurality of power lines each electrically connected to the capacitor, given switching elements, and the power connector. The plurality of lines include a plurality of output lines each electrically connected to given switching elements and the output connector. At least one among the plurality of lines is a line that includes a conductive pattern formed on the substrate.

Abstract: A vacuum circuit breaker serving as a switch includes a pair of electrodes that serve as a stationary electrode and a movable electrode, a handler including a movable shaft and a housing that operate as a first mover in withdrawing the movable electrode from the stationary electrode and closing the movable electrode toward the stationary electrode, a movable shaft that is connected as a second mover to the movable electrode, a coil spring that is connected as an elastic between the first mover and the second mover to press the movable electrode against the stationary electrode, and a shock absorber that attenuates as an attenuator contraction of the elastic when the movable electrode is withdrawn from the stationary electrode.

Abstract: The present invention provides novel antigens of an allergy to shrimp, methods and kits for diagnosing an allergy to shrimp, pharmaceutical compositions comprising such an antigen, shrimps or processed products of shrimp in which such an antigen is eliminated, and a tester composition for determining the presence or absence of a shrimp antigen in an object of interest. The present invention also relates to polypeptides comprising an epitope of an antigen, kits, compositions and methods for diagnosing an allergy, comprising such a polypeptide, pharmaceutical compositions comprising such a polypeptide, and raw materials or processed products in which an antigen comprising such a polypeptide is eliminated or reduced. The present invention further relates to a tester composition for determining the presence or absence of an antigen in an object of interest.

Abstract: The present disclosure relates to an attachment structure for attaching a wiring member to an instrument panel reinforcement, which is an attachment object, provided near an instrument panel. The wiring member includes a linear transmission member that transmits electricity or light, and a covering member that covers the linear transmission member. The wiring member attachment structure includes a rail member provided on the instrument panel reinforcement, and an insertion member that is provided on the covering member and inserted into the rail member. The wiring member is attached to the instrument panel reinforcement in a state in which the insertion member is inserted into the rail member.

Abstract: A power converter includes a positive busbar electrically connected to a positive terminal and the first capacitor electrode, and includes a negative busbar electrically connected to a negative terminal and the second capacitor electrode. The power converter includes output busbars each electrically connected to a given output terminal among multiple output terminals, a given high-side switching element among a plurality of high-side switching elements, and a given low-side switching element among a plurality of low-side switching elements. The power converter includes a cooler that cools the high-side switching elements and the low-side switching elements. The power converter includes a housing that accommodates a supply tube and a discharge tube. The positive terminal, the negative terminal, the output terminals, the inlet port, and the outlet port are exposed on the housing. The inlet port, the outlet port, the supply tube, and the discharge tube are separate members from the housing.

Abstract: The vehicle light-emitting device includes a light-emitting element having a peak emission wavelength of 400 nm or greater and 510 nm or less, and a fluorescent member including a first phosphor excited by light emitted by the light-emitting element and emitting light having a peak emission wavelength of 480 nm or greater and 530 nm or less a second phosphor excited by the light emitted by the light-emitting element and emitting light having a peak emission wavelength of 540 nm or greater and 600 nm or less. The vehicle light-emitting device emits light in a region AL in a CIE1931 chromaticity diagram as defined in the present disclosure.

Abstract: A semiconductor device includes a semiconductor element, a wiring member, a sintered member between a first main electrode of the semiconductor element and the wiring member, and a sealing body. The wiring member includes a base material, a metal film on a face of the base material, and an uneven oxide film. The uneven oxide film includes a thick film portion and a thin film portion. An opposing face of the wiring member opposing the semiconductor element includes a mounting portion to which the first main electrode is bonded, an outer peripheral portion formed with the thick film portion and surrounding the semiconductor element, and an intermediate portion formed with the thin film portion between the mounting portion and the outer peripheral portion. The sintered member overlaps with the mounting portion and the intermediate portion in the plan view, and is in contact with the thin film portion.

Abstract: An object is to provide a technique capable of easily taking out a submodule from a semiconductor device to reuse the submodule. The semiconductor device includes: a submodule in which a conductive plate and a semiconductor element mounted to an upper surface of the conductive plate via a first bonding material are sealed with a first sealing material; an insulating substrate bonded to a lower surface of the submodule via a second bonding material; a case surrounding a periphery of the insulating substrate and the submodule; and a second sealing material sealing a region surrounded by the case so that at least an upper surface of the submodule is exposed.

Abstract: An object is to provide a technique capable of reducing stress in the entire semiconductor device. The semiconductor device includes a plurality of sub-modules including a first sealing member, an insulating substrate provided with a first circuit pattern electrically connected to at least one of the conductive plates of the plurality of sub-modules, connection members electrically connected to at least one of the conductive pieces of the plurality of sub-modules, and a second sealing member having lower hardness than the first sealing member, which seals the plurality of sub-modules, the insulating substrate, and the connection members.

