Abstract: A liquid replenishing system includes a liquid tank and a liquid storage bottle for storing liquid to be replenished to the liquid tank. The liquid tank includes a tank body, a cylindrical adapter, and a needle penetrating into the tank body inside the cylindrical adapter. One end of the needle is located outside the tank body and another end of the needle is located inside the tank body. The liquid storage bottle includes a bottle body, a nozzle having an ejection port for ejecting a liquid stored in the bottle body, and includes a slit valve provided at the ejection port. In a case where the nozzle of the liquid storage bottle and the cylindrical adapter of the liquid tank are fitted to each other, one end of the needle is inserted into the slit valve so that the liquid storage bottle is secured to the liquid tank.

Abstract: An acoustic wave device is disclosed. The acoustic wave device can include a piezoelectric layer, an interdigital transducer electrode formed with the piezoelectric layer, a temperature compensation layer over the interdigital transducer electrode. The interdigital transducer electrode includes a bus bar and fingers that extend from the bus bar. The fingers each includes an edge portion and a body portion. The acoustic wave device can include a mass loading strip overlaps the edge portions of the fingers. The acoustic wave device can include a portion of the temperature compensation layer is positioned between the mass loading strip and the piezoelectric layer. The acoustic wave device can include a buffer layer that is disposed at least partially between the mass loading strip and the temperature compensation layer. A thickness of the buffer layer can be at least one forth a thickness of the mass loading strip.

Abstract: An acoustic wave device and a method of forming the same is disclosed. The acoustic wave device can include a piezoelectric layer, an interdigital transducer electrode formed with the piezoelectric layer, and a temperature compensation layer over the interdigital transducer electrode. The interdigital transducer electrode includes a bus bar and fingers that extend from the bus bar. The fingers each includes an edge portion and a body portion. The acoustic wave device can include a mass loading strip that overlaps the edge portions of the fingers. A portion of the temperature compensation layer is positioned between the mass loading strip and the piezoelectric layer. The acoustic wave device can include a buffer layer that is disposed at least partially between the mass loading strip and the temperature compensation layer. The buffer layer includes a material different from materials of the temperature compensation layer and the mass loading strip.

Abstract: An acoustic wave device is disclosed. The acoustic wave device can include a piezoelectric layer, an interdigital transducer electrode formed with the piezoelectric layer, a temperature compensation layer over the interdigital transducer electrode. The interdigital transducer electrode includes a bus bar and fingers that extend from the bus bar. The fingers each includes an edge portion and a body portion. The acoustic wave device can include a mass loading strip overlaps the edge portions of the fingers. The acoustic wave device can include a portion of the temperature compensation layer is positioned between the mass loading strip and the piezoelectric layer. The acoustic wave device can include a buffer layer that is disposed at least partially between the mass loading strip and the temperature compensation layer.

Abstract: An electronic device package includes a lower surface for conducting electronic signals, a first solder bond pad having a first size disposed on the lower surface, and a plurality of second solder bond pads having second sizes smaller than the first size disposed on the lower surface and surrounding the first solder bond pad.

Abstract: An electronic device package includes a lower surface for conducting electronic signals, a first solder bond pad having a first size disposed on the lower surface, and a plurality of second solder bond pads having second sizes smaller than the first size disposed on the lower surface and surrounding the first solder bond pad.

Abstract: An electronic device package includes a lower surface for conducting electronic signals, a first solder bond pad having a first size disposed on the lower surface, and a plurality of second solder bond pads having second sizes smaller than the first size disposed on the lower surface and surrounding the first solder bond pad.

Abstract: Examples are directed to suppressing crack development in a surface acoustic wave (SAW) element including a double-layered IDT electrode. In one example the SAW element includes a piezoelectric substrate, a comb-shaped electrode formed on a top surface of the piezoelectric substrate, and an insulation layer formed on the top surface of the piezoelectric substrate to cover the comb-shaped electrode. The comb-shaped electrode includes a plurality of electrode fingers each having a first metal layer of a first metal formed on the top surface of the piezoelectric substrate, a second metal layer of a second metal formed on the first metal layer, and a second protective film at least partially covering the second metal layer, the second metal layer being covered by the second protective film and the first metal layer.

Abstract: A backlight unit (3) provided with a LED package (light source) (11) and a light guide plate (14) includes a light-emitting portion (12) that is provided on the light guide plate side of the LED package (11) so as to be opposed to an incident surface (14a) of the light guide plate (14) and outputs light from the LED package (11) toward the light guide plate (14). A dimension on the incident surface side of the light-emitting portion (12) in a thickness direction of the light guide plate (14) is not more than a dimension at the incident surface (14a) of the light guide plate (14) in its thickness direction, and the light-emitting portion (12) uses a two-dimensional photonic crystal (12a).

Abstract: Provided are a filter unit 4 in which a plurality of metallic particles 42 having two or more anisotropic axes are disposed with uniform orientations on a surface or interior part of a transparent dielectric medium 41 transmitting visible light, and direction adjusting means 3 for changing, in a relative manner, the polarization of incident light, which incident on the filter unit with linear polarization, and the orientation of the anisotropic axes of the metallic particles 42.

Abstract: A liquid crystal display panel (39) includes a diffraction grating (DG) that is provided on the side of the inner surface (32N) of an opposed substrate (32) for receiving light and is used for enhancing the light output efficiency from the inner surface (32N) to the outside.

