Patents by Inventor Yujian Cheng
Yujian Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230369760Abstract: A multi-band, shared-aperture, circularly polarized phased array antenna relating to the field of antenna technology is disclosed. Specifically, two multi-band, shared-aperture, circularly polarized phased array antenna designs are disclosed. By integrating multiple circularly polarized endfire antennas with different operation bands into one aperture, a shared-aperture antenna array is achieved. The bandwidth and crossband port isolation of this antenna are enhanced, and the antenna also has the properties of miniaturization, feasibility, and ease of connection with circuits.Type: ApplicationFiled: February 3, 2023Publication date: November 16, 2023Inventors: Yujian CHENG, Ruisen HAO, Jinfan ZHANG, Zongrui HE, Tingjun LI, Haining YANG, Hongbin WANG, Yong FAN, Yafei WU, Minghua ZHAO
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Patent number: 10985470Abstract: A slot array antenna including a smooth curved surface and planar feed structures which are respectively disposed at two ends of the smooth curved surface and are tangent to the smooth curved surface. The smooth curved surface includes at least two arcs mutually connected by smooth transition. The at least two arcs each includes an upper copper metal layer, a lower copper metal layer, and a dielectric substrate layer between the upper and lower copper metal layers. The upper copper metal layer includes radiating slots, and the adjacent radiating slots in a linear array have opposite offsets along the center line of the slot array antenna. The dielectric substrate layer includes metallic vias symmetrically arranged on both sides of the central line of the antenna to form a substrate integrated waveguide.Type: GrantFiled: April 17, 2019Date of Patent: April 20, 2021Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Yujian Cheng, Yafei Wu, Jinfan Zhang, Fan Zhao, Chunxu Bai, Yong Fan, Kaijun Song, Bo Zhang, Xianqi Lin, Yonghong Zhang
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Patent number: 10879616Abstract: A shared-aperture antenna includes a first copper metal layer; a second copper metal layer; and a dielectric substrate layer sandwiched between the first copper metal layer and the second copper metal layer. The dielectric substrate layer includes a plurality of metallized vias. The first copper metal layer is in communication with the second copper metal layer via the plurality of metallized vias. The plurality of metallized vias includes first metallized vias forming an inner circular ring and second metallized vias forming an outer circular ring with respect to the center of the antenna. The first copper metal layer, the dielectric substrate layer, the second copper metal layer, and the first metallized vias form a substrate integrated waveguide (SIW) circular cavity slot antenna. The first copper metal layer, the dielectric substrate layer, the second copper metal layer, the first metallized vias and the second metallized vias form a coaxial cavity slot antenna.Type: GrantFiled: August 30, 2019Date of Patent: December 29, 2020Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Yujian Cheng, Yanran Ding, Jinfan Zhang, Chunxu Bai, Yong Fan, Kaijun Song, Xianqi Lin, Bo Zhang
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Patent number: 10644398Abstract: An antenna for generating an arbitrarily directed Bessel beam, including a beam-forming plane and a feeding horn, the beam-forming plane is a dual-layer dielectric substrate structure having a beam focusing function, including: a printed circuit bottom layer, a high-frequency dielectric substrate lower layer, a printed circuit middle layer, a high-frequency dielectric substrate upper layer, and, a printed circuit upper layer; the printed circuit bottom layer, the high-frequency dielectric substrate lower layer, the printed circuit middle layer, the high-frequency dielectric substrate upper layer, and the printed circuit upper layer are co-axially stacked from the bottom to the top: the beam-forming plane is entirely divided into periodically arranged beam-forming units by a plurality of meshes, and each beam-forming unit consists of printed circuit upper, middle and lower metal patches of which centers are on the same longitudinal axis, the high-frequency dielectric substrate lower layer and the high-frequencType: GrantFiled: April 23, 2018Date of Patent: May 5, 2020Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Yujian Cheng, Yichen Zhong, Renbo He, Yan Liu, Yong Fan, Kaijun Song, Bo Zhang, Xianqi Lin, Yonghong Zhang
