Abstract: Provided is an image acquisition device including: a stage on which a slide is mounted; an objective lens disposed to face a sample; a beam split unit separating light from the sample, which is incident through the objective lens into at least two, and delivering the separated lights; at least two image sensor units acquiring an image of the sample from the lights separated by the beam split unit; an image generation unit synthesizing the image acquired from the image sensor unit and generating the synthesized image; and a main control unit controlling operations of the stage or the objective lens, and the image sensor unit and the image generation unit, in which the stage is movable relatively to an optical axis of the objective lens at least in a first direction, and the at least two image sensor units acquire images at different focus positions for the sample.

Abstract: The present disclosure may provide a display device and a method for manufacturing the same. According to one or more embodiments, a display device includes a pixel electrode above a substrate, a light-emitting element above the pixel electrode, and including a first semiconductor layer, an active layer, a second semiconductor layer, and a third semiconductor layer in sequence, the third semiconductor layer defining a recess exposing a portion of the second semiconductor layer, a via layer above the substrate, and surrounding at least a portion of the light-emitting element, and a common electrode above the light-emitting element and the via layer, and directly contacting the second semiconductor layer through the recess.

Abstract: A display device and a method of manufacturing a display device are disclosed. A display device includes a planarization layer including a first planarization part on a substrate, and a second planarization part and a third planarization part on the first planarization part, a first pad electrode on the second planarization part, and a second pad electrode on the third planarization part, an organic pattern layer on the first pad electrode and the second pad electrode, a light emitting element on the organic pattern layer, a partition wall, a reflective layer on a side of the partition wall and the first planarization part, a first auxiliary connection electrode connecting the second semiconductor layer and the first pad electrode, and a second auxiliary connection electrode connecting the first semiconductor layer and the second pad electrode, and the planarization layer has an undercut shape.

Abstract: A display device includes a pixel electrode on a substrate, a bank layer on the substrate and the pixel electrode and dividing a light emitting area and a light non-emitting area, light emitting elements on the pixel electrode and including a first semiconductor layer, a second semiconductor layer, and an active layer between the first and second semiconductor layers, a first via layer on the pixel electrode and around sides of the light emitting elements, a common electrode on the first via layer, a side of a light emitting element protruding from the first via layer, and a top surface of the light emitting element, a first insulating layer on the common electrode, a partition wall unit on the first insulating layer and overlapping the bank layer, a second insulating layer on the partition wall unit, and a reflective layer around a side of the partition wall unit.

Abstract: A display device includes a planarization layer including a first planarization unit on a substrate and a second planarization unit on the first planarization unit, a pixel electrode on the second planarization unit, an organic pattern layer on the pixel electrode, a light emitting element on the organic pattern layer and having a downwardly convex recess on a top surface thereof, a first partition wall on one surface of the first planarization unit and forming a space around the light emitting element, a via layer in the space around the light emitting element, a first reflective layer around a side of the first partition wall in the space around the light emitting element, on the first planarization unit, and around a side of the light emitting element, a side of the organic pattern layer, and a side of the pixel electrode.

Abstract: An image sensing device includes a first sampling circuit suitable for sampling a reference ramp signal as a ramp signal; a switching circuit suitable for sequentially outputting first and second pixel signals to a common node based on first and second control signals; a second sampling circuit suitable for sampling the first and second pixel signals, which are sequentially outputted through the common node, as a measurement signal; a comparison circuit suitable for comparing the ramp signal with the measurement signal and generating a comparison signal corresponding to a comparison result; and a count circuit suitable for generating a count signal, which corresponds to a voltage level of the measurement signal, based on the comparison signal and a clock signal.

Abstract: An image sensing device includes a first sampling circuit suitable for sampling a reference ramp signal as a ramp signal; a switching circuit suitable for sequentially outputting first and second pixel signals to a common node based on first and second control signals; a second sampling circuit suitable for sampling the first and second pixel signals, which are sequentially outputted through the common node, as a measurement signal; a comparison circuit suitable for comparing the ramp signal with the measurement signal and generating a comparison signal corresponding to a comparison result; and a count circuit suitable for generating a count signal, which corresponds to a voltage level of the measurement signal, based on the comparison signal and a clock signal.

Abstract: A three-dimensional semiconductor device includes first and second extended regions disposed on a substrate spaced apart from each other, a memory block disposed on the substrate between the first and second extended regions, and first and second main separation structures disposed on the substrate spaced apart from each other. The first extended region, the memory block and the second extended region are disposed between the first and second main separation structures. The memory block includes data storage regions and word lines. The word lines extend from the memory block and pass through the first and second extended regions. A distance between the first and second main separation structures located on both sides of the first extended region is greater than a distance between the first and second main separation structures located on both sides of the memory block.

Abstract: The present specification relates to a compound as a UBR box domain ligand. The present specification provides a small molecule compound that binds to the UBR box domain. Further, the present specification provides a composition for inhibiting UBR box domain substrate binding, including a ligand compound that binds to a UBR box domain, a pharmaceutical composition for treating UBR-related disease, and a use thereof.

Abstract: The present specification relates to a compound as a UBR box domain ligand. The present specification provides a small molecule compound that binds to the UBR box domain. Further, the present specification provides a composition for inhibiting UBR box domain substrate binding, including a ligand compound that binds to a UBR box domain, a pharmaceutical composition for treating UBR-related disease, and a use thereof.