Abstract: A planar illumination device is provided that enhances the efficiency of use of light and its brightness while suppressing uneven brightness, that reduces an increase in the manufacturing cost and that can reduce the thickness of the planar illumination device. In this backlight device (planar illumination device) (20), in the light emitting surface (23b) of a light guide body (23), a plurality of prisms (23e) that gradually reduce an angle of incidence of light with respect to the back surface (23c) of the light guide body are provided, and, in the back surface (24a) of a low refractive index layer (24), a plurality of prisms (24b) that have the function of forwardly and totally reflecting light from LEDs (21) in an interface between the back surface of the low refractive index layer and an air layer are formed.

Abstract: Provided are a first light-transmitting substrate (10) on which a plurality of silicon photodiodes (17) and a plurality of thin-film transistors (16) serving as switching elements for liquid crystal driving are formed, a second light-transmitting substrate (20), and a liquid crystal layer (19) sealed therebetween. A diffraction grating (35 or 36) is formed on a face of a photoreception portion (30) of the silicon photodiodes, the face being on the second light-transmitting substrate side or the side opposite the second light-transmitting substrate. This enables providing a liquid crystal panel including photosensor functionality with improved photodetection sensitivity.

Abstract: Three grating piece groups (13gr.Gr.B, 13G, 13R) on the top surface (11U) of a light guide plate correspond to light of different wavelength regions, and respectively diffract and reflect light of the corresponding wavelength region, which is incident thereon at an incident angle within a specific range, back to the incoming direction of the light. The bottom surface (11B) of the light guide plate (11) is provided with a prism (15) for reflecting the backwardly diffracted and reflected light toward the top surface (11U).

Abstract: Provided is a light guide plate which can suppress glare with reduced thickness. Specifically, a light guide plate (1) is provided with a light incoming surface (1a), a light outgoing surface (1b) and a light reflecting surface (1c). A diffraction grating pattern (11) is formed on the light outgoing surface (1b), and a prism pattern (12) is formed on the light reflecting surface (1c). On a region of the light reflecting surface (1c) on the side of the light incoming surface (1a), the prism pattern (12) does not exist, and the region where the prism pattern (12) is formed is smaller than the region where the diffraction grating pattern (11) is formed.

Abstract: The top surface (41U) of a light guiding plate (41) includes two kinds of regions, i.e., a line grid region (LR) and a scattered grid region (SR). The line grid region (LR) is positioned at a part where light which propagates along a Y direction reaches, on the top surface (41U). The scattered grid region (SR) is positioned at a part where light which propagates in directions deviated from the Y direction reaches, on the top surface (41U).

Abstract: A backlight unit (3) provided with a LED package (light source) (11) and a light guide plate (14) includes a light-emitting portion (12) that is provided on the light guide plate side of the LED package (11) so as to be opposed to an incident surface (14a) of the light guide plate (14) and outputs light from the LED package (11) toward the light guide plate (14). A dimension on the incident surface side of the light-emitting portion (12) in a thickness direction of the light guide plate (14) is not more than a dimension at the incident surface (14a) of the light guide plate (14) in its thickness direction, and the light-emitting portion (12) uses a two-dimensional photonic crystal (12a).

Abstract: In the context of a measurement method in which scanning capacitance microscope(s) detecting surface(s) by means of electrically conductive probe(s) are used to measure electrical capacitance(s) of semiconductor sample surface(s), clean surface(s) are formed on semiconductor sample(s) by surface treatment; such semiconductor sample(s) are thereafter promptly placed in ultrahigh vacuum environment(s) (or inert gas environment(s)) and are maintained therein; and while still in this state, electrically conductive probe(s), on whose surface(s) stable insulating film(s) (e.g., vapor-deposited insulating diamond film(s)) are formed, are used to measure electrical capacitance(s) of semiconductor sample surface(s) while in ultrahigh vacuum environment(s) (or inert gas environment(s)).

Abstract: In the context of a measurement method in which scanning capacitance microscope(s) detecting surface(s) by means of electrically conductive probe(s) are used to measure electrical capacitance(s) of semiconductor sample surface(s), clean surface(s) are formed on semiconductor sample(s) by surface treatment; such semiconductor sample(s) are thereafter promptly placed in ultrahigh vacuum environment(s) (or inert gas environment(s)) and are maintained therein; and while still in this state, electrically conductive probe(s), on whose surface(s) stable insulating film(s) (e.g., vapor-deposited insulating diamond film(s)) are formed, are used to measure electrical capacitance(s) of semiconductor sample surface(s) while in ultrahigh vacuum environment(s) (or inert gas environment(s)).

Abstract: A checkerboard or a "go" board is implemented with a liquid crystal display or an electrochromic display. A pair of a disc pattern electrode and a ring pattern electrode are provided for showing a black "go" stone and a white "go" stone, respectively. A plurality of the disc pattern elecrodes and the ring pattern electrodes are formed on a first transparent glass substrate to serve as segment electrodes. A common electrode is provided opposite to the pair of the disc pattern electrode and the ring pattern electrode. The common electrode is arranged on the opposing second transparent glass substrate. A plurality of checks are printed on, for example, the first transparent glass substrate. The common electrodes, the disc pattern electrodes, and the ring pattern electrodes are activated by a driver coupled to a memory. The memory is adapted to store arrangement information of the black and the white "go" stones, and the blank indication.