Abstract: A semiconductor chip including a main electrode and a control electrode is bonded to a substrate. A wiring chip including a first electrode, a second electrode and a wiring is bonded to the substrate. A main electrode member is bonded to the main electrode. A control electrode member is bonded to the second electrode. The control electrode is bonded to the first electrode with a connection member. The semiconductor chip, the substrate, the wiring chip, the main electrode member, the control electrode member and the connection member are putted into a mold and are sealed with sealing material by injecting the sealing material into the mold in a state that distal end surfaces of the main electrode member and the control electrode member are pressed against a buffer material provided between the main electrode member/the control electrode member and the mold. The sealing material is not ground.

Abstract: A semiconductor apparatus includes: a first conductor plate; a second conductor plate separated from the first conductor plate; a plurality of semiconductor devices having back surface electrodes connected to the first conductor plate; a relay substrate mounted on the second conductor plate and including a plurality of first relay pads and a second relay pad connected to the plurality of first relay pads; a plurality of metal wires respectively connecting control electrodes of the plurality of semiconductor devices to the plurality of first relay pads; a first conductor block connected to front surface electrodes of the plurality of semiconductor devices; a second conductor block connected to the second relay pad; and a sealing material sealing the first and second conductor plates, the plurality of semiconductor devices, the relay substrate, the metal wire, and the first and second conductor blocks, the sealing material includes a first principal surface and a second principal surface opposed to each other,

Abstract: In order to enable, even when an increased number of workers become analysis targets, efficient analysis on work efficiency statuses of workers without putting a greater burden on an administrator to perform setting operations for the analysis, analytical information is produced by performing a joint position estimation based on respective frames of video recordings to estimate joint positions of a worker, performing a posture match determination based on results of the joint position estimation to determine whether or not to achieve a posture match between a posture of the worker in each frame of the video recordings and a predetermined reference body posture, and measuring, based on results of the posture match determination, a working time and a presence time of the worker used as analytical information on a work efficiency status of the worker.

Abstract: A light source device according to an embodiment of the present disclosure includes: a light source section; a rotating body; a motor; a housing; one or more lens groups; a lens holding section; and an adjusting mechanism. The rotating body includes a fluorescent light body. The fluorescent light body is excited by excitation light from the light source section to output fluorescent light. The motor drives the rotating body. The housing accommodates the rotating body. The one or more lens groups gather the excitation light from the light source section and direct the excitation light toward the rotating body. The lens holding section holds the one or more lens groups. The adjusting mechanism adjusts a distance between the rotating body and the one or more lens groups.

Abstract: A semiconductor device includes a base plate, a substrate, a semiconductor element, a case, and a wiring terminal. The case is disposed on the base plate so as to cover the substrate and the semiconductor element. The wiring terminal is electrically connected to the semiconductor element. The case includes a first case unit and a second case unit that is separate from the first case unit. The wiring terminal includes a first wiring unit and a second wiring unit. The first wiring unit is disposed so as to protrude from an inside to an outside of the case, and is electrically connected to the semiconductor element. The second wiring unit is bent with respect to the first wiring unit and disposed outside the case. The first case unit and the second case unit are disposed so as to sandwich the first wiring unit.

Abstract: A semiconductor device is obtained, in which the impact of bonding of the wiring member on an underneath structure including a semiconductor element is reduced and thus the reliability is improved. The semiconductor device includes: a semiconductor element with a first main surface; a first metal member formed on the first main surface; a second metal member formed on an upper surface of the first metal member; a third metal member formed on an upper surface of the second metal member; a fourth metal member with copper as a principal component, formed on an upper surface of the third metal member; and a wiring member with copper as a principal component, bonded to an upper surface of the fourth metal member corresponding to a formation position of the third metal member.

Abstract: In a semiconductor device, a first structure including a first uneven unit and a second structure covering the first structure and including a second uneven unit are formed in a bonding region defined in a semiconductor substrate. Metal wiring is joined to the second uneven unit in the second structure. A depth of a recess in the second uneven unit is shallower than a depth of a recess in the first uneven unit. An insulating member defining the bonding region is formed so as to reach the semiconductor substrate.

Abstract: According to the present disclosure, a semiconductor device includes a semiconductor substrate, a first metal layer provided above the semiconductor substrate, a second metal layer provided above the first metal layer and containing Ni as a material and a third metal layer provided above the second metal layer and containing Cu or Ni as a material, wherein the second metal layer has a Vickers hardness of 400 Hv or more and is harder than the third metal layer, and the third metal layer is harder than the first metal layer.