Abstract: A multiplex PCR chip capable of simultaneously detecting multiple target genes and a multiplex PCR method using the same are proposed. More specifically, in the multiplex PCR chip and multiplex PCR method, after a plurality of spatially separated particle-forming grooves is formed in one or more reaction chambers and a probe in a solution state is injected into the particle-forming grooves, planar shapes of the particle-forming grooves are varied or shapes and patterns of particle holders respectively formed on inner surfaces of the particle-forming grooves are varied, and the probe including primers specifically hybridizing with sequences of different nucleic acid molecules is injected into the particle-forming grooves, whereby simultaneous multiplex detection is possible by allowing multiple target genes to be detected on the basis of positions and shapes of the probe particles and the shapes and patterns of the particle holders respectively formed inside of the probe particles.

Abstract: A three-dimensional semiconductor device includes first and second extended regions disposed on a substrate spaced apart from each other, a memory block disposed on the substrate between the first and second extended regions, and first and second main separation structures disposed on the substrate spaced apart from each other. The first extended region, the memory block and the second extended region are disposed between the first and second main separation structures. The memory block includes data storage regions and word lines. The word lines extend from the memory block and pass through the first and second extended regions. A distance between the first and second main separation structures located on both sides of the first extended region is greater than a distance between the first and second main separation structures located on both sides of the memory block.

Abstract: A vertical-type memory device includes a substrate having a cell array region and a connection region disposed adjacent to the cell array region, a plurality of gate electrode layers stacked on the cell array region and the connection region, a plurality of channel structures disposed in the cell array region, a plurality of dummy channel structures disposed in the connection region, and a plurality of slits disposed in the plurality of gate electrode layers in the cell array region. The plurality of gate electrode layers forms a stepped structure in the connection region, the plurality of channel structures penetrates the plurality of gate electrode layers, and the plurality of dummy channel structures penetrates at least one of the plurality of gate electrode layers.

Abstract: A semiconductor device includes a stacked structure disposed on a substrate. The stacked structure includes a plurality of gate electrodes. The semiconductor device further includes a first structure disposed on the substrate and passing through the stacked structure, and a second structure disposed on the substrate. The second structure is disposed outside of the stacked structure, faces the first structure, and is spaced apart from the first structure. The first structure includes a plurality of separation lines passing through at least a portion of the plurality of gate electrodes and extending outside of the stacked structure, and the second structure is formed of the same material as the first structure.

Abstract: A three-dimensional semiconductor device includes first and second extended regions disposed on a substrate spaced apart from each other, a memory block disposed on the substrate between the first and second extended regions, and first and second main separation structures disposed on the substrate spaced apart from each other. The first extended region, the memory block and the second extended region are disposed between the first and second main separation structures. The memory block includes data storage regions and word lines. The word lines extend from the memory block and pass through the first and second extended regions. A distance between the first and second main separation structures located on both sides of the first extended region is greater than a distance between the first and second main separation structures located on both sides of the memory block.

Abstract: A vertical-type memory device includes a substrate having a cell array region and a connection region disposed adjacent to the cell array region, a plurality of gate electrode layers stacked on the cell array region and the connection region, a plurality of channel structures disposed in the cell array region, a plurality of dummy channel structures disposed in the connection region, and a plurality of slits disposed in the plurality of gate electrode layers in the cell array region. The plurality of gate electrode layers forms a stepped structure in the connection region, the plurality of channel structures penetrates the plurality of gate electrode layers, and the plurality of dummy channel structures penetrates at least one of the plurality of gate electrode layers.

Abstract: A vertical-type memory device includes a substrate having a cell array region and a connection region disposed adjacent to the cell array region, a plurality of gate electrode layers stacked on the cell array region and the connection region, a plurality of channel structures disposed in the cell array region, a plurality of dummy channel structures disposed in the connection region, and a plurality of slits disposed in the plurality of gate electrode layers in the cell array region. The plurality of gate electrode layers forms a stepped structure in the connection region, the plurality of channel structures penetrates the plurality of gate electrode layers, and the plurality of dummy channel structures penetrates at least one of the plurality of gate electrode layers.

Abstract: A three-dimensional semiconductor device includes first and second extended regions disposed on a substrate spaced apart from each other, a memory block disposed on the substrate between the first and second extended regions, and first and second main separation structures disposed on the substrate spaced apart from each other. The first extended region, the memory block and the second extended region are disposed between the first and second main separation structures. The memory block includes data storage regions and word lines. The word lines extend from the memory block and pass through the first and second extended regions. A distance between the first and second main separation structures located on both sides of the first extended region is greater than a distance between the first and second main separation structures located on both sides of the memory block.

Abstract: A semiconductor device includes a stacked structure disposed on a substrate. The stacked structure includes a plurality of gate electrodes. The semiconductor device further includes a first structure disposed on the substrate and passing through the stacked structure, and a second structure disposed on the substrate. The second structure is disposed outside of the stacked structure, faces the first structure, and is spaced apart from the first structure. The first structure includes a plurality of separation lines passing through at least a portion of the plurality of gate electrodes and extending outside of the stacked structure, and the second structure is formed of the same material as the first structure.

Abstract: A vertical-type memory device includes a substrate having a cell array region and a connection region disposed adjacent to the cell array region, a plurality of gate electrode layers stacked on the cell array region and the connection region, a plurality of channel structures disposed in the cell array region, a plurality of dummy channel structures disposed in the connection region, and a plurality of slits disposed in the plurality of gate electrode layers in the cell array region. The plurality of gate electrode layers forms a stepped structure in the connection region, the plurality of channel structures penetrates the plurality of gate electrode layers, and the plurality of dummy channel structures penetrates at least one of the plurality of gate electrode layers.