Patents by Inventor Yuji SHIKASHO

Yuji SHIKASHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240234260
    Abstract: A power semiconductor device according to the present disclosure includes, in the following order, a conductor plate, an insulator, a lead frame, a first mold package including a plurality of semiconductor elements provided on the lead frame inside thereof, and resin-sealed such that a main surface of the conductor plate opposite to a side on which the insulator is provided is exposed, and a second mold package in which the first mold package is resin-sealed such that the main surface is exposed, in which the lead frame has a plurality of terminals protruding from one side surface of the first mold package, the plurality of terminals are projecting from a front surface of the second mold package opposite to the conductor plate, and the plurality of terminals are alternately arranged to form a staggered pattern closer to one side of the front surface in plan view.
    Type: Application
    Filed: August 22, 2023
    Publication date: July 11, 2024
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takuya SAKAMOTO, Keitaro ICHIKAWA, Yuji SHIKASHO
  • Publication number: 20240136257
    Abstract: A power semiconductor device according to the present disclosure includes, in the following order, a conductor plate, an insulator, a lead frame, a first mold package including a plurality of semiconductor elements provided on the lead frame inside thereof, and resin-sealed such that a main surface of the conductor plate opposite to a side on which the insulator is provided is exposed, and a second mold package in which the first mold package is resin-sealed such that the main surface is exposed, in which the lead frame has a plurality of terminals protruding from one side surface of the first mold package, the plurality of terminals are projecting from a front surface of the second mold package opposite to the conductor plate, and the plurality of terminals are alternately arranged to form a staggered pattern closer to one side of the front surface in plan view.
    Type: Application
    Filed: August 21, 2023
    Publication date: April 25, 2024
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takuya SAKAMOTO, Keitaro ICHIKAWA, Yuji SHIKASHO
  • Publication number: 20230335480
    Abstract: Provided are a power semiconductor device using a lead frame, in which deformation and bending of terminals is suppressed, insulation is secured between terminals, and mounting onto a control board is facilitated, and a manufacturing method thereof. A package in which a semiconductor element mounted on a lead frame is sealed, terminals being bent and exposed from side surfaces of the package, and, a terminal bending portion being a portion bent in each of the terminals, a width thereof being larger than a width of a tip of the terminal, and being equal to or smaller than the width of a contact portion of the terminal in contact with the package are provided; therefore, deformation and bending of the terminals is suppressed, a necessary insulation is secured between the adjacent terminals, and mounting onto a control board is facilitated.
    Type: Application
    Filed: June 21, 2023
    Publication date: October 19, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Keitaro ICHIKAWA, Taketoshi SHIKANO, Yuji SHIKASHO, Fumihito KAWAHARA
  • Patent number: 11735509
    Abstract: Provided are a power semiconductor device using a lead frame, in which deformation and bending of terminals is suppressed, insulation is secured between terminals, and mounting onto a control board is facilitated, and a manufacturing method thereof. A package in which a semiconductor element mounted on a lead frame is sealed, terminals being bent and exposed from side surfaces of the package, and, a terminal bending portion being a portion bent in each of the terminals, a width thereof being larger than a width of a tip of the terminal, and being equal to or smaller than the width of a contact portion of the terminal in contact with the package are provided; therefore, deformation and bending of the terminals is suppressed, a necessary insulation is secured between the adjacent terminals, and mounting onto a control board is facilitated.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: August 22, 2023
    Assignee: Mitsubishi Electric Corporation
    Inventors: Keitaro Ichikawa, Taketoshi Shikano, Yuji Shikasho, Fumihito Kawahara
  • Publication number: 20230238311
    Abstract: A semiconductor device includes a sealing resin being an insulating resin sealing the semiconductor element therein, and a plurality of electrode terminals each including a root portion being a root protruding from the sealing resin, a tip portion being a tip and portion extending from the root portion, and a middle portion provided between the tip portion and the root portion, and the middle portion includes first middle portions having a width wider than those of the root portion and the tip portion in the first direction, and a second middle portion having a width wider than those of the root portion and the tip portion in the first direction, a width narrower than those of the first middle portions in the first direction, and a bent portion bent toward in a third direction orthogonal to the first direction and the second direction.
    Type: Application
    Filed: November 23, 2022
    Publication date: July 27, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Keitaro ICHIKAWA, Yuji SHIKASHO, Takuya SAKAMOTO
  • Patent number: 11335629
    Abstract: A transfer-mold type power module includes a plurality of electrode terminals that is arranged so as to protrude in the same direction from a target side surface of a package. A tie bar cutting residue protruding from a first side surface of each of the electrode terminals and a tie bar cutting residue protruding from a second side surface of each of the electrode terminals are different in position in a length direction of each of the electrode terminals. Each of the electrode terminals has a shape bent at a position including tie bar cutting residue closer to the package, with a width direction of each of the electrode terminals as an axis.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: May 17, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Fumihito Kawahara, Keitaro Ichikawa, Yuji Shikasho
  • Publication number: 20210249341
    Abstract: A transfer-mold type power module includes a plurality of electrode terminals that is arranged so as to protrude in the same direction from a target side surface of a package. A tie bar cutting residue protruding from a first side surface of each of the electrode terminals and a tie bar cutting residue protruding from a second side surface of each of the electrode terminals are different in position in a length direction of each of the electrode terminals. Each of the electrode terminals has a shape bent at a position including tie bar cutting residue closer to the package, with a width direction of each of the electrode terminals as an axis.
    Type: Application
    Filed: November 17, 2020
    Publication date: August 12, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Fumihito KAWAHARA, Keitaro ICHIKAWA, Yuji SHIKASHO
  • Publication number: 20200303295
    Abstract: Provided are a power semiconductor device using a lead frame, in which deformation and bending of terminals is suppressed, insulation is secured between terminals, and mounting onto a control board is facilitated, and a manufacturing method thereof. A package in which a semiconductor element mounted on a lead frame is sealed, terminals being bent and exposed from side surfaces of the package, and, a terminal bending portion being a portion bent in each of the terminals, a width thereof being larger than a width of a tip of the terminal, and being equal to or smaller than the width of a contact portion of the terminal in contact with the package are provided; therefore, deformation and bending of the terminals is suppressed, a necessary insulation is secured between the adjacent terminals, and mounting onto a control board is facilitated.
    Type: Application
    Filed: January 9, 2020
    Publication date: September 24, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Keitaro ICHIKAWA, Taketoshi SHIKANO, Yuji SHIKASHO, Fumihito KAWAHARA