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Publication number: 20200076086Abstract: A shared-aperture antenna includes a first copper metal layer; a second copper metal layer; and a dielectric substrate layer sandwiched between the first copper metal layer and the second copper metal layer. The dielectric substrate layer includes a plurality of metallized vias. The first copper metal layer is in communication with the second copper metal layer via the plurality of metallized vias. The plurality of metallized vias includes first metallized vias forming an inner circular ring and second metallized vias forming an outer circular ring with respect to the center of the antenna. The first copper metal layer, the dielectric substrate layer, the second copper metal layer, and the first metallized vias form a substrate integrated waveguide (SIW) circular cavity slot antenna. The first copper metal layer, the dielectric substrate layer, the second copper metal layer, the first metallized vias and the second metallized vias form a coaxial cavity slot antenna.Type: ApplicationFiled: August 30, 2019Publication date: March 5, 2020Inventors: Yujian CHENG, Yanran DING, Jinfan ZHANG, Chunxu BAI, Yong FAN, Kaijun SONG, Xianqi LIN, Bo ZHANG
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Publication number: 20190326679Abstract: A slot array antenna including a smooth curved surface and planar feed structures which are respectively disposed at two ends of the smooth curved surface and are tangent to the smooth curved surface. The smooth curved surface includes at least two arcs mutually connected by smooth transition. The at least two arcs each includes an upper copper metal layer, a lower copper metal layer, and a dielectric substrate layer between the upper and lower copper metal layers. The upper copper metal layer includes radiating slots, and the adjacent radiating slots in a linear array have opposite offsets along the center line of the slot array antenna. The dielectric substrate layer includes metallic vias symmetrically arranged on both sides of the central line of the antenna to form a substrate integrated waveguide.Type: ApplicationFiled: April 17, 2019Publication date: October 24, 2019Inventors: Yujian CHENG, Yafei WU, Jinfan ZHANG, Fan ZHAO, Chunxu BAI, Yong FAN, Kaijun SONG, Bo ZHANG, Xianqi LIN, Yonghong ZHANG
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Patent number: 10199743Abstract: An array antenna includes a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, and a third metal layer that are sequentially laminated, where multiple metal through holes are disposed on the second dielectric layer, the multiple metal through holes form a feeding section, the first metal layer includes multiple subarrays, each subarray includes multiple radiating arrays and one power splitter, the power splitter includes a central area and multiple branches extending from the central area, the multiple radiating arrays are respectively connected to ends of the multiple braches that are far from the central area, multiple coupling slots are disposed on the second metal layer, the multiple coupling slots respectively face central areas, the feeding section is used to feed a signal.Type: GrantFiled: September 9, 2016Date of Patent: February 5, 2019Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Yujian Cheng, Yi Chen
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Publication number: 20190036214Abstract: An antenna for generating an arbitrarily directed Bessel beam, including a beam-forming plane and a feeding horn, the beam-forming plane is a dual-layer dielectric substrate structure having a beam focusing function, including: a printed circuit bottom layer, a high-frequency dielectric substrate lower layer, a printed circuit middle layer, a high-frequency dielectric substrate upper layer, and, a printed circuit upper layer; the printed circuit bottom layer, the high-frequency dielectric substrate lower layer, the printed circuit middle layer, the high-frequency dielectric substrate upper layer, and the printed circuit upper layer are co-axially stacked from the bottom to the top: the beam-forming plane is entirely divided into periodically arranged beam-forming units by a plurality of meshes, and each beam-forming unit consists of printed circuit upper, middle and lower metal patches of which centers are on the same longitudinal axis, the high-frequency dielectric substrate lower layer and the high-frequencType: ApplicationFiled: April 23, 2018Publication date: January 31, 2019Applicant: University of Electronic Science and Technology of ChinaInventors: Yujian CHENG, Yichen ZHONG, Renbo HE, Yan LIU, Yong FAN, Kaijun SONG, Bo ZHANG, Xianqi LIN, Yonghong ZHANG
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Patent number: 10044109Abstract: Embodiments of the present invention provide a multi-polarization substrate integrated waveguide antenna. In the multi-polarization substrate integrated waveguide antenna of the present invention, the antenna is of a multi-layer structure and includes a first metal copper clad layer, a first dielectric layer, a second metal copper, clad layer, a second dielectric layer, and a third metal copper clad layer successively from top to bottom, where plated through holes are provided on both the first dielectric layer and the second dielectric layer, and etching grooves are provided on both the first metal copper clad layer and the second metal copper clad layer. The embodiments of the present invention resolve a problem that feeding efficiency is reduced in a high frequency application when a microstrip is used to feed electricity.Type: GrantFiled: October 21, 2016Date of Patent: August 7, 2018Assignee: Huawei Technologies Co., Ltd.Inventors: Yujian Cheng, Yi Chen
