Patents by Inventor Yuji Uchiumi

Yuji Uchiumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240003040
    Abstract: Provided is a plating process that enables merits of an insoluble anode to be sufficiently enjoyed in a jet type plating equipment. Also provided is a plating equipment having a plating tank including an opening part; a solution supply piping; an insoluble anode; and an diaphragm, an diaphragm outer peripheral end being fixed to a plating tank inner wall, a through-hole being provided in an diaphragm center, a hole peripheral end of the through-hole being fixed to the solution supply piping, the diaphragm being arranged so as to be inclined upward in an outer circumferential direction from the solution supply piping. A silicon ring is firmly fixed to each of the outer peripheral end of the diaphragm and a hole edge of the through-hole of the diaphragm. The solution supply piping supplies the plating solution to an upper catholyte chamber in the plating tank, the upper catholyte chamber being formed by the diaphragm and the placed object to be plated.
    Type: Application
    Filed: October 25, 2021
    Publication date: January 4, 2024
    Applicant: MITOMO SEMICON ENGINEERING CO., LTD.
    Inventor: YUJI UCHIUMI
  • Patent number: 9889261
    Abstract: The present invention relates to a nebulizer mesh which is used, in a nebulizer for atomizing and nebulizing liquid, for atomizing the liquid, and has plural through holes 17, wherein each of the through holes 17 forms a cylindrical space portion 174 on one surface side of the nebulizer mesh, and forms an opening 172 opened in a mortar shape on the other surface side, and to a production method thereof.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: February 13, 2018
    Assignee: Tanaka Kikinzoku Kogyo K.K.
    Inventors: Tasuku Arimoto, Makoto Sakai, Yoshio Shindo, Yuji Uchiumi, Shingo Watanabe
  • Patent number: 9700685
    Abstract: The present invention relates to a nebulizer mesh which is used, in a nebulizer for atomizing and nebulizing liquid, for atomizing the liquid, and has plural through holes 17, wherein each of the through holes 17 forms a cylindrical space portion 174 on one surface side of the nebulizer mesh, and forms an opening 172 opened in a mortar shape on the other surface side, and to a production method thereof.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: July 11, 2017
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Tasuku Arimoto, Makoto Sakai, Yoshio Shindo, Yuji Uchiumi, Shingo Watanabe
  • Publication number: 20160375203
    Abstract: The present invention relates to a nebulizer mesh which is used, in a nebulizer for atomizing and nebulizing liquid, for atomizing the liquid, and has plural through holes 17, wherein each of the through holes 17 forms a cylindrical space portion 174 on one surface side of the nebulizer mesh, and forms an opening 172 opened in a mortar shape on the other surface side, and to a production method thereof.
    Type: Application
    Filed: July 15, 2016
    Publication date: December 29, 2016
    Inventors: Tasuku Arimoto, Makoto SAKAI, Yoshio SHINDO, Yuji UCHIUMI, Shingo WATANABE
  • Publication number: 20150367089
    Abstract: The present invention relates to a nebulizer mesh which is used, in a nebulizer for atomizing and nebulizing liquid, for atomizing the liquid, and has plural through holes 17, wherein each of the through holes 17 forms a cylindrical space portion 174 on one surface side of the nebulizer mesh, and forms an opening 172 opened in a mortar shape on the other surface side, and to a production method thereof.
    Type: Application
    Filed: January 22, 2014
    Publication date: December 24, 2015
    Inventors: Tasuku ARIMOTO, Makoto SAKAI, Yoshio SHINDO, Yuji UCHIUMI, Shingo WATANABE
  • Patent number: 7799186
    Abstract: The present invention provides a technology for enabling a diaphragm to be arranged in a more facilitated manner in a plating tank of a plating apparatus having a diaphragm for separating an object to be plated from an anode.
    Type: Grant
    Filed: May 24, 2006
    Date of Patent: September 21, 2010
    Assignee: Electroplating Engineers of Japan Limited
    Inventor: Yuji Uchiumi
  • Publication number: 20070289873
    Abstract: Provided is a technique for wafer plating treatment that ensures that the plating film thickness becomes uniform on the total area of a plated wafer surface. This method of wafer plating includes: arranging a wafer in an opening of a plating tank; bringing a peripheral side of the wafer and a cathode electrode into contact with each other; supplying a plating liquid; causing the plating liquid that has reached the wafer to flow in the direction of a periphery of a wafer surface to be plated; and supplying a plating current by an anode electrode arranged within the plating tank so as to be opposed to the wafer and the cathode electrode, whereby the wafer is subjected to a plating treatment. In this method, the anode electrode has a shape almost the same shape as the wafer surface to be plated, a plurality of peripheral-edge current supplying sections are provided in a peripheral edge of the anode electrode, and a central current supplying section is provided in a center of the anode electrode.
    Type: Application
    Filed: June 1, 2007
    Publication date: December 20, 2007
    Inventor: Yuji Uchiumi
  • Publication number: 20070114127
    Abstract: The present invention provides a technology for enabling a diaphragm to be arranged in a more facilitated manner in a plating tank of a plating apparatus having a diaphragm for separating an object to be plated from an anode.
    Type: Application
    Filed: May 24, 2006
    Publication date: May 24, 2007
    Inventor: Yuji Uchiumi