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Patent number: 9893399Abstract: An embodiment of the present invention discloses a waveguide filter, which includes a first waveguide at an upper layer and a second waveguide at a lower layer. The first waveguide and the second waveguide are isolated from each other by a metal isolation layer. The first waveguide forms a first resonant cavity. The second waveguide forms a second resonant cavity. The first resonant cavity and the second resonant cavity overlap each other. A coupling slot is disposed at the metal isolation layer in an overlapping area.Type: GrantFiled: October 14, 2015Date of Patent: February 13, 2018Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Yujian Cheng, Chuanan Zhang, Yi Chen
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Patent number: 9673532Abstract: The present invention relates to an antenna, which includes a feeding part and a radiating part. By using the feeding part and the radiating part that are perpendicular to each other and use dielectric substrates, not only a volume of a normal radiation antenna is reduced, but also a substrate integrated waveguide directly radiates energy outwards, thereby improving operating bandwidth of the antenna.Type: GrantFiled: January 29, 2016Date of Patent: June 6, 2017Assignee: Huawei Technologies Co., Ltd.Inventors: Yujian Cheng, Yi Chen
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Publication number: 20170040703Abstract: Embodiments of the present invention provide a multi-polarization substrate integrated waveguide antenna. In the multi-polarization substrate integrated waveguide antenna of the present invention, the antenna is of a multi-layer structure and includes a first metal copper clad layer, a first dielectric layer, a second metal copper, clad layer, a second dielectric layer, and a third metal copper clad layer successively from top to bottom, where plated through holes are provided on both the first dielectric layer and the second dielectric layer, and etching grooves are provided on both the first metal copper clad layer and the second metal copper clad layer. The embodiments of the present invention resolve a problem that feeding efficiency is reduced in a high frequency application when a microstrip is used to feed electricity.Type: ApplicationFiled: October 21, 2016Publication date: February 9, 2017Inventors: Yujian Cheng, Yi Chen
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Publication number: 20160380362Abstract: An array antenna includes a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, and a third metal layer that are sequentially laminated, where multiple metal through holes are disposed on the second dielectric layer, the multiple metal through holes form a feeding section, the first metal layer includes multiple subarrays, each subarray includes multiple radiating arrays and one power splitter, the power splitter includes a central area and multiple branches extending from the central area, the multiple radiating arrays are respectively connected to ends of the multiple braches that are far from the central area, multiple coupling slots are disposed on the second metal layer, the multiple coupling slots respectively face central areas, the feeding section is used to feed a signal.Type: ApplicationFiled: September 9, 2016Publication date: December 29, 2016Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Yujian Cheng, Yi Chen
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Publication number: 20160149311Abstract: The present invention relates to an antenna, which includes a feeding part and a radiating part. By using the feeding part and the radiating part that are perpendicular to each other and use dielectric substrates, not only a volume of a normal radiation antenna is reduced, but also a substrate integrated waveguide directly radiates energy outwards, thereby improving operating bandwidth of the antenna.Type: ApplicationFiled: January 29, 2016Publication date: May 26, 2016Inventors: Yujian Cheng, Yi Chen
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Publication number: 20160036110Abstract: An embodiment of the present invention discloses a waveguide filter, which includes a first waveguide at an upper layer and a second waveguide at a lower layer. The first waveguide and the second waveguide are isolated from each other by a metal isolation layer. The first waveguide forms a first resonant cavity. The second waveguide forms a second resonant cavity. The first resonant cavity and the second resonant cavity overlap each other. A coupling slot is disposed at the metal isolation layer in an overlapping area.Type: ApplicationFiled: October 14, 2015Publication date: February 4, 2016Inventors: Yujian Cheng, Chuanan Zhang, Yi Chen